公开(公告)号：US20130259806A1

公开(公告)日：2013-10-03

申请号：US13988133

申请日：2011-12-07

Applicant: David Light ,  Paul Szymanski ,  Marian Seto ,  Aline Cornelius

Inventor： David Light ,  Paul Szymanski ,  Marian Seto ,  Aline Cornelius

IPC: C07K16/00

CPC classification number: C07K16/00 ,  A61K51/088 ,  C07K16/18 ,  C07K2317/528 ,  C07K2317/53 ,  C07K2317/55 ,  C07K2317/60 ,  C07K2317/64 ,  C07K2317/94 ,  C07K2319/00 ,  C07K2319/01

Abstract: The invention relates generally to dimeric molecular complexes comprising two fusion proteins. Each fusion protein comprises a biological effector moiety, a polypeptide spacer sequence, and an IgE CH4 dimerization domain. The dimeric molecular complexes may be conjugated, at a defined site, to other molecules including drug moieties, cytotoxic agents, labels (such as detectable labels), or biocompatible polymers.

Abstract translation: 本发明一般涉及包含两种融合蛋白的二聚体分子复合物。 每个融合蛋白包含生物效应子部分，多肽间隔序列和IgE CH4二聚化结构域。 二聚体分子复合物可以在限定的位点与包括药物部分，细胞毒性剂，标记（例如可检测标记）或生物相容性聚合物的其它分子缀合。

公开(公告)号：US20130012658A1

公开(公告)日：2013-01-10

申请号：US13543642

申请日：2012-07-06

Applicant: David Light ,  Barnett Rosenblum

Inventor： David Light ,  Barnett Rosenblum

IPC: C08F222/38

CPC classification number: C12Q1/6834 ,  C08F2/32 ,  C08F220/56 ,  C08F222/385 ,  C08F251/00 ,  C12Q1/6869 ,  C12Q2563/155 ,  C12Q2563/159

Abstract: The disclosure relates to methods of making polymer particles, said methods including the steps of: making an aqueous gel reaction mixture; forming an emulsion having dispersed aqueous phase micelles of gel reaction mixture in a continuous phase; adding an initiator oil comprising at least one polymerization initiator to the continuous phase; and performing a polymerization reaction in the micelles. Further, the initiator oil is present in a volume % relative to a volume of the aqueous gel reaction mixture of between about 1 vol % to about 20 vol %. The disclosure also relates to methods of making nucleic acid polymer particles having the same method steps and wherein the aqueous gel reaction mixture includes a nucleic acid fragment, such as a primer.

公开(公告)号：US20100304982A1

公开(公告)日：2010-12-02

申请号：US12785685

申请日：2010-05-24

Applicant: Wolfgang Hinz ,  John Leamon ,  David Light ,  Jonathan M. Rothberg

Inventor： Wolfgang Hinz ,  John Leamon ,  David Light ,  Jonathan M. Rothberg

IPC: C40B30/00 ,  C40B40/08 ,  C40B50/18 ,  C12P19/34

CPC classification number: B01J19/0046 ,  B01J2219/00466 ,  B01J2219/005 ,  B01J2219/00596 ,  B01J2219/00722 ,  C12N15/1093 ,  C12Q1/6874 ,  C40B40/08 ,  C40B50/06 ,  Y10T428/2982

Abstract: The invention provides particle compositions having applications in nucleic acid analysis. Nucleic acid polymer particles of the invention allow polynucleotides to be attached throughout their volumes for higher loading capacities than those achievable solely with surface attachment. In one aspect, nucleic acid polymer particles of the invention comprise polyacrylamide particles with uniform size distributions having low coefficients of variations, which result in reduced particle-to-particle variation in analytical assays. Such particle compositions are used in various amplification reactions to make amplicon libraries from nucleic acid fragment libraries.

