PRESSURE SENSING ASSEMBLY INTEGRATED WITH FINGERPRINT IDENTIFICATION FUNCTION, DRIVING METHOD THEREOF, AND DISPLAY DEVICE

    公开(公告)号:US20190065811A1

    公开(公告)日:2019-02-28

    申请号:US15933139

    申请日:2018-03-22

    Abstract: A pressure sensing assembly integrated with a fingerprint identification function includes a pressure sensing unit and a control unit. The pressure sensing unit includes a plurality of pressure sensing sub-units arranged in N rows and M columns, a pressure sensing processing sub-unit, and a fingerprint identification processing sub-unit, where N and M are each a positive integer. A pressure sensing sub-unit in an nth row and an mth column includes a pressure sensing module in the nth row and the mth column and a fingerprint identification module in the nth row and the mth column. The pressure sensing processing sub-unit and the fingerprint identification module in the nth row and the mth column are connected to the control unit, where n is a positive integer smaller than or equal to N, and m is a positive integer smaller than or equal to M. The control unit is configured to, upon the receipt of a pressure sensing indication signal, transmit a fingerprint identification control signal to the fingerprint identification module in the nth row and the mth column.

    TOUCH CONTROL STRUCTURE, DISPLAY PANEL AND TOUCH CONTROL METHOD

    公开(公告)号:US20170277334A1

    公开(公告)日:2017-09-28

    申请号:US15228834

    申请日:2016-08-04

    Abstract: The present disclosure discloses a touch control structure, a display panel and a touch control method. The touch control structure comprises a first conductive layer, a second conductive layer, a plurality of insulative supporting points, and a detection module. The second conductive layer comprises a plurality of electrodes which are independent from each other. The plurality of insulative supporting points is arranged on the first conductive layer and under the second conductive layer. The detection module is connected to the plurality of electrodes, and configured to detect an electrode in the second conductive layer contacted with the first conductive layer when the first conductive layer is pressed, and to determine a level of pressure pressed on the first conductive layer.

    Self-ejectable port fixing device
    24.
    发明授权
    Self-ejectable port fixing device 有权
    自动排出端口固定装置

    公开(公告)号:US09197016B2

    公开(公告)日:2015-11-24

    申请号:US14105138

    申请日:2013-12-12

    CPC classification number: H01R13/629 H01R13/193 H01R13/635 H01R24/62

    Abstract: The present invention provides a self-ejectable port fixing device for contact connecting with a port having a port chip. The port fixing device comprises a casing having an opening through which the port chip is allowed to insert and to contact with a receptacle chip provided in the casing. The port fixing device further comprises an elastic unit and a locking unit. The elastic unit is compressed directly or indirectly by the port so as to accumulate elastic potential energy while the port chip is getting closer to the receptacle chip. When the port chip is in contact with the receptacle chip, the locking unit locks the port chip at this contacting position. When the locking unit is unlocked, the elastic unit releases the elastic potential energy to push the port chip to be detached from the receptacle chip.

    Abstract translation: 本发明提供一种用于与具有端口芯片的端口接触连接的自可喷射端口固定装置。 端口固定装置包括具有开口的壳体,通过该开口允许端口芯片插入并与设置在壳体中的插座芯片接触。 端口固定装置还包括弹性单元和锁定单元。 弹性单元由端口直接或间接地压缩,以便在端口芯片越来越接近插座芯片时积聚弹性势能。 当端口芯片与插座芯片接触时,锁定单元将端口芯片锁定在该接触位置。 当锁定单元解锁时,弹性单元释放弹性势能以推动端口芯片以从插座芯片拆下。

    Semiconductor apparatus having expansion wires for electrically connecting chips

    公开(公告)号:US12278243B2

    公开(公告)日:2025-04-15

    申请号:US17529969

    申请日:2021-11-18

    Abstract: A semiconductor apparatus and a method for manufacturing the semiconductor apparatus are provided. The semiconductor apparatus includes: a base substrate; a plurality of chips arranged on the base substrate each including a chip main body and a plurality of terminals arranged thereon; a plurality of fixed connection portions arranged on the base substrate, and adjacent to the plurality of chips; a terminal expansion layer arranged on the base substrate; and a plurality of expansion wires in the terminal expansion layer and configured to electrically connect the chips, wherein an expansion wire configured to electrically connect two chips includes at least a first wire segment and a second wire segment, and the first wire segment is configured to electrically connect a terminal of a chip and a fixed connection portion adjacent to the chip, and the second wire segment is configured to connect two fixed connection portions between the two chips.

    Display device
    27.
    发明授权

    公开(公告)号:US12063493B2

    公开(公告)日:2024-08-13

    申请号:US17439673

    申请日:2021-01-05

    CPC classification number: H04R7/045 H04R1/028 H04R2499/15

    Abstract: A display device, including a display panel, a box, a connection frame and a vibration actuator provided on the display panel. The connection frame includes: a frame-shaped member including a first end face and a second end face arranged opposite to each other, the first end face being attached to a top face of the box, a plurality of protrusions being provided on the second end face, a surface of each protrusion away from the first end face forming a support face, and the display panel being fixed on the support face; and a connection member fixedly coupled to the frame-shaped member, and detachably coupled to the box via a fastener.

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