公开(公告)号：US10913725B2

公开(公告)日：2021-02-09

申请号：US15781843

申请日：2016-11-08

Applicant: DIC Corporation

Inventor： Masato Otsu ,  Tomohiro Shimono ,  Kazuo Arita ,  Junji Yamaguchi

IPC: C07D265/16 ,  C07D265/14 ,  H01L23/31 ,  H05K1/03 ,  C08L61/34 ,  H01L23/29 ,  B32B15/092 ,  B32B15/20 ,  C08F236/20

Abstract: The present invention provides an oxazine compound which contains a group having an aromatic ring structure and a plurality of specified carbon-carbon double bond structure so as to achieve an object. The present invention further provides a composition containing the oxazine compound of the present invention, a cured product containing the composition, and a laminate having a layer of the cured product. The present invention further still provides a composition for a heat-resistant material and a composition for an electronic material, which contain the composition containing the oxazine compound of the present invention so as to achieve the object.

公开(公告)号：US20200331832A1

公开(公告)日：2020-10-22

申请号：US16772858

申请日：2018-11-20

Applicant: DIC Corporation

Inventor： Kazuo Arita ,  Masato Otsu ,  Etsuko Suzuki

IPC: C07C43/23 ,  C09J163/00 ,  C08K3/013 ,  C08G59/46 ,  C08G59/32 ,  B32B15/092 ,  B32B27/38 ,  B32B15/20 ,  B32B7/12 ,  H05K1/03

Abstract: The invention provides an epoxy compound A represented by the following formula (1): in the formula (1), Ar's each independently represent a structure having an unsubstituted or substituted aromatic ring; R1 and R2 each independently represent a hydrogen atom or an alkyl group having 1 or 2 carbon atoms; R3 to R8 represent a hydroxy group, a glycidyl ether group and/or a 2-methylglycidyl ether group, and at least one of R3 to R8 is a glycidyl ether group or a 2-methylglycidyl ether group; R9 to R12 represent a hydroxy group or a methyl group; n is an integer of 11 to 16; and m, p1, p2, and q are average values of repetition, m is 0.5 to 10, p1 and p2 are each independently 0 to 5, and q is 0.5 to 5 (provided that each repeating unit present in the repeating units may be the same or different).

公开(公告)号：US10577307B2

公开(公告)日：2020-03-03

申请号：US16304429

申请日：2017-06-01

Applicant: DIC Corporation

Inventor： Kazuo Arita ,  Tomohiro Shimono ,  Junji Yamaguchi

IPC: C07C213/08 ,  C07C215/74 ,  C07C215/86 ,  C08G59/50 ,  C07C215/80 ,  C07C215/76 ,  C07C215/78 ,  C08G59/64 ,  C08G73/06

Abstract: A task is to provide a method for producing a polycyclic aromatic aminophenol compound through a reduced number of steps at a low cost with high safety. The method for producing a polycyclic aromatic aminophenol compound includes the step of reacting a compound represented by the general formula (1) below and an aromatic amino compound with each other: Wherein n represents an integer of 1 to 8, Ar represents a benzene ring optionally having a substituent, or a naphthalene ring optionally having a substituent, each of R1 and R2 independently represents a hydrogen atom, a hydrocarbon group having 1 to 6 carbon atoms and optionally having a substituent, or an aromatic group optionally having a substituent, and R3 represents a hydroxyl group, a methoxy group, or a halogen atom.

公开(公告)号：US20180362479A1

公开(公告)日：2018-12-20

申请号：US15781843

申请日：2016-11-08

Applicant: DIC Corporation

Inventor： Masato Otsu ,  Tomohiro Shimono ,  Kazuo Arita ,  Junji Yamaguchi

IPC: C07D265/16 ,  C08F236/20 ,  B32B15/092 ,  B32B15/20 ,  H01L23/29 ,  H05K1/03

Abstract: The present invention provides an oxazine compound which contains a group having an aromatic ring structure and a plurality of specified carbon-carbon double bond structure so as to achieve an object. The present invention further provides a composition containing the oxazine compound of the present invention, a cured product containing the composition, and a laminate having a layer of the cured product. The present invention further still provides a composition for a heat-resistant material and a composition for an electronic material, which contain the composition containing the oxazine compound of the present invention so as to achieve the object.

公开(公告)号：US20180327541A1

公开(公告)日：2018-11-15

申请号：US15527876

申请日：2015-11-10

Applicant: DIC Corporation

Inventor： Kazuo Arita ,  Tatsuya Okamoto

IPC: C08G59/40 ,  C08G63/197 ,  H05K1/03

CPC classification number: C08G59/40 ,  C08G63/181 ,  C08G63/197 ,  C08J5/24 ,  H01L23/29 ,  H01L23/295 ,  H01L23/31 ,  H01L2924/0002 ,  H05K1/03 ,  H05K1/0373 ,  H05K3/46 ,  H05K2201/012 ,  H05K2201/0145 ,  H01L2924/00

Abstract: Provided are a thermosetting resin composition whose cured product exhibits a low dielectric constant and a low loss tangent as well as excellent flame retardancy, heat resistance, and thermal decomposition resistance, a cured product obtained from the thermosetting resin composition, and an active ester resin for use in the thermosetting resin composition. Specifically, the thermosetting resin composition contains, as essential components, an epoxy resin and an active ester resin having a resin structure that has a structural segment represented by formula (I) below and monovalent aryloxy groups at both terminals:

