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    LOW IMPEDANCE OXIDE RESISTANT GROUNDED CAPACITOR FOR AN AIMD
    23.
    发明申请
    LOW IMPEDANCE OXIDE RESISTANT GROUNDED CAPACITOR FOR AN AIMD 有权
    用于AIMD的低阻抗氧化物接地电容器

    公开(公告)号：US20150343224A1

    公开(公告)日：2015-12-03

    申请号：US14826229

    申请日：2015-08-14

    Applicant: Greatbatch Ltd.

    Inventor： Jason Woods ,  Richard L. Brendel ,  Robert A. Stevenson ,  Christopher Michael Williams ,  Robert Naugler ,  Christine A. Frysz

    IPC: A61N1/375 ,  H02G15/013

    CPC classification number: A61N1/3754 ,  H01G2/02 ,  H01G4/228 ,  H01G4/35 ,  H01G4/40 ,  H01R13/7195 ,  H02G15/013 ,  H03H1/00 ,  H03H2001/0042 ,  H03H2001/0085

    Abstract: A hermetically sealed filtered feedthrough assembly for an AIMD includes an electrically conductive ferrule with an electrically conductive extension at least partially extending into the ferrule opening. An electrically non-conductive insulator hermetically seals the ferrule opening. An electrically conductive pathway is hermetically sealed and disposed through the insulator between a body fluid and device side. A filter capacitor is located on the device side. A first low impedance electrical coupling is between a first metallization of the filter capacitor and the pathway. A ground conductor is disposed through the filter capacitor in non-conductive relation with the at least one active and ground electrode plates, where the ground conductor is electrically coupled to the extension of the ferrule. An oxide-resistant metal addition is disposed on the device side and electrically couples the ground conductor to the second metallization of the filter capacitor.

    Abstract translation: 用于AIMD的气密密封的过滤馈通组件包括具有至少部分延伸到套圈开口中的导电延伸部的导电套圈。 非导电绝缘体气密地密封套圈开口。 导电通路密封并通过绝缘体设置在体液和器件侧之间。 滤波电容器位于器件侧。 第一低阻抗电耦合在滤波电容器的第一金属化和通路之间。 接地导体与所述至少一个有源和接地电极板以非导电关系设置穿过所述滤波电容器，其中所述接地导体电耦合到所述套圈的延伸部。 在器件侧设置耐氧化金属添加剂，并将接地导体电耦合到滤波电容器的第二金属化。

    Low impedance oxide resistant grounded capacitor for an AIMD
    24.
    发明授权
    Low impedance oxide resistant grounded capacitor for an AIMD 有权
    用于AIMD的低阻抗氧化物接地电容器

    公开(公告)号：US09108066B2

    公开(公告)日：2015-08-18

    申请号：US14202653

    申请日：2014-03-10

    Applicant: Greatbatch Ltd.

    Inventor： Jason Woods ,  Richard L. Brendel ,  Robert A. Stevenson ,  Christopher M. Williams ,  Robert Naugler ,  Christine A. Frysz

    IPC: A61N1/00 ,  A61N1/375 ,  H01G4/40 ,  H01R13/7195 ,  H03H1/00 ,  H01G4/35 ,  H01G2/02 ,  H01G4/228 ,  H03H7/01

    CPC classification number: A61N1/3754 ,  H01G2/02 ,  H01G4/228 ,  H01G4/35 ,  H01G4/40 ,  H01R13/7195 ,  H03H1/0007 ,  H03H7/1766 ,  H03H2001/0042 ,  H03H2001/0085

    Abstract: A hermetically sealed filtered feedthrough assembly for an AIMD includes an insulator hermetically sealed to a conductive ferrule or housing. A conductor is hermetically sealed and disposed through the insulator in non-conductive relation to the conductive ferrule or housing between a body fluid side and a device side. A feedthrough capacitor is disposed on the device side. A first low impedance electrical connection is between a first end metallization of the capacitor and the conductor. A second low impedance electrical connection is between a second end metallization of the capacitor and the ferrule or housing. The second low impedance electrical connection includes an oxide-resistant metal addition attached directly to the ferrule or housing and an electrical connection coupling the second end metallization electrically and physically directly to the oxide-resistant metal addition.

