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公开(公告)号：US20160081220A1
公开(公告)日：2016-03-17
申请号：US14485943
申请日：2014-09-15
Applicant: Cisco Technology, Inc.
Inventor： Vic Hong Chia , Hong Tran Huynh , M. Baris Dogruoz
CPC classification number: F24F7/007 , G06F1/20 , H05K7/20727
Abstract: An apparatus includes a frame and one or more heat generating elements supported by the frame. A plurality of ports are located at the front portion of the frame, and are electrically coupled to the heat generating elements. A faceplate is coupled to the front portion of the frame and includes one or more port openings to allow access to the ports and a plurality of airflow openings. Each of the airflow openings has a bottom edge aligned with the front portion of the frame and a top edge aligned with the top portion of the frame. The top edges of the airflow openings are set back a predetermined distance from the front portion of the frame.
Abstract translation: 一种装置包括框架和由框架支撑的一个或多个发热元件。 多个端口位于框架的前部，并且电耦合到发热元件。 面板联接到框架的前部，并且包括一个或多个端口开口，以允许接近端口和多个气流开口。 每个气流开口具有与框架的前部对准的底部边缘和与框架的顶部部分对准的顶部边缘。 气流开口的顶部边缘从框架的前部设置回预定的距离。
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公开(公告)号：US12209596B2
公开(公告)日：2025-01-28
申请号：US18353596
申请日：2023-07-17
Applicant: Cisco Technology, Inc.
Inventor： Yongguo Chen , Peter Christopher McLean , Vic Hong Chia , Zahid Naveed Aziz , Harvey Yang
Abstract: Various devices, systems, and methods are described herein that provide bi-directional, and even multi-directional airflow within fan systems. These fan systems can be utilized by devices such as datacenter switches to change from one direction of airflow (such as port side inlet) to another direction (such as port side exhaust). This can be done manually by having a multi-directional fan housed within an enclosure that provides access through a hatch door. The multi-directional fan can be removed and reoriented to a second direction, thus providing airflow with the same quality and pressure in multiple directions. Fan changes can also be automated through one or more interlocking rotational gears coupled to the fans within a housing, such that rotating one gear will rotate each of the fans within the housing, thus changing the direction of the airflow. By doing this, only one fan is needed to provide airflow in multiple directions.
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公开(公告)号：US12207435B2
公开(公告)日：2025-01-21
申请号：US17826520
申请日：2022-05-27
Applicant: Cisco Technology, Inc.
Inventor： Vic Hong Chia , Yongguo Chen , Yaotsan Tsai , Hua Yang , Xin Mao
IPC: H05K7/20
Abstract: A fan assembly comprises: a fan having a fan intake and a fan exit downstream from the fan intake, wherein the fan is configured to draw air into the fan intake and propel the air downstream through the fan exit; a housing having a housing inlet coupled to the fan exit and a housing outlet downstream from the housing inlet; and an air guider, mounted inside the housing adjacent to the housing inlet, having a conical shape with a base adjacent to the housing inlet and an apex opposite the base that points towards the housing outlet, wherein the air guider has a first diameter that tapers from the base to the apex, and wherein the air guider is configured to reduce air turbulence of the air when the air is propelled from the housing inlet to the housing outlet.
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公开(公告)号：US12167567B2
公开(公告)日：2024-12-10
申请号：US17498164
申请日：2021-10-11
Applicant: Cisco Technology, Inc.
Inventor： Vic Hong Chia , Yongguo Chen , Yaotsan Tsai , Hua Yang , Xin Mao
Abstract: A fan silencer module includes a housing having a first end of the housing, a second end of the housing, and an interior surface between the first end of the housing and the second end of the housing. Acoustic absorbing material is disposed on the interior surface. A honeycomb air flow director is disposed at the second end of the housing. And an electromagnetic interference gasket surrounds an outer edge of the honeycomb air flow director. In an embodiment, a depth of the electromagnetic interference gasket is at least as deep as a depth of the honeycomb air flow director. Also provided is a handle, and a latch actuator, to enable removal and replacement of the fan silencer module and an associated fan module from a chassis.
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公开(公告)号：US12160979B2
公开(公告)日：2024-12-03
申请号：US17846494
申请日：2022-06-22
Applicant: Cisco Technology, Inc.
Inventor： Chejung Liu , Ravinandana Mysore Ramachandra Rao , Vic Hong Chia
Abstract: According to one embodiment, an apparatus is provided that includes a first block and a second block, one or more springs provided between the first block and the second block, and a thermally conductive wrap extending from the first block to the second block, wherein the thermally conductive wrap is configured to conduct heat away from the first block. An assembly including a chassis, a receptacle, and the apparatus is also provided, as well as a method for operating the apparatus.
