Card cage system
    21.
    发明授权
    Card cage system 有权
    卡笼系统

    公开(公告)号:US07277296B2

    公开(公告)日:2007-10-02

    申请号:US10850702

    申请日:2004-05-21

    Applicant: Donald A. Ice

    Inventor: Donald A. Ice

    CPC classification number: H05K7/1404 H05K7/1418

    Abstract: A card cage system is provided that includes a middle card guide interposed between two end card guides in an electronic equipment enclosure. Each of the card guides includes one or more channels adapted to receive a card edge. The middle card guide includes a removable adapter element that can permit insertion of two single wide cards in a side-by-side arrangement. When the adapter element is removed, a double-wide card can be received in the middle card guide such that it straddles the middle card guide. One or more elongate members can also be inserted in any of the card guides to add vertical or lateral stability. Thus, the card guide can be readily customized to accommodate a variety of card types and sizes, in various arrangements.

    Abstract translation: 提供了一种卡笼系统,其包括插入在电子设备外壳中的两个端卡引导件之间的中间卡引导件。 每个卡片导向器包括一个或多个适于接收卡片边缘的通道。 中间卡引导件包括可移动适配器元件,其可以允许以并排布置插入两个单宽卡。 当适配器元件被移除时,可以在中间卡引导件中接收双宽卡,使得它跨越中间卡引导件。 一个或多个细长构件也可以插入任何一个卡导向件中以增加垂直或横向的稳定性。 因此,卡引导件可以容易地定制以适应各种卡类型和尺寸,以各种布置。

    Card guide systems and devices
    22.
    发明授权
    Card guide systems and devices 有权
    卡导向系统和设备

    公开(公告)号:US07099160B1

    公开(公告)日:2006-08-29

    申请号:US10698329

    申请日:2003-10-31

    Applicant: Donald A. Ice

    Inventor: Donald A. Ice

    CPC classification number: H05K7/1418 G06F1/185

    Abstract: A card guide is provided that is suitable for use in connection with a card cage system of an electronic equipment enclosure. The card guide includes one or more engagement elements configured to interact with corresponding structure of the chassis of the electronic equipment enclosure so that the card guide lacks any degree of freedom when the card guide is positioned within a fully assembled electronic equipment enclosure. At least one of the engagement elements is configured and arranged to enage the corresponding structure of the chassis in a permanent snap-fit type arrangement.

    Abstract translation: 提供适于与电子设备外壳的卡笼系统结合使用的卡引导件。 卡引导件包括配置成与电子设备外壳的底盘的相应结构相互作用的一个或多个接合元件,使得当卡引导件定位在完全组装的电子设备外壳内时,卡引导件没有任何自由度。 所述接合元件中的至少一个被构造和布置成以永久卡扣配合型布置来使所述底盘的相应结构成为可能。

    Lead frame for connecting optical sub-assembly to printed circuit board
    23.
    发明授权
    Lead frame for connecting optical sub-assembly to printed circuit board 有权
    用于将光学子组件连接到印刷电路板的引线框架

    公开(公告)号:US07097468B2

    公开(公告)日:2006-08-29

    申请号:US10809992

    申请日:2004-03-26

    Applicant: Donald A. Ice

    Inventor: Donald A. Ice

    CPC classification number: G02B6/4201

    Abstract: Lead frame connectors for connecting optical sub-assemblies to printed circuit boards in optical transceiver modules. The lead frame connectors include a stamped and bent conductive lead structure that is encased in an insert injection molded plastic casing. The plastic casing provides electrical insulation for the conductors in the lead frame as well as mechanical support for the finished component. The lead frame connectors connect to the leads associated with the optical sub-assemblies and are surface mounted onto the printed circuit board to establish connectivity between the optical sub-assembly and the printed circuit board. The lead frame assemblies are generally more reliable and less expensive than using flexible printed circuit board structures to establish electrical connectivity between optical sub-assemblies and transceiver printed circuit boards.

