-
公开(公告)号：US20250123520A1
公开(公告)日：2025-04-17
申请号：US18293395
申请日：2022-06-30
Applicant: BOE Technology Group Co., Ltd.
Inventor： Wenqu LIU , Feng ZHANG , Qi YAO , Yong YU , Detian MENG , Zhao CUI , Zhijun LV , Yang YUE , Yuqiao LI , Dongfei HOU , Liwen DONG , Tianmin ZHOU
IPC: G02F1/1339 , G02F1/1333 , G02F1/1362 , G02F1/1368 , H10D86/40
Abstract: Provided is a display substrate. The display substrate includes: a substrate body; and a plurality of support pillars disposed on the substrate body, wherein the support pillar includes a first surface in contact with the substrate body, and a second surface opposite to the first surface; wherein in any direction parallel to the substrate body, a ratio of a width of the first surface to a width of the second surface is greater than or equal to 0.8, and is less than or equal to 1.2.
-
公开(公告)号：US20240297426A1
公开(公告)日：2024-09-05
申请号：US18028012
申请日：2022-04-26
Applicant: BOE Technology Group Co., Ltd.
Inventor： Zhao CUI , Feng ZHANG , Liwen DONG , Dongfei HOU , Yuqiao LI , Wenqu LIU , Zhijun LV , Detian MENG , Qi YAO , Liuqing LI , Yong MA , Mengya SONG
Abstract: A phase shifter, a manufacturing method thereof and an electronic device are provided. The phase shifter includes opposite first and second substrates, and a tunable dielectric layer and first isolation components therebetween. The first substrate includes a first dielectric substrate and a first electrode on a side of the first dielectric substrate close to the tunable dielectric layer; the second substrate includes a second dielectric substrate and a second electrode on a side of the second dielectric substrate close to the tunable dielectric layer; the phase shifter includes a phase shift region and a peripheral region; the phase shift region includes overlapping regions; the first electrode and the second electrode are both in the phase shift region, and orthographic projections of the first electrode and the second electrode on the first dielectric substrate at least partly overlap with each other in the overlapping regions, to form overlapping capacitors.
-
公开(公告)号：US20230215851A1
公开(公告)日：2023-07-06
申请号：US17922139
申请日：2021-05-14
Applicant: BOE Technology Group Co., Ltd.
Inventor： Zhijun LV , Feng ZHANG , Wenqu LIU , Xiaoxin SONG , Zhao CUI , Liwen DONG , Detian MENG , Libo WANG , Dongfei HOU , Lizhen ZHANG
CPC classification number: H01L25/167 , H01L27/124 , H01L33/0093 , H01L24/05 , H01L24/95 , H01F7/20 , H01F7/064 , H01L2224/05573 , H01L2224/06131 , H01L24/06 , H01L24/83 , H01L2224/2957 , H01L2224/29611 , H01L2224/29639 , H01L24/29 , H01L2224/83201 , H01L2224/95136 , H01L2224/95133
Abstract: A driving backplane, a transfer method for a light-emitting diode chip (21), and a display apparatus. The driving backplane comprises: a base substrate (10), a driving circuit, a plurality of electromagnetic structures (13), and a plurality of contact electrodes (12). The plurality of electromagnetic structures (13) in the driving backplane are symmetrically arranged relative to a first straight line (L1) and a second straight line (L2). A current signal can be applied to each electromagnetic structure (13) by means of the driving circuit. Stress generated by a transfer carrier plate (20) according to the magnetic force of each electromagnetic structure (13) moves the transfer carrier plate (20). When the transfer carrier plate (20) is stress balanced in each direction parallel to the surface of the transfer carrier plate (20), the light-emitting diode chip (21) is precisely aligned to corresponding contact electrodes (12).
-
公开(公告)号：US20220223674A1
公开(公告)日：2022-07-14
申请号：US17359675
申请日：2021-06-28
Applicant: BOE Technology Group Co., Ltd.
Inventor： Wenqu LIU , Qi YAO , Detian MENG , Feng ZHANG , Zhao CUI , Liwen DONG , Xiaoxin SONG , Dongfei HOU , Libo WANG , Zhijun LV
IPC: H01L27/32 , H01L29/786 , H01L51/56
Abstract: Provided are a display substrate and a preparation method thereof, and a display apparatus. The display substrate includes a substrate, an active structure layer disposed on the substrate, a first source-drain structure layer disposed on a side of the active structure layer away from the substrate, and a second source-drain structure layer disposed on a side of the first source-drain structure layer away from the substrate. The active structure layer includes a first active layer and a second active layer. The first source-drain structure layer includes a first active via and a first source-drain electrode, and the first source-drain electrode is connected to the first active layer through the first active via; and the second source-drain structure layer includes a second active via and a second source-drain electrode, and the second source-drain electrode is connected to the second active layer through the second active via.
-
公开(公告)号：US20210200985A1
公开(公告)日：2021-07-01
申请号：US16966394
申请日：2020-01-17
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Wenqu LIU , Xiufeng LI , Qi YAO , Feng ZHANG , Liwen DONG , Zhao CUI , Chuanxiang XU , Detian MENG , Xiaoxin SONG , Libo WANG , Yang YUE , Dongfei HOU , Zhijun LV
Abstract: A fingerprint identification module, a manufacturing method thereof and an electronic device are disclosed. The fingerprint identification module includes a substrate, a piezoelectric material layer, an auxiliary structure and a plurality of first driving electrodes; the piezoelectric material layer is on the substrate, the auxiliary structure is at least partially located on the substrate, and the plurality of first driving electrodes are on a side, away from the substrate, of the piezoelectric material and the auxiliary structure; each first driving electrode extends along a first direction and exceeds a first edge of the piezoelectric material layer in the first direction; the plurality of first driving electrodes are arranged at intervals along a second direction; the auxiliary structure is at least in contact with the first edge; the auxiliary structure includes a slope portion; and a thickness of the slope portion in a direction perpendicular to the functional substrate gradually decreases in a direction from the first edge to a position away from a center of the piezoelectric material layer. The fingerprint identification module can avoid the problems of wire disconnection and conductive material residue in the process of forming the plurality of first driving electrodes on the piezoelectric material layer, thereby improving the yield of products.
