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21.
公开(公告)号:US10360334B2
公开(公告)日:2019-07-23
申请号:US15428449
申请日:2017-02-09
Applicant: GLOBALFOUNDRIES INC.
Inventor: Navneet Jain , Mahbub Rashed , Juhan Kim
IPC: G06F17/50
Abstract: Methods and systems assign an alignment context to each of the cells within an integrated circuit layout, from previously established alignment contexts, based on how the different cell widths cause each of the cells to align with adjoining cells. Also, such methods and systems retrieve standard signal delay times for each of the cells from a standard cell library. This allows these methods and systems to adjust the signal delay times for each of the cells based on which alignment context has been assigned to each of the cells, to produce adjusted delay times for each of the cells. Following this, the methods and systems perform a timing analysis of the layout using the adjusted delay times for each of the cells, and output the results of the timing analysis.
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公开(公告)号:US10340288B2
公开(公告)日:2019-07-02
申请号:US15226867
申请日:2016-08-02
Applicant: GLOBALFOUNDRIES INC.
Inventor: Juhan Kim , Mahbub Rashed
IPC: H01L27/118 , H01L29/78 , H01L27/11 , H01L27/02
Abstract: At least one method, apparatus and system disclosed involves an integrated circuit comprising a unidirectional metal layout. A first set of metal features are formed in a vertical configuration in a first metal layer of a memory cell. A second set of metal features are formed in a unidirectional horizontal configuration in a second metal layer of the memory cell. A third set of metal features are formed in the unidirectional horizontal configuration in a second metal layer of a functional cell for providing routing compatibility between the memory cell and the functional cell. The memory cell is placed adjacent to the functional cell for forming an integrated circuit device.
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23.
公开(公告)号:US10333497B1
公开(公告)日:2019-06-25
申请号:US15944813
申请日:2018-04-04
Applicant: GLOBALFOUNDRIES INC.
Inventor: Anil Kumar , Mahbub Rashed , Sushama Davar , Navneet Jain
Abstract: A calibration circuit is connected to an input/output driver, a voltage bias generator is connected to the calibration circuit and the input/output driver, and a temperature sensor is connected to the voltage bias generator. The calibration circuit and input/output driver each include a bank of resistors and corresponding switches. Bodies of the switches are connected to the voltage bias generator, and the switches are biased by a bias signal output from the voltage bias generator. The calibration circuit includes a comparator device connected to the switches and to a reference resistor. Activation and deactivation of selected ones of the switches is made to match the reference resistor. Also, the voltage bias generator adjusts the bias signal when a temperature change is sensed by the temperature sensor. Thus, the switches change current flow as the bias signal changes, without changing which of the switches are activated or deactivated.
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公开(公告)号:US10303196B1
公开(公告)日:2019-05-28
申请号:US15966300
申请日:2018-04-30
Applicant: GLOBALFOUNDRIES INC.
Inventor: Navneet Jain , Arif A. Siddiqi , Mahbub Rashed
Abstract: Disclosed is a voltage generator that includes a first voltage generation circuit and a second voltage generation circuit. The first voltage generation circuit is selectively operable in a single trimming mode enabling positive trimming only or in a dual trimming mode that shifts the voltage range downward enabling a somewhat smaller amount of positive trimming and also some negative trimming. The second voltage generation circuit is selectively operable in a single trimming mode enabling negative trimming only or in a dual trimming mode that shifts the voltage range upward enabling a somewhat smaller amount of negative trimming and also some positive trimming. Also disclosed is an integrated circuit (IC) chip that incorporates one or more such voltage generators for back-biasing the field effect transistors in one or more circuit blocks, respectively.
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公开(公告)号:US10096595B2
公开(公告)日:2018-10-09
申请号:US15286196
申请日:2016-10-05
Applicant: GLOBALFOUNDRIES INC.
Inventor: Juhan Kim , Mahbub Rashed , Navneet Jain , Anurag Mittal , Sangmoon Kim
Abstract: At least one method, apparatus and system disclosed involves an antenna diode design for a semiconductor device. A first common diode operatively coupled to a ground node and to a p-well layer serving as an isolated p-well that is formed over a deep n-well that is adjacent to an n-well in a semiconductor device is provided. A first antenna diode formed on the isolated p-well operatively coupled to the p-well layer and operatively coupled to a first signal line of the semiconductor device is provided for discharging accumulated charges on the first signal line. A second antenna diode formed on the isolated p-well operatively coupled to the p-well layer and operatively coupled to a second signal line of semiconductor device is provided for discharging accumulated charges on the second signal line.
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26.
公开(公告)号:US20180225406A1
公开(公告)日:2018-08-09
申请号:US15428449
申请日:2017-02-09
Applicant: GLOBALFOUNDRIES INC.
