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公开(公告)号：US20250044521A1
公开(公告)日：2025-02-06
申请号：US18746490
申请日：2024-06-18
Applicant: FUJITSU OPTICAL COMPONENTS LIMITED
Inventor： Masaki SUGIYAMA
IPC: G02B6/35
Abstract: An optical device is an optical device that is formed on a wafer. The optical device includes an optical circuit, a grating coupler, and an optical switch that includes a first port that is connected to the grating coupler, a second port that is connected to the optical circuit, and a third port that is connected to a loop mirror by way of a phase shifter.
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公开(公告)号：US20250012989A1
公开(公告)日：2025-01-09
申请号：US18662260
申请日：2024-05-13
Applicant: FUJITSU OPTICAL COMPONENTS LIMITED
Inventor： Masaki SUGIYAMA
Abstract: An optical integrated device includes a first chip including an optical circuit, and a second chip including an optical waveguide including a material with an electro-optic effect larger than the electro-optic effect of a material of the first chip. In the optical integrated device, the first chip is mounted in a trench formed on the second chip, and the first chip is optically coupled to the second chip by butt coupling.
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公开(公告)号：US20240295708A1
公开(公告)日：2024-09-05
申请号：US18425106
申请日：2024-01-29
Applicant: FUJITSU OPTICAL COMPONENTS LIMITED
Inventor： Masaki SUGIYAMA
IPC: G02B6/42
CPC classification number: G02B6/4239 , G02B6/4206
Abstract: An optical device includes a substrate, a trench that is formed on the substrate, an optical waveguide that is formed on the substrate and that is connected to a first side surface of the trench, and a lens that is arranged on the first side surface included in the trench and that is connected to the optical waveguide. Furthermore, the optical device includes an optical fiber that is secured, by an adhesive, to a chip end surface that is located adjacent to a second side surface that is located opposite the first side surface included in the trench.
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公开(公告)号：US20230073002A1
公开(公告)日：2023-03-09
申请号：US17840178
申请日：2022-06-14
Applicant: Fujitsu Optical Components Limited
Inventor： Masaki SUGIYAMA
Abstract: An optical device includes a modulator and a tap coupler. The modulator includes an optical waveguide that is formed of a thin-film lithium niobate (LN) substrate and through which light passes, and an electrode that applies voltage to the optical waveguide, and modulates a phase of light that passes through the optical waveguide in accordance with an electric field in the optical waveguide, where the electric field corresponds to the voltage. The tap coupler includes at least a part formed of the thin-film LN substrate, and splits a part of the light that passes through an inside of the optical waveguide. The tap coupler includes a delayed interferometer that splits a part of the light that passes through the optical waveguide, at a split ratio corresponding to a phase difference of light that passes through an inside of the tap coupler from the optical waveguide.
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公开(公告)号：US20230065036A1
公开(公告)日：2023-03-02
申请号：US17845328
申请日：2022-06-21
Applicant: FUJITSU OPTICAL COMPONENTS LIMITED
Inventor： Masaki SUGIYAMA
Abstract: An optical device includes a rib optical waveguide that is a thin-film lithium niobate (LN) crystal formed of a thin-film LN substrate, and a buffer layer that is laminated on the optical waveguide. The optical device further includes an electrode that is laminated on the buffer layer, and sub electrodes that are arranged parallel to the electrode on the buffer layer, and attract a charge in the optical waveguide in accordance with electrification.
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Patent Agency Ranking
26.发明申请公开(公告)号：US20220163827A1
公开(公告)日：2022-05-26
申请号：US17496304
申请日：2021-10-07
Applicant: FUJITSU OPTICAL COMPONENTS LIMITED
Inventor： Masaki SUGIYAMA
Abstract: An optical device has a silicon (Si) substrate, a ground electrode, a lithium niobate (LN) optical waveguide, and a signal electrode. The ground electrode is an electrode that is at ground potential and that is layered on the Si substrate. The LN optical waveguide is an optical waveguide that is formed by a thin film LN substrate that is layered on the ground electrode. The signal electrode is an electrode that is disposed at a position opposite the ground electrode with the LN optical waveguide interposed therebetween and that applies a high-frequency signal.
