公开(公告)号：US11101248B2

公开(公告)日：2021-08-24

申请号：US15681205

申请日：2017-08-18

Applicant: Cree, Inc.

Inventor： Colin Kelly Blakely ,  Jasper Sicat Cabalu ,  Kyle Damborsky

IPC: H01L25/075 ,  H01L33/50 ,  H01L33/54 ,  H01L33/58 ,  H01L27/02 ,  H01L33/62 ,  H01L33/48 ,  H01L33/60 ,  H05B45/20

Abstract: A light emitter device includes a submount with a top surface and a bottom surface, electrically conductive traces on the top surface of the submount, light emitting diodes (LEDs) arranged on the top surface of the submount in light emitter zones, with the LEDs being electrically connected to respective traces of the traces, a retention material disposed over the top surface of the submount in a form of walls which physically separate the light emitter zones, and encapsulants that are dispensed in respective light emitter zones of the light emitter zones. The LEDs are individually addressable to independently control an output of light from each of the LEDs to produce a specified light output.

公开(公告)号：US10804251B2

公开(公告)日：2020-10-13

申请号：US15359517

申请日：2016-11-22

Applicant: Cree, Inc.

Inventor： Erin R. F. Welch ,  Colin Kelly Blakely ,  Jesse Colin Reiherzer ,  Christopher P. Hussell

IPC: H01L25/075 ,  H05K1/05 ,  H01L33/46 ,  H01L33/48 ,  H01L33/62 ,  H01L33/64

Abstract: Devices, components and methods containing one or more light emitter devices, such as light emitting diodes (LEDs) or LED chips, are disclosed. In one aspect, a light emitter device component can include a metallic substrate with a mirrored surface, one or more light emitter devices mounted directly or indirectly on the mirrored surface, and one or more electrical components mounted on the top surface and electrically coupled to the one or more light emitter devices, wherein the one or more electrical components can be spaced from the mirrored metal substrate by one or more non-metallic layers. Components disclosed herein can result in improved thermal management and light output.

公开(公告)号：US10672957B2

公开(公告)日：2020-06-02

申请号：US15654323

申请日：2017-07-19

Applicant: Cree, Inc.

Inventor： Troy Gould ,  Colin Kelly Blakely ,  Jesse Colin Reiherzer ,  Craig William Hardin

IPC: H01L33/54 ,  H01L33/00 ,  H01L25/075

Abstract: Light emitting diode (LED) apparatuses and methods having a high lumen output density. An example apparatus can include a substrate with one or more LEDs enclosed by an encapsulant. The encapsulant comprises beveled edges and/or top surface facets. By providing facets in the encapsulant and minimizing the chip-to-area ratio through efficient via placement, a high lumen density is achieved. Facets and bevels can be created by removing material from the encapsulant with a beveled blade.

公开(公告)号：US20190355701A1

公开(公告)日：2019-11-21

申请号：US16525100

申请日：2019-07-29

Applicant: Cree, Inc.

Inventor： Troy Gould ,  Colin Kelly Blakely ,  Jesse Colin Reiherzer ,  Joseph G. Clark

IPC: H01L25/075 ,  H01L33/58 ,  H01L33/50 ,  H01L33/54 ,  H01L33/62 ,  H01L33/60

Abstract: Light emitting diode (LED) devices and methods. An example apparatus can include a substrate, one or more LEDs, light-transmissive encapsulation material, and a reflective material covering a portion of the encapsulation material to form a defined opening. The opening allows light emitted from an LED to pass through in a prescribed manner. In some embodiments, the apparatus can be subsequently treated to modify the surface having the opening. In other embodiments, the reflective material can be disposed on a lateral surface of the encapsulation material to reflect light in a desired direction.

公开(公告)号：USD851790S1

公开(公告)日：2019-06-18

申请号：US29616841

申请日：2017-09-08

Applicant: Cree, Inc.