    Abstract translation: 用于AIMD的气密密封的过滤馈通组件包括密封到导电套圈或壳体的绝缘体。 导体被气密地密封并且通过绝缘体以非导电关系设置在导体套管或壳体之间，在体液侧和器件侧之间。 馈通电容器设置在器件侧。 第一低阻抗电连接在电容器的第一端金属化和导体之间。 第二低阻抗电连接在电容器的第二端金属化和套圈或壳体之间。 第二低阻抗电连接包括直接连接到套圈或壳体的耐氧化金属添加剂和将第二端金属化物电和物理直接耦合到耐氧化金属添加物的电连接。

    HEADER EMBEDDED FILTER FOR IMPLANTABLE MEDICAL DEVICE
    26.
    发明申请
    HEADER EMBEDDED FILTER FOR IMPLANTABLE MEDICAL DEVICE 审中-公开
    用于可植入医疗器械的HEADER嵌入式过滤器

    公开(公告)号：US20150116053A1

    公开(公告)日：2015-04-30

    申请号：US14065431

    申请日：2013-10-29

    Applicant: Greatbatch Ltd.

    Inventor： Robert A. Stevenson ,  Warren S. Dabney ,  Christine A. Frysz ,  Richard L. Brendel

    IPC: A61N1/08 ,  H03H7/01

    CPC classification number: A61N1/08 ,  A61N1/086 ,  A61N1/3718 ,  A61N1/3754 ,  H01F17/0006 ,  H01F17/02 ,  H01F17/04 ,  H01F2017/0073 ,  H01G4/12 ,  H01G4/28 ,  H01G4/30 ,  H01G4/35 ,  H01G4/40 ,  H03H1/00 ,  H03H7/0115 ,  H03H7/0161 ,  H03H7/38 ,  H03H2001/005

    Abstract: A header block is configured to be attachable to an implantable medical device. The header block includes a header block body and a connection port disposed in the header block body configured to receive an implantable lead. A conductor is disposed in the header block body electrically coupled to the connection port at a first end and connectable at a second end to the implantable medical device. An impeding device is electrically coupled in series along the length of the conductor and disposed within the header block body. The impeding device is configured to raise the high-frequency impedance of the conductor. The impeding device may include a bandstop filter or an L-C tank circuit.

    Abstract translation: 标题块被配置为可附接到可植入医疗装置。 标题块包括标题块主体和设置在头部块主体中的配置为接收可植入引线的连接端口。 导体被布置在头部块体中，第一端部电耦合到连接端口，并且在第二端处可连接到可植入医疗装置。 阻碍装置沿着导体的长度串联电耦合并设置在集管块体内。 阻碍装置被配置为提高导体的高频阻抗。 阻碍装置可以包括带阻滤波器或L-C槽电路。

    EMI Filtered Co-Connected Hermetic Feedthrough, Feedthrough Capacitor and Leadwire Assembly for an Active Implantable Medical Device
    27.
    发明申请
    EMI Filtered Co-Connected Hermetic Feedthrough, Feedthrough Capacitor and Leadwire Assembly for an Active Implantable Medical Device 有权
    电磁干扰过滤联合密封馈通，馈通电容器和有源可植入医疗设备的导线组件

    公开(公告)号：US20140036409A1

    公开(公告)日：2014-02-06

    申请号：US13743276

    申请日：2013-01-16

    Applicant: GREATBATCH LTD.

    Inventor： Robert A. Stevenson ,  Thomas Marzano ,  Keith W. Seitz ,  Steven W. Winn ,  Christine A. Frysz ,  Richard L. Brendel ,  Jason Woods ,  Dominick J. Frustaci ,  Xiaohong Tang ,  William C. Thiebolt

    IPC: H01G4/35

    CPC classification number: A61N1/3754 ,  A61N1/05 ,  A61N1/08 ,  A61N1/372 ,  A61N1/375 ,  B23K35/3013 ,  C22C29/12 ,  H01G2/103 ,  H01G4/005 ,  H01G4/12 ,  H01G4/30 ,  H01G4/35 ,  H01G4/40 ,  H01R43/00 ,  H02G3/22 ,  Y10T156/1052

    Abstract: A co-connected hermetic feedthrough, feedthrough capacitor, and leadwire assembly includes a dielectric substrate with a via hole disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via forming a hermetic seal and is electrically conductive between the body fluid side and the device side. A feedthrough capacitor is attached to the dielectric substrate and includes a capacitor dielectric substrate, an unfilled capacitor via hole including an inner metallization, a set of capacitor active electrode plates electrically coupled to the inner metallization, an outer metallization disposed and a set of capacitor ground electrode plates electrically coupled to the outer metallization. A conductive leadwire is disposed within the unfilled capacitor via hole. An electrical joint connects the conductive fill, the capacitor inner metallization along with the capacitor active electrode plates and the conductive leadwire.