Abstract translation: 本发明提供了在核酸分析中具有应用的颗粒组合物。 本发明的核酸聚合物颗粒允许多核苷酸在其整个体积中被连接，以便比仅通过表面附着可实现的更高的负载能力。 在一个方面，本发明的核酸聚合物颗粒包含具有低变异系数的具有均匀尺寸分布的聚丙烯酰胺颗粒，这导致分析测定中粒子与粒子变化的减少。 这种颗粒组合物用于各种扩增反应以制备来自核酸片段文库的扩增子文库。

公开(公告)号：US20100210630A1

公开(公告)日：2010-08-19

申请号：US12771659

申请日：2010-04-30

Applicant: Damian Arnaiz ,  Greg Brown ,  Emmanuel Claret ,  Arwed Cleve ,  David Davey ,  William Guilford ,  Seock-Kyu Khim ,  Thomas Kirkland ,  Monica J. Kochanny ,  Amy Liang ,  David Light ,  John Parkinson ,  David Vogel ,  Guo Ping Wei ,  Bin Ye

Inventor： Damian Arnaiz ,  Greg Brown ,  Emmanuel Claret ,  Arwed Cleve ,  David Davey ,  William Guilford ,  Seock-Kyu Khim ,  Thomas Kirkland ,  Monica J. Kochanny ,  Amy Liang ,  David Light ,  John Parkinson ,  David Vogel ,  Guo Ping Wei ,  Bin Ye

IPC: A61K31/551 ,  C07D487/08 ,  A61K31/504 ,  C07D243/08 ,  C07D263/32 ,  A61K31/421 ,  C07D211/58 ,  A61K31/4468 ,  C07D207/09 ,  A61K31/40 ,  C07D413/00 ,  A61K31/5377 ,  A61P29/00

CPC classification number: C07D487/08 ,  C07B2200/07 ,  C07C217/58 ,  C07C229/08 ,  C07C229/38 ,  C07C233/78 ,  C07C255/57 ,  C07C271/20 ,  C07C2601/14 ,  C07D207/04 ,  C07D207/09 ,  C07D207/16 ,  C07D211/26 ,  C07D211/34 ,  C07D211/58 ,  C07D243/08 ,  C07D263/14 ,  C07D263/32 ,  C07D277/22 ,  C07D277/68 ,  C07D295/04 ,  C07D295/096 ,  C07D295/16 ,  C07D401/10 ,  C07D401/12 ,  C07D403/12 ,  C07D405/12 ,  C07D409/12 ,  C07D413/12 ,  C07D451/02 ,  C07D451/04

Abstract: This invention is directed to compounds of formula (I): where r, q, R, R2, R3, R4, R5a, R5b, R5c, R6a, R6b, R6c, R7, R8, and R9 are described herein, as single stereoisomers or as mixtures of stereoisomers, or pharmaceutically acceptable salts, solvates, clathrates, polymorphs, ammonium ions, N-oxides or prodrugs thereof; which are leukotriene A4 hydrolase inhibitors and therefore useful in treating inflammatory disorders. Pharmaceutical compositions comprising the compounds of the invention and methods of preparing the compounds of the invention are also disclosed.

Abstract translation: 本发明涉及式（I）化合物：其中r，q，R，R2，R3，R4，R5a，R5b，R5c，R6a，R6b，R6c，R7，R8和R9在本文中描述为单立体异构体 或作为立体异构体或其药学上可接受的盐，溶剂合物，包合物，多晶型物，铵离子，N-氧化物或前药的混合物; 其是白三烯A4水解酶抑制剂，因此可用于治疗炎症性疾病。 还公开了包含本发明化合物的药物组合物和制备本发明化合物的方法。

公开(公告)号：US20080020965A1

公开(公告)日：2008-01-24

申请号：US11766160

申请日：2007-06-21

Applicant: David Light ,  Kirk McLean

Inventor： David Light ,  Kirk McLean

IPC: A61K38/16 ,  A61K31/7088 ,  A61K48/00 ,  A61P7/02 ,  A61K35/14

CPC classification number: C07K16/36 ,  A61K38/00 ,  A61K48/00 ,  A61K2039/505 ,  C07K14/485 ,  C07K14/7455 ,  C07K16/40 ,  C07K19/00 ,  C07K2317/21 ,  C07K2317/32 ,  C07K2317/622 ,  C07K2319/00

Abstract: This invention relates to novel fusion proteins which are comprised of a targeting protein that binds tissue factor (TF), which is operably linked to the thrombomodulin (TM) EGF456 domain alone or in combination with at least one other TM domain selected from the group consisting of the N-terminal hydrophobic region domain, the EGF123 domain, the interdomain loop between EGF3 and EGF4, and the O-glycosylated Ser/Thr-rich domain, or analogs, fragments, derivatives or variants thereof. The fusion protein binds at the site of injury and prevents the initiation of thrombosis. The fusion protein can be used to treat a variety of thrombotic conditions including but not limited to deep vein thrombosis, disseminated intravascular coagulation, and acute coronary syndrome.

