公开(公告)号：US06840111B2

公开(公告)日：2005-01-11

申请号：US10433541

申请日：2002-09-29

Applicant: Hubert Benzel ,  Heribert Weber ,  Frank Schaefer

Inventor： Hubert Benzel ,  Heribert Weber ,  Frank Schaefer

IPC: G01L9/00 ,  H01L29/84 ,  G01L7/06

CPC classification number: G01L9/0052

Abstract: A micromechanical component in which lateral deformations, i.e., deformations of the component parallel to its two main surfaces, are concentrated in a defined area of the component structure, making it possible to decouple lateral and vertical stresses in the component. The component structure includes at least one bellows-like structure in which lateral deformations of the component are concentrated. A pressure sensor having a micromechanical component of this type may be used, for example, for measured-value detection.

Abstract translation: 其中侧向变形（即，与其两个主表面平行的部件的变形）集中在部件结构的限定区域中的微机械部件，使得可以使部件中的横向和垂直应力解耦。 部件结构包括至少一个波纹管状结构，其中部件的侧向变形被集中。 可以使用具有这种类型的微机械部件的压力传感器，例如用于测量值检测。

公开(公告)号：US06803637B2

公开(公告)日：2004-10-12

申请号：US10169464

申请日：2002-10-28

Applicant: Hubert Benzel ,  Heribert Weber ,  Hans Artmann ,  Frank Schaefer

Inventor： Hubert Benzel ,  Heribert Weber ,  Hans Artmann ,  Frank Schaefer

IPC: B81B300

CPC classification number: B81C1/00595 ,  B81B2201/0235 ,  B81B2201/036 ,  B81C2201/0114 ,  B81C2201/0115 ,  B81C2201/0136 ,  B81C2203/0136

Abstract: A micromechanical component having a substrate made from a substrate material having a first doping type, a micromechanical functional structure provided in the substrate and a cover layer to at least partially cover the micromechanical functional structure. The micromechanical functional structure has zones made from the substrate material having a second doping type, the zones being at least partially surrounded by a cavity, and the cover layer has a porous layer made from the substrate material.

Abstract translation: 一种具有由具有第一掺杂类型的衬底材料制成的衬底的微机械部件，设置在衬底中的微机械功能结构以及至少部分地覆盖微机械功能结构的覆盖层。 微机械功能结构具有由具有第二掺杂类型的基底材料制成的区域，所述区域至少部分地被空腔包围，并且覆盖层具有由基底材料制成的多孔层。

公开(公告)号：US08993690B2

公开(公告)日：2015-03-31

申请号：US13266199

申请日：2010-04-26

Applicant: Bin-Eric Chen ,  Frank Schaefer ,  Dirk Kempfert ,  Christoph Bahr ,  Guenter Scholz ,  Teruya Ohkuwa ,  Martin Vallo ,  Carsten Guenther ,  Harald Schulz ,  Yasuyuki Suzuki ,  Tien Kuan Lim

Inventor： Bin-Eric Chen ,  Frank Schaefer ,  Dirk Kempfert ,  Christoph Bahr ,  Guenter Scholz ,  Teruya Ohkuwa ,  Martin Vallo ,  Carsten Guenther ,  Harald Schulz ,  Yasuyuki Suzuki ,  Tien Kuan Lim

IPC: C08L75/06 ,  C08K5/11 ,  C08G18/42 ,  C08G18/48 ,  C08G18/66 ,  C08G18/76 ,  C08J3/18 ,  C08K5/00

CPC classification number: C08G18/664 ,  C08G18/0895 ,  C08G18/4238 ,  C08G18/4854 ,  C08G18/6674 ,  C08G18/7657 ,  C08G18/7671 ,  C08G18/797 ,  C08G2120/00 ,  C08J3/18 ,  C08J2375/04 ,  C08K5/0016 ,  C08K5/005 ,  C08K5/11 ,  C08L75/04

Abstract: The invention refers to a thermoplastic polyurethane produced from at least an organic diisocyanate and a compound which is reactive toward isocyanates, wherein the polyurethane comprises the ester of a tricarboxylic acid with at least one alcohol and wherein all acid groups of the tricarboxylic acid are esterified with an alcohol. The invention further refers to a process for producing the respective polyurethane, products comprising this thermoplastic polyurethane and the use of the ester of a tricarboxylic acid as plasticizer in thermoplastic polyurethanes.