-
Patent Agency Ranking
公开(公告)号：US20210110761A1
公开(公告)日：2021-04-15
申请号：US17070338
申请日：2020-10-14
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Wenqu LIU , Qi YAO , Feng ZHANG , Zhijun LV , Liwen DONG , Zhao CUI , Xiaoxin SONG , Detian MENG , Libo WANG
Abstract: A driving backplane includes a base, and a pixel driving circuit, a first electrode and a first piezoelectric block that are disposed in the sub-pixel region. The pixel driving circuit is disposed on the base. The first electrode is disposed at a side of the pixel driving circuit away from the base. The first electrode includes a first sub-electrode pattern and a second sub-electrode pattern that are in a same layer and are spaced apart to be insulated from each other, and the first sub-electrode pattern is electrically connected to the pixel driving circuit. The first piezoelectric block is disposed between the pixel driving circuit and the first electrode, and the first sub-electrode pattern and the second sub-electrode pattern are in contact with the first piezoelectric block.
-
公开(公告)号：US20200235160A1
公开(公告)日：2020-07-23
申请号：US16534362
申请日：2019-08-07
Applicant: BOE Technology Group Co., Ltd.
Inventor： Zhijun LV , Liwen DONG , Wenqu LIU , Xiaoxin SONG , Zhao CUI , Feng ZHANG , Qi YAO , Changzheng WANG
Abstract: The disclosure discloses a backboard, a display device, and a method for fabricating the same, and the backboard includes: a backboard body; and a plurality of LED installation mounts arranged in an array on the backboard body, wherein each of the plurality of LED installation mounts includes at least two lead-out electrodes to be connected with LED pins, and a coil structure around each of the at least two lead-out electrodes, wherein the coil structure is configured to produce a magnetic field upon being powered on. The coils can be formed on the backboard body in the backboard to absorb electrodes of LEDs to thereby position them precisely so as to transfer the LEDs in a mass manner with a high good yield ratio, and the lead-out electrodes can be powered on to thereby detect abnormally operating LEDs.
-
公开(公告)号：US20190094425A1
公开(公告)日：2019-03-28
申请号：US15923257
申请日：2018-03-16
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Wenqu LIU , Feng ZHANG , Zhijun LV , Liwen DONG , Shizheng ZHANG , Ning DANG
Abstract: A fingerprint recognition sensor includes a plurality of fingerprint recognition units arranged in an array. Each of the fingerprint recognition units includes a base substrate, an image capturing device disposed on one side of the substrate, and a first grating structure and a second grating structure sequentially disposed on the other side of the base substrate, the first grating structure has a first imaging hole at a position opposite to the image capturing device and the second grating structure has a second imaging hole at a position opposite to the image capturing device, and an extending direction of a slit of the first grating structure is perpendicular to an extending direction of a slit of the second grating structure.
-
公开(公告)号：US20250151399A1
公开(公告)日：2025-05-08
申请号：US19017830
申请日：2025-01-13
Applicant: BOE Technology Group Co., Ltd.
Inventor： Zhijun LV , Qi YAO , Feng ZHANG , Wenqu LIU , Liwen DONG , Zhao CUI , Detian MENG , Dongfei HOU , Yuqiao LI , Jiaxiang ZHANG , Jingshang ZHOU
IPC: H10D86/40 , H01L25/075 , H10D86/01
Abstract: A manufacturing method for an array substrate, an array substrate, and a display apparatus. The manufacturing method comprises: step S100, providing a base substrate; step S200, forming a driving circuit layer on one side of the base substrate the driving circuit layer comprising a plurality of wires and a plurality of bonding pads; step S300, forming a removable protective layer on the side of the driving circuit layer away from the base substrate; and step S400, connecting functional devices to the bonding pads, the removable protective layer being decomposed and removed in step S400. Between step S200 and step S300, there are no steps of forming an inorganic protective layer and patterning the inorganic protective layer.
-
公开(公告)号：US20250015239A1
公开(公告)日：2025-01-09
申请号：US18273042
申请日：2022-05-24
Applicant: BOE Technology Group Co., Ltd.
Inventor： Dongfei HOU , Mengya SONG , Feng ZHANG , Zhao CUI , Liwen DONG , Zhijun LV , Detian MENG , Wenqu LIU , Yuqiao LI , Qi YAO
IPC: H01L33/58
Abstract: A microlens substrate, a display device and a method for manufacturing a microlens substrate are provided. The microlens substrate includes: a base; a first lens pattern disposed on a side of the base and including a plurality of first microlenses distributed at intervals; a second lens pattern disposed on a side of the first lens pattern and including a plurality of second microlenses distributed at intervals, where an orthographic projection of at least one of the plurality of second microlens on the base is located between two orthographic projections of two adjacent first microlenses on the base.
-
-
-
-
-
-
-
-
-
Search Results
48
records
(took 0.041 seconds)