Abstract translation: 本发明涉及新颖的融合蛋白，其由结合组织因子（TF）的靶向蛋白组成，其与单独的血栓调节蛋白EGF456结构域或与至少一种其它TM结构域可操作地连接，所述TM结构域选自 的N末端疏水区域，EGF123结构域，EGF3和EGF4之间的域间环和O-糖基化的Ser / Thr富集结构域，或其类似物，片段，衍生物或变体。 融合蛋白在损伤位点处结合并防止血栓形成的发生。 融合蛋白可用于治疗各种血栓形成病症，包括但不限于深静脉血栓形成，弥散性血管内凝血和急性冠状动脉综合征。

公开(公告)号：US20080019985A1

公开(公告)日：2008-01-24

申请号：US11766155

申请日：2007-06-21

Applicant: David Light ,  Kirk McLean

Inventor： David Light ,  Kirk McLean

IPC: A61K39/00 ,  A61K48/00 ,  A61P7/02 ,  C07H21/04 ,  C07K16/46 ,  C07K19/00

CPC classification number: C07K16/36 ,  A61K38/00 ,  A61K48/00 ,  A61K2039/505 ,  C07K14/485 ,  C07K14/7455 ,  C07K16/40 ,  C07K19/00 ,  C07K2317/21 ,  C07K2317/32 ,  C07K2317/622 ,  C07K2319/00

Abstract: This invention relates to novel fusion proteins which are comprised of a targeting protein that binds tissue factor (TF), which is operably linked to the thrombomodulin (TM) EGF456 domain alone or in combination with at least one other TM domain selected from the group consisting of the N-terminal hydrophobic region domain, the EGF123 domain, the interdomain loop between EGF3 and EGF4, and the O-glycosylated Ser/Thr-rich domain, or analogs, fragments, derivatives or variants thereof. The fusion protein binds at the site of injury and prevents the initiation of thrombosis. The fusion protein can be used to treat a variety of thrombotic conditions including but not limited to deep vein thrombosis, disseminated intravascular coagulation, and acute coronary syndrome.

公开(公告)号：US07098074B2

公开(公告)日：2006-08-29

申请号：US10699328

申请日：2003-10-31

Applicant: Michael Warner ,  Masud Beroz ,  David Light ,  Delin Li ,  Dennis Castillo ,  Hung-ming Wang ,  John W. Smith

Inventor： Michael Warner ,  Masud Beroz ,  David Light ,  Delin Li ,  Dennis Castillo ,  Hung-ming Wang ,  John W. Smith

IPC: H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC classification number: H01L24/10 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L23/5389 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05572 ,  H01L2224/13 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/8193 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/05644 ,  H01L2924/00014 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05124

Abstract: A method is disclosed for making a microelectronic package. A material is applied to a first major surface of a microelectronic element to reduce the heights of protrusions projecting from the first major surface. The microelectronic element is assembled to a microelectronic component. A method of forming protrusions and an assembly incorporating the microelectronic element having protrusions is also disclosed.