Abstract translation: 本发明涉及由至少一种有机二异氰酸酯制得的热塑性聚氨酯和对异氰酸酯具有反应性的化合物，其中该聚氨酯包含三羧酸与至少一种醇的酯，其中三羧酸的所有酸基均被 一个酒精。 本发明还涉及生产各种聚氨酯的方法，包括该热塑性聚氨酯的产品以及三羧酸酯作为热塑性聚氨酯的增塑剂的用途。

公开(公告)号：US08123963B2

公开(公告)日：2012-02-28

申请号：US12152241

申请日：2008-05-12

Applicant: Hubert Benzel ,  Heribert Weber ,  Hans Artmann ,  Frank Schaefer

Inventor： Hubert Benzel ,  Heribert Weber ,  Hans Artmann ,  Frank Schaefer

IPC: H01L21/302 ,  B81C1/00

CPC classification number: G01L9/0042 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81C1/00047 ,  B81C1/00595 ,  B81C2201/0115 ,  G01L9/0045 ,  H01L21/3063

Abstract: A method for producing a semiconductor component includes forming an n-doped layer in a p-doped layer of the semiconductor component, wherein the n-doped layer comprises at least one of: a sieve-like layer or a network-like layer. The method also includes porously etching the p-doped layer between the material of the n-doped layer to form a top electrode, and forming a cavity below the n-doped layer.

Abstract translation: 一种制造半导体部件的方法包括在所述半导体部件的p掺杂层中形成n掺杂层，其中所述n掺杂层包括以下中的至少一种：筛状层或网状层。 该方法还包括在n掺杂层的材料之间对p-掺杂层进行腐蚀蚀刻以形成顶部电极，以及在n-掺杂层下方形成空腔。

公开(公告)号：US20120015029A1

公开(公告)日：2012-01-19

申请号：US13185817

申请日：2011-07-19

Applicant: Sabine Pfeffer ,  Frank Schaefer ,  Ricardo Schneeberger ,  Paul Allen Sutton ,  Martin Friedrich Trueby ,  Wolfgang Wirth

Inventor： Sabine Pfeffer ,  Frank Schaefer ,  Ricardo Schneeberger ,  Paul Allen Sutton ,  Martin Friedrich Trueby ,  Wolfgang Wirth

IPC: A61K9/20 ,  A61P3/10 ,  A61P3/04 ,  A61P25/00 ,  A61P19/10 ,  A61P25/16 ,  A61P25/28 ,  A61P9/00 ,  A61K31/40 ,  A61P19/02

CPC classification number: A61K9/2018 ,  A61K9/2054 ,  A61K31/195 ,  A61K31/40 ,  A61K31/4439 ,  Y10T428/2982

Abstract: This invention relates to tablets especially tablets formed by direct compression of a dipeptidylpeptidase IV (DPP-IV) inhibitor compound, a process for the preparation thereof, to new pharmaceutical formulations, and new tableting powders comprising DPP-IV inhibitor formulations capable of being directly compressed into tablets. The invention relates further to a process for preparing the tablets by blending the active ingredient and specific excipients into the new formulations and then directly compressing the formulations into the direct compression tablets. The invention also relates to vildagliptin particle size distribution and a new crystal form of vildagliptin particularly adapted for the preparation of improved tablets and other pharmaceutical compositions.

Abstract translation: 本发明涉及片剂，特别是通过直接压制二肽基肽酶IV（DPP-IV）抑制剂化合物，其制备方法，新药物制剂和包含能直接压制的DPP-IV抑制剂制剂的新型压片粉末形成的片剂 成片。 本发明还涉及通过将活性成分和特定赋形剂混合到新制剂中然后将制剂直接压制成直接压制片剂来制备片剂的方法。 本发明还涉及维格列汀的粒度分布和新型晶体形式的维格列汀，特别适用于制备改进的片剂和其它药物组合物。

公开(公告)号：US20110163255A1

公开(公告)日：2011-07-07

申请号：US13000259

申请日：2009-06-26

Applicant: Thomas Deutschmann ,  Frank Schaefer ,  Helena Block

Inventor： Thomas Deutschmann ,  Frank Schaefer ,  Helena Block

IPC: C09K15/22 ,  H01F1/00 ,  C09K15/32

CPC classification number: C07K1/22 ,  B01D15/3828 ,  B01D15/426

Abstract: The invention relates to a method for the preparation of an application buffer for the purification of proteins by means of immobilized metal ion affinity chromatography (IMAC) under denaturing conditions, which is characterized in that a defined amount of a buffer concentrate having a defined pH value is mixed with a defined amount of a urea concentrate, whereby an application buffer having a defined pH value is provided. According to the invention, a corresponding kit is provided in addition. The components are stable in storage and by mixing produce an application buffer having a defined composition and a defined pH value. The need for pH adjustment or a new preparation is eliminated. The invention can thus be used in an automated manner and as a closed kit concept.