    Abstract translation: 用于将光学子组件连接到光收发器模块中的印刷电路板的引线框架连接器。 引线框架连接器包括被封装并弯曲的导电引线结构,其被封装在插入式注塑塑料外壳中。 塑料外壳为引线框架中的导体提供电绝缘以及成品部件的机械支撑。 引线框架连接器连接到与光学子组件相关联的引线,并且被表面安装到印刷电路板上以在光学子组件和印刷电路板之间建立连接。 引线框架组件通常比使用柔性印刷电路板结构来建立光学子组件和收发器印刷电路板之间的电连接更可靠和更便宜。

    EMI containment transceiver module with floating PCB
    24.
    发明授权
    EMI containment transceiver module with floating PCB 有权
    具有浮动PCB的EMI抑制收发器模块

    公开(公告)号:US07068522B2

    公开(公告)日:2006-06-27

    申请号:US10831595

    申请日:2004-04-23

    Abstract: An electronic module is provided that includes a housing having electrically conductive top and bottom housing portions in substantial contact with each other and cooperating with each other to define an opening. A printed circuit board is disposed within the housing and includes an edge connector at least partially extending through the opening in the housing. The printed circuit board also defines a non-conductive through opening configured and arranged so that the housing portions contact each other by way of the through opening. In this way, the housing portions cooperate to subdivide the opening defined by the housing into at least two relatively smaller openings that, as a result of their relatively small size, facilitate containment of electromagnetic emissions generated by the electronic module.

    Abstract translation: 提供了一种电子模块,其包括壳体,该壳体具有彼此基本接触并且彼此配合以限定开口的导电顶部和底部壳体部分。 印刷电路板设置在壳体内,并且包括至少部分延伸穿过壳体中的开口的边缘连接器。 印刷电路板还限定非导电通孔,其被构造和布置成使得壳体部分通过通孔彼此接触。 以这种方式,壳体部分配合以将由壳体限定的开口细分成至少两个相对较小的开口,由于其相对较小的尺寸,便于容纳由电子模块产生的电磁辐射。

    Heat spreader for optical transceiver components

    公开(公告)号:US06940723B2

    公开(公告)日:2005-09-06

    申请号:US10615107

    申请日:2003-07-08

    CPC classification number: G02B6/4201 G02B6/4266 G02B6/4281 G02B6/4283

    Abstract: An optical transceiver module having improved heat dissipation characteristics is disclosed. The transceiver includes a transmitter optical subassembly (“TOSA”), comprising a hermetically sealed housing penetrated by a component platform that includes interior and exterior platform portions. The interior portion of the component platform supports a laser that produces optical signals for emission by the TOSA. A heat tongue is attached to the both the interior and exterior portions of the component platform and is configured to absorb heat that is produced by the laser and absorbed by the component platform. A heat spreader is positioned within the transceiver shell and includes a cavity defined adjacent the heat tongue. A slug is received into the cavity and is positioned to contact both the heat tongue and the heat spreader body. The slug enables heat from the tongue to be transmitted to the heat spreader and eventually to the transceiver shell.

    Temperature measurement apparatus for optoelectronic transceiver
    27.
    发明授权
    Temperature measurement apparatus for optoelectronic transceiver 有权
    光电收发器温度测量仪

    公开(公告)号:US08128283B2

    公开(公告)日:2012-03-06

    申请号:US12240930

    申请日:2008-09-29

    CPC classification number: G01K7/42 G01K1/16

    Abstract: The case temperature measurement device for an optoelectronic transceiver includes a case with at least one thermally conductive wall, at least one optical component at least partially disposed within the case, circuitry electrically coupled to the optical component. The circuitry includes a temperature sensor coupled to the circuitry. The case temperature measurement device also includes at least one protrusion formed on the wall of the case of the optoelectronic transceiver. The protrusion is thermally coupled to temperature sensor via a thermal pad. A method for estimating case temperature of the optoelectronic transceiver based on an internal temperature measurement and knowledge of the relationship between the measured internal temperature and the actual case temperature, and compensating for the effects of variable heat sources within the transceiver upon this estimate.