Designer： Jesse Colin Reiherzer ,  Colin Kelly Blakely ,  Samuel Richard Harrell, Jr. ,  Erin R. F. Welch ,  Roshan Murthy

公开(公告)号：US20180261741A1

公开(公告)日：2018-09-13

申请号：US15453594

申请日：2017-03-08

Applicant: Cree, Inc.

Inventor： Erin R. F. Welch ,  Colin Kelly Blakely ,  Jesse Colin Reiherzer ,  Arthur Fong-Yuen Pun

IPC: H01L33/62 ,  H01L33/60 ,  H01L25/075 ,  H01L21/48 ,  H01L33/54 ,  H01L33/50

CPC classification number: H01L33/62 ,  H01L21/4846 ,  H01L25/0753 ,  H01L33/505 ,  H01L33/507 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00014

Abstract: Light emitting diode (LED) devices, components and systems are provided. Improved substrates for LEDs and LED devices are provided, with one or more dielectric layers over a reflective layer sufficient to minimize or eliminate damage of the dielectric layer(s). More stable and efficient LED devices can be produced using such improved substrates. LED devices, and methods of making the same, are also provided wherein LED chips are embedded in fill material to attach the LEDs to a substrate and increase light reflectivity.

公开(公告)号：USD778848S1

公开(公告)日：2017-02-14

申请号：US29523168

申请日：2015-04-07

Applicant: Cree, Inc.

Designer： Colin Kelly Blakely ,  Jesse Colin Reiherzer

公开(公告)号：US20200043905A1

公开(公告)日：2020-02-06

申请号：US16601826

申请日：2019-10-15

Applicant: Cree, Inc.

Inventor： Jesse Colin Reiherzer ,  Colin Kelly Blakely ,  Arthur Fong-Yuen Pun ,  Troy Anthony Trottier

IPC: H01L25/075 ,  H01L33/54

Abstract: Light emitting diode (LED) components and related methods are disclosed. LED components include a submount, at least one LED chip on a first surface of the submount, and a light permeable structure or dam. The light permeable dam can provide a component having a viewing angle that is greater than 115°. A method of providing an LED component includes providing a non-metallic submount, attaching at least one LED chip to a first surface of the submount, and dispensing a light permeable dam over the first surface of the submount about the at least one LED chip thereby providing a component having a viewing angle that is greater than 115°.

公开(公告)号：US10453825B2

公开(公告)日：2019-10-22

申请号：US14538526

申请日：2014-11-11

Applicant: Cree, Inc.

Inventor： Jesse Colin Reiherzer ,  Colin Kelly Blakely ,  Arthur Fong-Yuen Pun ,  Troy Anthony Trottier

IPC: H01L25/075 ,  H01L33/54

Abstract: Light emitting diode (LED) components and related methods are disclosed. LED components include a submount, at least one LED chip on a first surface of the submount, and a non-reflective, light permeable structure or dam. The light permeable dam can provide a component having a viewing angle that is greater than 115°. A method of providing an LED component includes providing a non-metallic submount, attaching at least one LED chip to a first surface of the submount, and dispensing a non-reflective, light permeable dam over the first surface of the submount about the at least one LED chip thereby providing a component having a viewing angle that is greater than 115°.

公开(公告)号：US10439114B2

公开(公告)日：2019-10-08

申请号：US15453594

申请日：2017-03-08

Applicant: Cree, Inc.

Inventor： Erin R. F. Welch ,  Colin Kelly Blakely ,  Jesse Colin Reiherzer ,  Arthur Fong-Yuen Pun

IPC: H01L33/62 ,  H01L33/50 ,  H01L33/60 ,  H01L21/48 ,  H01L25/075 ,  H01L33/54 ,  H01L33/56

Abstract: Light emitting diode (LED) devices, components and systems are provided. Improved substrates for LEDs and LED devices are provided, with one or more dielectric layers over a reflective layer sufficient to minimize or eliminate damage of the dielectric layer(s). More stable and efficient LED devices can be produced using such improved substrates. LED devices, and methods of making the same, are also provided wherein LED chips are embedded in fill material to attach the LEDs to a substrate and increase light reflectivity.