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Patent Agency Ranking
公开(公告)号：US12022639B2
公开(公告)日：2024-06-25
申请号：US17670608
申请日：2022-02-14
Applicant: Cisco Technology, Inc.
Inventor： Chejung Liu , Vic Hong Chia
CPC classification number: H05K7/20409 , H05K1/0203
Abstract: An apparatus comprising a printed circuit board with at least one heat source, an enclosure around the printed circuit board, wherein the enclosure includes a first surface and a second surface opposite the first surface, and a heatsink comprising a body portion and a plurality of fins extending from the body portion, wherein the heatsink is attached to the first surface, and wherein the at least one heat source conducts heat to the heatsink, wherein a plurality of channels are provided between the first surface and the second surface, each of the plurality of channel passing through the enclosure, the heatsink, and the printed circuit board.
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公开(公告)号：US20230389224A1
公开(公告)日：2023-11-30
申请号：US17826520
申请日：2022-05-27
Applicant: Cisco Technology, Inc.
Inventor： Vic Hong Chia , Yongguo Chen , Yaotsan Tsai , Hua Yang , Xin Mao
IPC: H05K7/20
CPC classification number: H05K7/20172 , H05K7/20145
Abstract: A fan assembly comprises: a fan having a fan intake and a fan exit downstream from the fan intake, wherein the fan is configured to draw air into the fan intake and propel the air downstream through the fan exit; a housing having a housing inlet configured to be coupled to the fan exit and a housing outlet downstream from the housing inlet; and an air guider, mounted inside the housing adjacent to the housing inlet, having a conical shape with a base adjacent to the housing inlet and an apex opposite the base that points towards the housing outlet, wherein the air guider has a first diameter that tapers from the base to the apex, wherein the first diameter is less than a second diameter of the housing to define a peripheral volume surrounding the air guider that serves as a tunnel, wherein the air guider is configured to reduce air turbulence of the air when the air propelled from the housing inlet to the housing outlet.
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公开(公告)号：US11758689B2
公开(公告)日：2023-09-12
申请号：US17242722
申请日：2021-04-28
Applicant: Cisco Technology, Inc.
Inventor： Yaotsan Tsai , Yongguo Chen , Hua Yang , Vic Hong Chia
IPC: H05K7/20
CPC classification number: H05K7/20336 , H05K7/20509
Abstract: Presented herein is a cold plate assembly including a sub-plate and a vapor chamber for use as part of a remote fin cooling system for an electronic device. The sub-plate includes a first surface, a second surface, and a plurality of pipes. The vapor chamber includes a first wall and a second wall opposite the first wall. The first wall and the second wall define an interior cavity having a first depth for one or more first portions of the vapor chamber and a second depth for one or more second portions of the vapor chamber. The second surface of the sub-plate is attached to the first wall of the vapor chamber.
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公开(公告)号：US20230262938A1
公开(公告)日：2023-08-17
申请号：US17670608
申请日：2022-02-14
Applicant: Cisco Technology, Inc.
Inventor： Chejung Liu , Vic Hong Chia
CPC classification number: H05K7/20409 , H05K1/0203
Abstract: An apparatus comprising a printed circuit board with at least one heat source, an enclosure around the printed circuit board, wherein the enclosure includes a first surface and a second surface opposite the first surface, and a heatsink comprising a body portion and a plurality of fins extending from the body portion, wherein the heatsink is attached to the first surface, and wherein the at least one heat source conducts heat to the heatsink, wherein a plurality of channels are provided between the first surface and the second surface, each of the plurality of channel passing through the enclosure, the heatsink, and the printed circuit board.
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公开(公告)号：US11716836B2
公开(公告)日：2023-08-01
申请号：US17369387
申请日：2021-07-07
Applicant: Cisco Technology, Inc.
Inventor： Vic Hong Chia , George Edward Curtis , John David Stallings
CPC classification number: H05K9/0015 , H05K1/0216 , H05K5/0217 , H05K5/0247 , H05K7/20172 , G06F1/182 , H05K2201/2036
Abstract: A chassis-mounted electronic device includes a conductive chassis, an upper EMI gasket, and a lower EMI gasket. An upper chassis and a lower chassis of the conductive chassis are coupled to form an interior of the chassis housing an electronic device. The upper EMI gasket is attached to the upper chassis, and resiliently contacts a portion of the electronic device. The lower EMI gasket is attached to the lower chassis, and resiliently contacts a different portion of the electronic device. The upper and lower EMI gaskets include perforations to allow cooling air through the EMI gaskets and into the interior of the chassis. The conductive chassis, the upper EMI gasket, and the lower EMI gasket provide EMI shielding for the electronic device.
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