Machining of fusion-drawn glass laminate structures containing a photomachinable layer
    23.
    发明授权
    Machining of fusion-drawn glass laminate structures containing a photomachinable layer 有权
    包含可光致变色层的熔融玻璃层压结构的加工

    公开(公告)号:US09340451B2

    公开(公告)日:2016-05-17

    申请号:US13798479

    申请日:2013-03-13

    Abstract: Methods for machining glass structures may be performed on fusion-drawn glass laminates having a core layer interposed between a first cladding layer and a second cladding layer. The core layer may be formed from a core glass composition having a core photosensitivity, the first cladding layer may be formed from a glass composition having a photosensitivity different from the core photosensitivity, and the second cladding layer may be formed from a glass composition having a photosensitivity different from the core photosensitivity. At least one of the core layer, the first cladding layer, and the second cladding layer is a photomachinable layer. The methods may include exposing a selected region of a photomachinable layer in the fusion-drawn laminate to ultraviolet radiation; heating the glass structure until the selected region crystallizes; and removing the crystallized material selectively from the photomachinable layer.

    Abstract translation: 用于加工玻璃结构的方法可以在具有介于第一包层和第二包层之间的芯层的熔融拉制玻璃层压板上进行。 芯层可以由具有芯光敏性的芯玻璃组合物形成,第一包层可以由具有不同于芯光敏性的光敏性的玻璃组合物形成,第二包层可以由具有核心光敏性的玻璃组合物形成, 光敏性与核心感光度不同。 核心层,第一包层和第二包层中的至少一个是可光致变色层。 所述方法可以包括将熔融拉制的层压体中的可光致热敏化层的选定区域暴露于紫外线辐射; 加热玻璃结构直到所选区域结晶; 并从所述可光致敏化层中选择性地除去所述结晶材料。

    METHODS FOR LASER PROCESSING TRANSPARENT WORKPIECES USING PULSED LASER BEAM FOCAL LINES AND VAPOR ETCHING

    公开(公告)号:US20210283713A1

    公开(公告)日:2021-09-16

    申请号:US17327194

    申请日:2021-05-21

    Abstract: A method for processing a transparent workpiece includes directing a pulsed laser beam into the transparent workpiece such that a portion of the pulsed laser beam directed into the transparent workpiece generates an induced absorption within the transparent workpiece, thereby forming a damage line within the transparent workpiece, and the portion of the pulsed laser beam directed into the transparent workpiece includes a wavelength λ, a spot size wo, and a Rayleigh range ZR that is greater than F D ⁢ π ⁢ w 0 , 2 λ , where FD is a dimensionless divergence factor comprising a value of 10 or greater. Further, the method for processing the transparent workpiece includes etching the transparent workpiece with an etching vapor to remove at least a portion of the transparent workpiece along the damage line, thereby forming an aperture extending through the at least a portion of the thickness of the transparent workpiece.

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