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27.发明申请公开(公告)号：US20190041670A1
公开(公告)日：2019-02-07
申请号：US16050347
申请日：2018-07-31
Applicant: Fujitsu Optical Components Limited
Inventor： Masaki SUGIYAMA
IPC: G02F1/01
CPC classification number: G02F1/0147 , G02F2201/58 , G02F2203/055
Abstract: A tunable light source includes a substrate; a light source; a wavelength selecting device that selects, according to a control signal, output light with a specific wavelength from light output from the light source; a wavelength filter that is disposed on the substrate, filters the output light, and outputs the filtered light; a light-receiving device that receives the filtered light from the wavelength filter; and a controller configured to generate the control signal based on an output transmittance corresponding to a quantity of the received light received by the light-receiving device, a first transmittance corresponding to a target wavelength, a second transmittance corresponding to a shorter-wavelength limit of a control range including the target wavelength, and a third transmittance corresponding to a longer-wavelength limit of the control range, and output the generated control signal to the wavelength selecting device.
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公开(公告)号：US20180031945A1
公开(公告)日：2018-02-01
申请号：US15650222
申请日：2017-07-14
Applicant: Fujitsu Optical Components Limited
Inventor： Yasuhiro OHMORI , Yoshinobu KUBOTA , Masaharu DOI , Masaki SUGIYAMA
CPC classification number: G02F1/2255 , G02F1/0027 , G02F1/0123 , G02F1/2257 , G02F2201/07 , G02F2203/21 , H04B10/50572
Abstract: An optical modulator includes an optical modulator chip configured to optically modulate an optical signal using an electrical signal input thereto; and a relay substrate configured to relay and couple the electrical signal to the optical modulator chip. The optical modulator chip includes a signal electrode and a ground electrode for the electrical signal, formed along a waveguide for the optical signal. One end of the optical modulator chip is arranged to face the relay substrate. An electrode connection portion coupling the electrical signal to the relay substrate by wire is provided at the one end. A distance between a tip of one end of the signal electrode in the electrode connection portion and the end of the optical modulator chip is less than a distance between a tip of an end of the ground electrode in the electrode connection portion and the end of the optical modulator chip.
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公开(公告)号：US20170082875A1
公开(公告)日：2017-03-23
申请号：US15244438
申请日：2016-08-23
Applicant: Fujitsu Optical Components Limited
Inventor： Masaki SUGIYAMA
CPC classification number: G02F1/0121 , G02F1/025 , G02F2201/12 , H04B10/50
Abstract: An optical transmission device includes: an optical modulation package that includes a plurality of terminals that are exposed to an outside from a front surface thereof, and performs optical modulation on electrical signals input from the terminals; a flexible board that includes: an electrode arrangement part on which electrodes respectively connected to the terminals are arranged side by side to transmit the electrical signals to the terminals; and an arm part that projects more outward than an electrode located on an end of the electrode arrangement part and extends toward the optical modulation package to be locked to the optical modulation package; and an optical transmission member that transmits an optical signal obtained by the optical modulation performed by the optical modulation package.
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公开(公告)号：US20160161771A1
公开(公告)日：2016-06-09
申请号：US14943736
申请日：2015-11-17
Applicant: Fujitsu Optical Components Limited
Inventor： Masaki SUGIYAMA , Akira Ishii , Yoshinobu Kubota
CPC classification number: G02F1/0316 , G02B6/4201 , G02F1/035 , G02F1/225
Abstract: An optical module includes a package, a substrate, a lead pin, and a ground pattern. The substrate is accommodated in the package, includes a signal line pattern that transmits an electric signal, extends toward a side wall of the package beyond an end of the signal line pattern, and has a through hole between the end of the signal line pattern and the side wall of the package. The lead pin is inserted into the through hole in the substrate and inputs the electric signal to the end of the signal line pattern. The ground pattern is provided in at least a part of regions surrounding the through hole on the substrate.
Abstract translation: 光学模块包括封装，基板，引脚引脚和接地图案。 衬底被容纳在封装中，包括传输电信号的信号线图案，朝着封装的侧壁延伸超过信号线图案的端部，并且在信号线图案的端部和 包装的侧壁。 引脚插入基板的通孔中，并将电信号输入到信号线图案的末端。 接地图案设置在围绕基板上的通孔的区域的至少一部分中。
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