Abstract translation: 公开了一种制造微电子封装的方法。 将材料施加到微电子元件的第一主表面以减小从第一主表面突出的突起的高度。 微电子元件组装到微电子元件上。 还公开了一种形成突起的方法和包括具有突起的微电子元件的组件。

公开(公告)号：US06657286B2

公开(公告)日：2003-12-02

申请号：US09957120

申请日：2001-09-20

Applicant: David Light

Inventor： David Light

IPC: H01L23495

CPC classification number: H01L24/81 ,  H01L21/6835 ,  H01L23/49811 ,  H01L24/97 ,  H01L29/0657 ,  H01L2224/81801 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2224/81

Abstract: Leads are connected between first and second elements so that a first end of each lead is connected to the first element and a second end of each lead is connected to the second element. and the elements are moved away from one another so as to bend the leads towards a vertically-extensive disposition. The direction of each lead, prior to the movement step, is represented by a lead direction vector from the first end of the lead to the second end of the same lead. At least some of these lead direction vectors are non-parallel with at least some other lead direction vectors, but the various lead direction vectors have components in a common direction. During the vertical movement step, the first element is moved in a horizontal direction of motion in this common direction, thereby moving the first end of each lead horizontally toward the second end of that lead, so as to provide or maintain slack in the leads.

公开(公告)号：US06338982B1

公开(公告)日：2002-01-15

申请号：US09688397

申请日：2000-10-16

Applicant: Masud Beroz ,  Thomas H. DiStefano ,  Matthew T. Hendrickson ,  David Light ,  John W. Smith

Inventor： Masud Beroz ,  Thomas H. DiStefano ,  Matthew T. Hendrickson ,  David Light ,  John W. Smith

IPC: H01L2102

CPC classification number: H01L24/86 ,  B29C2043/5825 ,  H01L21/67144 ,  H01L2224/7965 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/30105 ,  Y10S269/909 ,  Y10T29/53265 ,  Y10T29/53435 ,  Y10T428/23 ,  Y10T428/239 ,  H01L2924/00

Abstract: A flexible sheet used in manufacture of microelectronic components is held on a frame formed from a rigid material so that the frame maintains the sheet under tension during processing and thereby stabilizes the dimensions of the sheet. The frame may be formed from a rigid, light-transmissive material such as a glass, and the bond between the frame and sheet may be made or released by light transmitted through the frame. Preferred features of the framed sheet minimize entrapment of processing liquids such as etch solutions, thereby minimizing carryover of processing solutions between steps. The frame may have contact openings which permit engagement of a metallic layer on the sheet by an electrode carrying electroplating or etching current without disturbing the main portion of the sheet where features are to be formed or treated.

公开(公告)号：US06217972B1

公开(公告)日：2001-04-17

申请号：US09173797

申请日：1998-10-16

Applicant: Masud Beroz ,  Thomas H. DiStefano ,  Matthew T. Hendrickson ,  David Light ,  John W. Smith

Inventor： Masud Beroz ,  Thomas H. DiStefano ,  Matthew T. Hendrickson ,  David Light ,  John W. Smith

IPC: B32B104

CPC classification number: H01L24/86 ,  B29C2043/5825 ,  H01L21/67144 ,  H01L2224/7965 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/30105 ,  Y10S269/909 ,  Y10T29/53265 ,  Y10T29/53435 ,  Y10T428/23 ,  Y10T428/239 ,  H01L2924/00

Abstract: A flexible sheet used in manufacture of microelectronic components is held on a frame formed from a rigid material so that the frame maintains the sheet under tension during processing and thereby stabilizes the dimensions of the sheet. The frame may be formed from a rigid, light-transmissive material such as a glass, and the bond between the frame and sheet may be made or released by light transmitted through the frame. Preferred features of the framed sheet minimize entrapment of processing liquids such as etch solutions, thereby minimizing carryover of processing solutions between steps. The frame may have contact openings which permit engagement of a metallic layer on the sheet by an electrode carrying electroplating or etching current without disturbing the main portion of the sheet where features are to be formed or treated.

Abstract translation: 用于制造微电子部件的柔性片被保持在由刚性材料形成的框架上，使得框架在处理期间将片材保持在张力下，从而稳定片材的尺寸。 框架可以由诸如玻璃的刚性透光材料形成，并且框架和片材之间的结合可以由透射通过框架的光制成或释放。 框架板的优选特征使得诸如蚀刻溶液的处理液体的捕获最小化，从而最小化步骤之间的处理溶液的携带。 框架可以具有接触开口，其允许通过携带电镀或蚀刻电流的电极在片材上接合金属层，而不会干扰要形成或处理特征的片材的主要部分。