Context aware processing to resolve strong spacing effects due to strain relaxation in standard cell library

    公开(公告)号:US10360334B2

    公开(公告)日:2019-07-23

    申请号:US15428449

    申请日:2017-02-09

    Abstract: Methods and systems assign an alignment context to each of the cells within an integrated circuit layout, from previously established alignment contexts, based on how the different cell widths cause each of the cells to align with adjoining cells. Also, such methods and systems retrieve standard signal delay times for each of the cells from a standard cell library. This allows these methods and systems to adjust the signal delay times for each of the cells based on which alignment context has been assigned to each of the cells, to produce adjusted delay times for each of the cells. Following this, the methods and systems perform a timing analysis of the layout using the adjusted delay times for each of the cells, and output the results of the timing analysis.

    Calibration devices for I/O driver circuits having switches biased differently for different temperatures

    公开(公告)号:US10333497B1

    公开(公告)日:2019-06-25

    申请号:US15944813

    申请日:2018-04-04

    Abstract: A calibration circuit is connected to an input/output driver, a voltage bias generator is connected to the calibration circuit and the input/output driver, and a temperature sensor is connected to the voltage bias generator. The calibration circuit and input/output driver each include a bank of resistors and corresponding switches. Bodies of the switches are connected to the voltage bias generator, and the switches are biased by a bias signal output from the voltage bias generator. The calibration circuit includes a comparator device connected to the switches and to a reference resistor. Activation and deactivation of selected ones of the switches is made to match the reference resistor. Also, the voltage bias generator adjusts the bias signal when a temperature change is sensed by the temperature sensor. Thus, the switches change current flow as the bias signal changes, without changing which of the switches are activated or deactivated.

    On-chip voltage generator for back-biasing field effect transistors in a circuit block

    公开(公告)号:US10303196B1

    公开(公告)日:2019-05-28

    申请号:US15966300

    申请日:2018-04-30

    Abstract: Disclosed is a voltage generator that includes a first voltage generation circuit and a second voltage generation circuit. The first voltage generation circuit is selectively operable in a single trimming mode enabling positive trimming only or in a dual trimming mode that shifts the voltage range downward enabling a somewhat smaller amount of positive trimming and also some negative trimming. The second voltage generation circuit is selectively operable in a single trimming mode enabling negative trimming only or in a dual trimming mode that shifts the voltage range upward enabling a somewhat smaller amount of negative trimming and also some positive trimming. Also disclosed is an integrated circuit (IC) chip that incorporates one or more such voltage generators for back-biasing the field effect transistors in one or more circuit blocks, respectively.

    Antenna diode circuit for manufacturing of semiconductor devices

    公开(公告)号:US10096595B2

    公开(公告)日:2018-10-09

    申请号:US15286196

    申请日:2016-10-05

    Abstract: At least one method, apparatus and system disclosed involves an antenna diode design for a semiconductor device. A first common diode operatively coupled to a ground node and to a p-well layer serving as an isolated p-well that is formed over a deep n-well that is adjacent to an n-well in a semiconductor device is provided. A first antenna diode formed on the isolated p-well operatively coupled to the p-well layer and operatively coupled to a first signal line of the semiconductor device is provided for discharging accumulated charges on the first signal line. A second antenna diode formed on the isolated p-well operatively coupled to the p-well layer and operatively coupled to a second signal line of semiconductor device is provided for discharging accumulated charges on the second signal line.

    CONTEXT AWARE PROCESSING TO RESOLVE STRONG SPACING EFFECTS DUE TO STRAIN RELAXATION IN STANDARD CELL LIBRARY

    公开(公告)号:US20180225406A1

    公开(公告)日:2018-08-09

    申请号:US15428449

    申请日:2017-02-09

    CPC classification number: G06F17/5072 G06F17/5077 G06F2217/84

    Abstract: Methods and systems assign an alignment context to each of the cells within an integrated circuit layout, from previously established alignment contexts, based on how the different cell widths cause each of the cells to align with adjoining cells. Also, such methods and systems retrieve standard signal delay times for each of the cells from a standard cell library. This allows these methods and systems to adjust the signal delay times for each of the cells based on which alignment context has been assigned to each of the cells, to produce adjusted delay times for each of the cells. Following this, the methods and systems perform a timing analysis of the layout using the adjusted delay times for each of the cells, and output the results of the timing analysis.

    Positive and negative full-range back-bias generator circuit structure

    公开(公告)号:US10678287B2

    公开(公告)日:2020-06-09

    申请号:US16159831

    申请日:2018-10-15

    Abstract: Embodiments of the disclosure provide a circuit structure for producing a full range biasing voltage including: a logic control node; first and second voltage generators, coupled to the logic control node, the first and second voltage generators configured to generate a positive voltage output at a positive voltage node and a negative voltage output at a negative voltage node; first and second multiplexer cells, coupled to the logic control node, configured to multiplex the positive voltage level received from the first or the second positive voltage node and the negative voltage level received from the first or the second negative voltage node to provide a multiplexed output; and an output node coupled to each of the first multiplexer cell and the second multiplexer cell configured to receive the multiplexed output to provide a biasing voltage range to at least one transistor having a back-gate terminal.

    FDSOI semiconductor device with contact enhancement layer and method of manufacturing

    公开(公告)号:US10347543B2

    公开(公告)日:2019-07-09

    申请号:US15810557

    申请日:2017-11-13

    Abstract: A method of forming contacts includes forming a plurality of transistor devices separated by shallow trench insulator regions, the transistor devices each comprising a semiconductor substrate, a buried insulator layer on the semiconductor bulk substrate, a semiconductor layer on the buried insulator layer, a high-k metal gate stack on the semiconductor layer and a gate electrode above the high-k metal gate stack, raised source/drain regions on the semiconductor layer, and a silicide contact layer above the raised source/drain regions and the gate electrode, providing an interlayer dielectric stack on the silicide contact layer and planarizing the interlayer dielectric stack, patterning a plurality of contacts through the interlayer dielectric stack onto the raised source/drain regions, and, for at least some of the contacts, patterning laterally extended contact regions above the contacts, the laterally extended contact regions extending over shallow trench insulator regions neighboring the corresponding raised source/drain regions.

    Method, apparatus and system for forming recolorable standard cells with triple patterned metal layer structures

    公开(公告)号:US10108771B2

    公开(公告)日:2018-10-23

    申请号:US15140183

    申请日:2016-04-27

    Abstract: At least one method, apparatus and system disclosed herein for forming a semiconductor device comprising a plurality of cells having metal features formed using triple patterning processes. An overall pattern layout is created for a first cell that is to be manufactured using a triple patterning process for forming a plurality of metal features on a metal layer. A first color metal feature is formed in the metal layer. The first color metal feature is associated with a first patterning process of the triple patterning process. A second color metal feature is formed in the metal layer. The second color metal feature is associated with a second patterning process of the triple patterning process. A third color metal feature is formed in the metal layer. The third color metal feature is associated with a third patterning process of the triple patterning process. At least one of the first, second, and third color metal features is re-colorable.

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