公开(公告)号：US10059798B2

公开(公告)日：2018-08-28

申请号：US14436202

申请日：2013-10-02

Applicant: DIC Corporation

Inventor： Kazuo Arita ,  Tomohiro Shimono

IPC: C08G63/137 ,  C08L63/00 ,  C08G63/00 ,  C09D167/00 ,  C09D163/00 ,  C09J167/00 ,  C09J163/00 ,  H05K1/03 ,  C08J5/24 ,  C08G59/62

CPC classification number: C08G63/00 ,  C08G59/62 ,  C08G63/137 ,  C08J5/24 ,  C08J2363/00 ,  C08J2367/00 ,  C08J2463/00 ,  C08J2467/00 ,  C08J2467/03 ,  C08L63/00 ,  C08L67/00 ,  C09D163/00 ,  C09D167/00 ,  C09J163/00 ,  C09J167/00 ,  H05K1/0353 ,  Y10T428/24917

Abstract: An active ester resin having a molecular structure represented by Structural Formula (1) where X represents a benzene ring or a naphthalene ring, each R1 independently represents a methyl group or a hydrogen atom, k is 0 or 1, n is 1 or 2, l is 1 or 2, and m is the average of a repeating unit and from 0.25 to 1.5. The active ester resin, as a curing agent, can be combined with an epoxy resin to form at least an epoxy resin composition, a cured product, a prepreg, a circuit board and a build-up film.

公开(公告)号：US20150344617A1

公开(公告)日：2015-12-03

申请号：US14436202

申请日：2013-10-02

Applicant: DIC CORPORATION

Inventor： Kazuo Arita ,  Tomohiro Shimono

IPC: C08G63/00 ,  C09D163/00 ,  H05K1/03 ,  C09J163/00 ,  C08J5/24 ,  C09D167/00 ,  C09J167/00

CPC classification number: C08G63/00 ,  C08G59/62 ,  C08G63/137 ,  C08J5/24 ,  C08J2363/00 ,  C08J2367/00 ,  C08J2463/00 ,  C08J2467/00 ,  C08L63/00 ,  C09D163/00 ,  C09D167/00 ,  C09J163/00 ,  C09J167/00 ,  H05K1/0353 ,  Y10T428/24917

Abstract: There is provided a novel active ester resin which has a high solubility in a variety of solvents. The active ester resin includes a structural moiety in which a structural unit (I) in which a plurality of arylene groups (a) are bonded to each other via an alicyclic hydrocarbon group is bonded to another structural unit (I) or an aryl group (d) via an arylene dicarbonyloxy group (c), wherein at least one of the arylene groups (a) in the molecule has a structural part (b) represented by Structural Formula (i) and positioned on its aromatic nucleus (in the formula, each R1 independently represents a methyl group or a hydrogen atom; Ar1 represents a phenylene group, a naphthylene group, or a phenylene group or naphthylene group which has one to three alkyl groups each having 1 to 4 carbon atoms on its aromatic nucleus; and n is 1 or 2).

Abstract translation: 提供了一种在各种溶剂中具有高溶解度的新型活性酯树脂。 活性酯树脂包括结构部分，其中多个亚芳基（a）经由脂环族烃基彼此键合的结构单元（I）与另一个结构单元（I）或芳基（ d）通过亚芳基二羰基（c），其中分子中的亚芳基（a）中的至少一个具有由结构式（i）表示的结构部分（b）并且位于其芳香核上（在式中， 每个R 1独立地表示甲基或氢原子; Ar 1表示其芳香核上具有1至3个碳原子的一至三个烷基的亚苯基，亚萘基或亚苯基或亚萘基; n 是1或2）。

公开(公告)号：US20150104651A1

公开(公告)日：2015-04-16

申请号：US14389068

申请日：2013-03-19

Applicant: DIC Corporation

Inventor： Kazuo Arita ,  Hajime Watanabe

IPC: C08G59/22 ,  H05K1/02 ,  C08K7/18

CPC classification number: C08G59/22 ,  C08G59/1494 ,  C08G59/245 ,  C08J5/24 ,  C08J7/047 ,  C08J2363/00 ,  C08K3/013 ,  C08K3/22 ,  C08K7/18 ,  C08K2003/2227 ,  H05K1/0209 ,  H05K1/0326 ,  H05K3/4676 ,  H05K2201/0209 ,  Y10T428/31529 ,  C08L63/00 ,  C08K3/0033

Abstract: The present invention provides an epoxy resin having a low melting point, low melt viscosity, excellent solvent solubility, and excellent processability. Also, the present invention provides an epoxy resin composition and a cured product thereof having excellent fluidity, processability, flexibility, adhesion, and thermal conductivity. The epoxy resin is represented by general formula (I) below (Q: an alkylene chain having a C1-C9 linear part which may have a C1-C18 alkyl group in a side chain, or a linkage chain having an ether bond present between two continuous methylene groups in the alkylene chain; A: a phenylene unit in which 2 to 4 phenylene groups are bonded directly or through a linkage chain, or a naphthylene unit, n: 0 to 10). The epoxy resin composition contains the epoxy resin and a curing agent. The composition includes the epoxy resin.

Abstract translation: 本发明提供一种具有低熔点，低熔体粘度，优异溶剂溶解性和优异加工性能的环氧树脂。 此外，本发明提供具有优异的流动性，加工性，柔韧性，粘附性和导热性的环氧树脂组合物及其固化产物。 环氧树脂由下述通式（I）表示（Q：具有C1-C9直链部分的亚烷基链，侧链中可具有C1-C18烷基或具有二价键之间的具有醚键的连接链） A：亚烷基链中连续的亚甲基; A：其中2至4个亚苯基直接键合或通过连接链或亚萘基单元n：0至10键合的亚苯基单元。 环氧树脂组合物含有环氧树脂和固化剂。 该组合物包括环氧树脂。