    Abstract translation: 用于光电收发器的壳体温度测量装置包括具有至少一个导热壁的壳体,至少部分地设置在壳体内的至少一个光学部件,电耦合到光学部件。 电路包括耦合到电路的温度传感器。 壳体温度测量装置还包括形成在光电收发器的壳体的壁上的至少一个突起。 突起通过热垫热耦合到温度传感器。 一种用于基于内部温度测量估计光电收发器的壳体温度的方法,以及对所测量的内部温度与实际情况温度之间的关系的了解以及在该估计上补偿收发器内的可变热源的影响的方法。

    Methods for manufacturing optical modules having an optical sub-assembly
    28.
    发明授权
    Methods for manufacturing optical modules having an optical sub-assembly 有权
    具有光学子组件的光学模块的制造方法

    公开(公告)号:US07757929B2

    公开(公告)日:2010-07-20

    申请号:US11426298

    申请日:2006-06-23

    Abstract: Methods of manufacturing optical transceiver modules using lead frame connectors that connect optical sub-assemblies to printed circuit boards are disclosed. The lead frame connector includes an electrically insulating case having a first part separated from a second part, and a plurality of conductors that are electrically isolated one from another by the electrically insulating case. Each of the plurality of conductors can form an electrical contact restrained in a fixed position with respect to the first part and a contact point extending from the second part. The electrical contact is aligned with and soldered to the leads that protrude from the back end of an optical sub-assembly. The contact points can then be connected to electrical pads on a PCB.

    Abstract translation: 公开了使用将光学子组件连接到印刷电路板的引线框架连接器制造光收发器模块的方法。 引线框架连接器包括具有与第二部分分离的第一部分的电绝缘壳体和由电绝缘壳体彼此电隔离的多个导体。 多个导体中的每一个可以形成相对于第一部分被限制在固定位置的电触点和从第二部分延伸的接触点。 电触点对准并焊接到从光学子组件的后端突出的引线。 接触点可以连接到PCB上的电焊盘。

    CFP mechanical platform
    29.
    发明授权
    CFP mechanical platform 有权
    CFP机械平台

    公开(公告)号:US07710734B2

    公开(公告)日:2010-05-04

    申请号:US12203053

    申请日:2008-09-02

    CPC classification number: G02B6/4246 G02B6/4201 G02B6/4274 G02B6/4284

    Abstract: In one example embodiment, a pluggable optoelectronic module includes a shell with a front, back, and first and second sides. A first guiderail protrudes from the first side and extends from the front of the shell to the back of the shell. A second guiderail protrudes from the second side and also extends from the front of the shell to the back of the shell. A first thumbscrew runs the length of the module and is housed within the first guiderail. A second thumbscrew also runs the length of the module and is housed within the second guiderail. The two thumbscrews are configured to secure the module to a host device when the module is plugged into the host device.

    Abstract translation: 在一个示例性实施例中,可插拔光电模块包括具有前,后,以及第一和第二侧的外壳。 第一指状物从第一侧突出并且从壳体的前部延伸到壳体的后部。 第二个导轨从第二侧突出并且还从壳体的前部延伸到壳体的后部。 第一个指旋螺丝运行模块的长度,并放置在第一个导轨内。 第二个指旋螺丝也运行模块的长度,并放置在第二个导轨内。 两个指旋螺钉被配置为在模块插入主机设备时将模块固定到主机设备。

    Single layer flex circuit
    30.
    发明授权
    Single layer flex circuit 有权
    单层柔性电路

    公开(公告)号:US07629537B2

    公开(公告)日:2009-12-08

    申请号:US11179223

    申请日:2005-07-11

    Applicant: Donald A. Ice

    Inventor: Donald A. Ice

    Abstract: One example of a single-layer flexible circuit may include a top flexible substrate, a bottom flexible substrate, and a conductive layer disposed therebetween. Signal traces and ground traces can be located in the conductive layer.

    Abstract translation: 单层柔性电路的一个示例可以包括顶部柔性基板,底部柔性基板和设置在其间的导电层。 信号迹线和接地迹线可以位于导电层中。

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