公开(公告)号：US20210337707A1

公开(公告)日：2021-10-28

申请号：US17369387

申请日：2021-07-07

Applicant: Cisco Technology, Inc.

Inventor： Vic Hong Chia ,  George Edward Curtis ,  John David Stallings

IPC: H05K9/00 ,  H05K5/02 ,  H05K1/02 ,  H05K7/20

Abstract: A chassis-mounted electronic device includes a conductive chassis, an upper EMI gasket, and a lower EMI gasket. An upper chassis and a lower chassis of the conductive chassis are coupled to form an interior of the chassis housing an electronic device. The upper EMI gasket is attached to the upper chassis, and resiliently contacts a portion of the electronic device. The lower EMI gasket is attached to the lower chassis, and resiliently contacts a different portion of the electronic device. The upper and lower EMI gaskets include perforations to allow cooling air through the EMI gaskets and into the interior of the chassis. The conductive chassis, the upper EMI gasket, and the lower EMI gasket provide EMI shielding for the electronic device.

公开(公告)号：US20210298211A1

公开(公告)日：2021-09-23

申请号：US16826557

申请日：2020-03-23

Applicant: Cisco Technology, Inc.

Inventor： Vic Hong Chia ,  George Edward Curtis ,  John David Stallings

IPC: H05K9/00 ,  H05K7/20 ,  H05K5/02 ,  H05K1/02

Abstract: A chassis-mounted electronic device includes a chassis, an upper EMI gasket, and a lower EMI gasket is provided. The chassis, including an upper chassis and a lower chassis, is constructed from a conductive sheet with a first thickness. The upper chassis and the lower chassis are coupled to form an interior of the chassis housing an electronic device. The upper EMI gasket is attached to the upper chassis, and is thinner than the upper chassis. The lower EMI gasket is attached to the lower chassis, and is also thinner than the lower chassis. The upper and lower EMI gaskets include perforations to allow cooling air through the EMI gaskets and into the interior of the chassis. Both the upper EMI gasket and the lower EMI gasket are configured to resiliently contact a portion of the electronic device to provide EMI shielding for the electronic device.

公开(公告)号：US11716836B2

公开(公告)日：2023-08-01

申请号：US17369387

申请日：2021-07-07

Applicant: Cisco Technology, Inc.

Inventor： Vic Hong Chia ,  George Edward Curtis ,  John David Stallings

IPC: H05K7/20 ,  G06F1/18 ,  H05K9/00 ,  H05K5/02 ,  H05K1/02

CPC classification number: H05K9/0015 ,  H05K1/0216 ,  H05K5/0217 ,  H05K5/0247 ,  H05K7/20172 ,  G06F1/182 ,  H05K2201/2036

Abstract: A chassis-mounted electronic device includes a conductive chassis, an upper EMI gasket, and a lower EMI gasket. An upper chassis and a lower chassis of the conductive chassis are coupled to form an interior of the chassis housing an electronic device. The upper EMI gasket is attached to the upper chassis, and resiliently contacts a portion of the electronic device. The lower EMI gasket is attached to the lower chassis, and resiliently contacts a different portion of the electronic device. The upper and lower EMI gaskets include perforations to allow cooling air through the EMI gaskets and into the interior of the chassis. The conductive chassis, the upper EMI gasket, and the lower EMI gasket provide EMI shielding for the electronic device.

公开(公告)号：US11129311B1

公开(公告)日：2021-09-21

申请号：US16826557

申请日：2020-03-23

Applicant: Cisco Technology, Inc.

Inventor： Vic Hong Chia ,  George Edward Curtis ,  John David Stallings

IPC: H05K7/20 ,  H05K9/00 ,  H05K5/02 ,  H05K1/02

Abstract: A chassis-mounted electronic device includes a chassis, an upper EMI gasket, and a lower EMI gasket is provided. The chassis, including an upper chassis and a lower chassis, is constructed from a conductive sheet with a first thickness. The upper chassis and the lower chassis are coupled to form an interior of the chassis housing an electronic device. The upper EMI gasket is attached to the upper chassis, and is thinner than the upper chassis. The lower EMI gasket is attached to the lower chassis, and is also thinner than the lower chassis. The upper and lower EMI gaskets include perforations to allow cooling air through the EMI gaskets and into the interior of the chassis. Both the upper EMI gasket and the lower EMI gasket are configured to resiliently contact a portion of the electronic device to provide EMI shielding for the electronic device.