Inventor: Navneet Jain , Mahbub Rashed , Juhan Kim
IPC: G06F17/50
CPC classification number: G06F17/5072 , G06F17/5077 , G06F2217/84
Abstract: Methods and systems assign an alignment context to each of the cells within an integrated circuit layout, from previously established alignment contexts, based on how the different cell widths cause each of the cells to align with adjoining cells. Also, such methods and systems retrieve standard signal delay times for each of the cells from a standard cell library. This allows these methods and systems to adjust the signal delay times for each of the cells based on which alignment context has been assigned to each of the cells, to produce adjusted delay times for each of the cells. Following this, the methods and systems perform a timing analysis of the layout using the adjusted delay times for each of the cells, and output the results of the timing analysis.
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公开(公告)号:US09142513B2
公开(公告)日:2015-09-22
申请号:US14645598
申请日:2015-03-12
Applicant: GLOBALFOUNDRIES Inc.
Inventor: Mahbub Rashed , Yuansheng Ma , Irene Lin , Jason Stephens , Yunfei Deng , Yuan Lei , Jongwook K E , Roderick Augur , Shibly Ahmed , Subramani Kengeri , Suresh Venkatesan
IPC: H01L23/538 , H01L29/78 , H01L27/092 , H01L27/02
CPC classification number: H01L23/5386 , H01L21/76895 , H01L21/823871 , H01L23/5384 , H01L27/0207 , H01L27/0924 , H01L29/7851 , H01L2924/0002 , H01L2924/00
Abstract: An approach for providing MOL constructs using diffusion contact structures is disclosed. Embodiments include: providing a first diffusion region in a substrate; providing, via a first lithography process, a first diffusion contact structure; providing, via a second lithography process, a second diffusion contact structure; and coupling the first diffusion contact structure to the first diffusion region and the second diffusion contact structure. Embodiments include: providing a second diffusion region in the substrate; providing a diffusion gap region between the first and second diffusion regions; providing the diffusion contact structure over the diffusion gap region; and coupling, via the diffusion contact structure, the first and second diffusion regions.
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公开(公告)号:US10678287B2
公开(公告)日:2020-06-09
申请号:US16159831
申请日:2018-10-15
Applicant: GLOBALFOUNDRIES INC.
Inventor: Arif A. Siddiqi , Juhan Kim , Mahbub Rashed
Abstract: Embodiments of the disclosure provide a circuit structure for producing a full range biasing voltage including: a logic control node; first and second voltage generators, coupled to the logic control node, the first and second voltage generators configured to generate a positive voltage output at a positive voltage node and a negative voltage output at a negative voltage node; first and second multiplexer cells, coupled to the logic control node, configured to multiplex the positive voltage level received from the first or the second positive voltage node and the negative voltage level received from the first or the second negative voltage node to provide a multiplexed output; and an output node coupled to each of the first multiplexer cell and the second multiplexer cell configured to receive the multiplexed output to provide a biasing voltage range to at least one transistor having a back-gate terminal.
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公开(公告)号:US10347543B2
公开(公告)日:2019-07-09
申请号:US15810557
申请日:2017-11-13
Applicant: GLOBALFOUNDRIES Inc.
Inventor: Peter Baars , Rick Carter , Vikrant Chauhan , George Jonathan Kluth , Anurag Mittal , David Pritchard , Mahbub Rashed
IPC: H01L21/8238 , H01L27/092 , H01L29/417 , H01L27/12 , H01L29/49
Abstract: A method of forming contacts includes forming a plurality of transistor devices separated by shallow trench insulator regions, the transistor devices each comprising a semiconductor substrate, a buried insulator layer on the semiconductor bulk substrate, a semiconductor layer on the buried insulator layer, a high-k metal gate stack on the semiconductor layer and a gate electrode above the high-k metal gate stack, raised source/drain regions on the semiconductor layer, and a silicide contact layer above the raised source/drain regions and the gate electrode, providing an interlayer dielectric stack on the silicide contact layer and planarizing the interlayer dielectric stack, patterning a plurality of contacts through the interlayer dielectric stack onto the raised source/drain regions, and, for at least some of the contacts, patterning laterally extended contact regions above the contacts, the laterally extended contact regions extending over shallow trench insulator regions neighboring the corresponding raised source/drain regions.
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公开(公告)号:US10108771B2
公开(公告)日:2018-10-23
申请号:US15140183
申请日:2016-04-27
Applicant: GLOBALFOUNDRIES INC.
Inventor: Juhan Kim , Mahbub Rashed
IPC: H01L27/02 , G06F17/50 , H01L27/118
Abstract: At least one method, apparatus and system disclosed herein for forming a semiconductor device comprising a plurality of cells having metal features formed using triple patterning processes. An overall pattern layout is created for a first cell that is to be manufactured using a triple patterning process for forming a plurality of metal features on a metal layer. A first color metal feature is formed in the metal layer. The first color metal feature is associated with a first patterning process of the triple patterning process. A second color metal feature is formed in the metal layer. The second color metal feature is associated with a second patterning process of the triple patterning process. A third color metal feature is formed in the metal layer. The third color metal feature is associated with a third patterning process of the triple patterning process. At least one of the first, second, and third color metal features is re-colorable.
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