Abstract translation: 本发明涉及一种在变性条件下通过固定金属离子亲和层析（IMAC）制备用于纯化蛋白质的应用缓冲液的方法，其特征在于定义量的具有确定的pH值的缓冲浓缩物 与规定量的尿素浓缩物混合，由此提供具有确定的pH值的施用缓冲液。 根据本发明，另外提供相应的试剂盒。 这些组分在储存中是稳定的并且通过混合产生具有确定的组成和定义的pH值的应用缓冲液。 消除了对pH调节或新制剂的需要。 因此，本发明可以以自动化的方式和作为封闭的工具箱概念使用。

公开(公告)号：US20090247581A1

公开(公告)日：2009-10-01

申请号：US12085056

申请日：2006-11-16

Applicant: Mahavir Prashad ,  Yugang Liu ,  Bin Hu ,  Michael J. Girgis ,  Frank Schaefer

Inventor： Mahavir Prashad ,  Yugang Liu ,  Bin Hu ,  Michael J. Girgis ,  Frank Schaefer

IPC: C07D211/26 ,  A61K31/445

CPC classification number: C07D211/26 ,  C07B57/00

Abstract: The present invention relates to a process for the synthesis of (S)-2′[2-1-(methyl-2-piperidyl) ethyl] cinnamanilide (I) or salts or pharmaceutically acceptable prodrugs thereof:

Abstract translation: 本发明涉及合成（S）-2'[2-1-（甲基-2-哌啶基）乙基]肉桂酰苯胺（I）或其盐或其药学上可接受的前药的方法：

公开(公告)号：US07479234B2

公开(公告)日：2009-01-20

申请号：US10492009

申请日：2002-09-04

Applicant: Hubert Benzel ,  Heribert Weber ,  Frank Schaefer

Inventor： Hubert Benzel ,  Heribert Weber ,  Frank Schaefer

IPC: H01B13/00

CPC classification number: B81C1/00047 ,  B81C1/00246 ,  B81C2201/0115 ,  B81C2201/014

Abstract: A method is proposed which will enable cavities having optically transparent walls to be produced simply and cost-effectively in a component by using standard methods of microsystems technology. For this purpose, a silicon region is first produced, which is surrounded on all sides by at least one optically transparent cladding layer. At least one opening is then produced in the cladding layer. Over this opening, the silicon surrounded by the cladding layer is dissolved out, forming a cavity within the cladding layer. In this context, the cladding layer acts as an etch barrier layer.

Abstract translation: 提出了一种通过使用微系统技术的标准方法，能够简单且成本有效地在部件中产生具有光学透明壁的空腔的方法。 为此目的，首先制造出硅区域，其通过至少一个光学透明覆层在所有侧面上被包围。 然后在包层中产生至少一个开口。 在该开口上，由包覆层包围的硅被溶出，在包覆层内形成空腔。 在本文中，包覆层用作蚀刻阻挡层。

公开(公告)号：US07300854B2

公开(公告)日：2007-11-27

申请号：US10451775

申请日：2001-12-06

Applicant: Hubert Benzel ,  Heribert Weber ,  Frank Schaefer

Inventor： Hubert Benzel ,  Heribert Weber ,  Frank Schaefer

IPC: H01L21/76 ,  H01L21/20 ,  H01L21/00

CPC classification number: B81C1/00492 ,  B81B2201/0235 ,  B81B2203/0315 ,  B81C2201/0115 ,  Y10S438/96

Abstract: A method of producing a semiconductor component, e.g., a multilayer semiconductor component, and a semiconductor component produced by this method, where the semiconductor component has, e.g., a mobile mass, i.e., an oscillator structure.A method easily and inexpensively produce a micromechanical component having monocrystalline oscillator structures, such as an acceleration sensor or a rotational rate sensor for example, by surface micromechanics, a first porous layer is formed in the semiconductor component in a first step and a cavity, i.e., a cavern, is formed beneath or out of the first porous layer in the semiconductor component in a second step.

Abstract translation: 制造半导体元件的方法，例如多层半导体元件，以及通过该方法制造的半导体元件，其中半导体元件具有例如移动质量，即振荡器结构。 一种容易且廉价地制造具有单晶振荡器结构的微机械部件，例如加速度传感器或旋转速率传感器，例如通过表面微机械，在第一步骤和空腔中在半导体部件中形成第一多孔层，即 在第二步骤中，在半导体部件中的第一多孔层的下面或外面形成有洞穴。

公开(公告)号：US07160750B2

公开(公告)日：2007-01-09

申请号：US10473762

申请日：2002-02-21

Applicant: Hubert Benzel ,  Heribert Weber ,  Frank Schaefer

Inventor： Hubert Benzel ,  Heribert Weber ,  Frank Schaefer

IPC: H01L21/00

CPC classification number: B81C1/00047 ,  B81B2201/0278 ,  B81C2201/0115 ,  B81C2201/0139

Abstract: A method for manufacturing a semiconductor component, such as, for example, a multilayer semiconductor component including a micromechanical component, such as, for example, a heat transfer sensor having a semiconductor substrate of silicon, and a sensor region. For inexpensive manufacture of a thermal insulation between the semiconductor substrate and the sensor region a porous layer is provided in the semiconductor component.

Abstract translation: 一种半导体部件的制造方法，例如包括微机械部件的多层半导体部件，例如具有硅的半导体基板的传热传感器和传感器区域。 为了廉价地制造半导体基板和传感器区域之间的绝热，在半导体部件中设置多孔层。