公开(公告)号：US09591786B2

公开(公告)日：2017-03-07

申请号：US14763844

申请日：2013-11-08

Applicant: DENSO CORPORATION

Inventor： Tetsuya Sueyoshi ,  Tsubasa Kawashita ,  Ichiro Yoshida ,  Kiyohiko Sawada

IPC: H05K7/20 ,  H05K5/00

CPC classification number: H05K7/20136 ,  H05K5/0004 ,  H05K7/20863 ,  H05K7/20972

Abstract: An electronic device for a vehicle includes: a digital substrate having a first semiconductor package with a CPU, a second semiconductor package with a volatile memory readable and writable from the CPU, a third semiconductor package with a flash memory storing a start-up program of the CPU, and a fourth semiconductor package with a power supply management integrated circuit; and a fan that takes in air along the surface of the digital substrate on which the first to fourth semiconductor packages are mounted. The third semiconductor package is disposed to distance from the first semiconductor package by at least a first predetermined distance and to distance from the fourth semiconductor package by at least a second predetermined distance exceeding the first predetermined distance, and is disposed in a passage of the air taken in by the fan.

Abstract translation: 一种用于车辆的电子设备包括：具有CPU的第一半导体封装的数字基板，具有可从CPU读取和写入的易失性存储器的第二半导体封装，具有闪存的第三半导体封装，其存储启动程序 CPU和具有电源管理集成电路的第四半导体封装; 以及风扇，其沿着安装有第一至第四半导体封装件的数字基板的表面吸入空气。 第三半导体封装被设置成距离第一半导体封装至少第一预定距离并且距离第四半导体封装的距离超过第一预定距离至少第二预定距离，并且设置在空气的通道中 被粉丝带走。