    Abstract translation: 一个共同连接的密封馈通电源，馈通电容器和引线组件包括具有通孔的电介质基片，其通过介电基片从体液侧设置到器件侧。 导电填料设置在通孔内形成气密密封，并且在体液侧和装置侧之间导电。 馈通电容器附接到电介质基板，并且包括电容器电介质基板，包括内部金属化的未填充的电容器通孔，电耦合到内部金属化的一组电容器有源电极板，设置的外部金属化和一组电容器接地 电极板电耦合到外部金属化。 导电引线设置在未填充的电容器通孔内。 电接头将导电填充物，电容器内部金属化以及电容器有源电极板和导电引线连接。

    EMI FILTERS UTILIZING COUNTER-BORED CAPACITORS TO FACILITATE SOLDER RE-FLOW
    28.
    发明申请
    EMI FILTERS UTILIZING COUNTER-BORED CAPACITORS TO FACILITATE SOLDER RE-FLOW 有权
    电磁过滤器利用计数器电容器来帮助焊接机回流

    公开(公告)号：US20130286537A1

    公开(公告)日：2013-10-31

    申请号：US13926255

    申请日：2013-06-25

    Applicant: Greatbatch Ltd.

    Inventor： Richard L. Brendel ,  Jason Woods ,  Jose Luis Lorente-Adame ,  Robert A. Stevenson ,  John E. Roberts ,  Buehl E. Truex

    IPC: H01G4/35

    CPC classification number: H01G4/35 ,  A61N1/3754 ,  H01G4/228 ,  H01G4/40 ,  H01G5/00 ,  H01G5/01 ,  H01G5/011 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/49002

    Abstract: An EMI filtered terminal assembly including at least one conductive terminal pin, a feedthrough capacitor, and a counter-bore associated with a passageway through the capacitor is described. Preferably, the feedthrough capacitor having counter-drilled or counter-bored holes on its top side is first bonded to a hermetic insulator. The counter-drilled or counter-bore holes in the capacitor provide greater volume for the electro-mechanical attachment between the capacitor and the terminal pin or lead wire, permitting robotic dispensing of, for example, thermal-setting conductive adhesive.

    Abstract translation: 描述了包括至少一个导电端子引脚，馈通电容器和与通过电容器的通道相关联的反向孔的EMI滤波端子组件。 优选地，其上侧具有相对钻孔或反钻孔的穿通电容器首先被结合到密封绝缘体。 电容器中的反钻孔或反孔钻孔为电容器和端子销或引线之间的机电连接提供了更大的体积，允许机器人分配例如热固性导电粘合剂。

    Ground electrical path from an MLCC filter capacitor on an AIMD circuit board to the ferrule of a hermetic feedthrough
    29.
    发明授权
    Ground electrical path from an MLCC filter capacitor on an AIMD circuit board to the ferrule of a hermetic feedthrough 有权

    公开(公告)号：US11013928B2

    公开(公告)日：2021-05-25

    申请号：US16045035

    申请日：2018-07-25

    Applicant: Greatbatch Ltd.

    Inventor： Robert A. Stevenson ,  Christine A. Frysz ,  Richard L. Brendel

    IPC: A61N1/08 ,  A61N1/37 ,  A61N1/375 ,  H01G4/35 ,  H05K1/18 ,  H01G4/06 ,  H01G4/40 ,  H01R13/7195 ,  H03H1/00 ,  H03H7/01 ,  H05K9/00 ,  H05K5/00

    Abstract: An EMI/energy dissipating filter for an active implantable medical device (AIMD) is described. The filter comprises a first gold braze hermetically sealing the insulator to a ferrule that is configured to be mounted in an opening in a housing for the AIMD. A lead wire is hermetically sealed in a passageway through the insulator by a second gold braze. A circuit board substrate is disposed adjacent the insulator. A two-terminal chip capacitor disposed adjacent to the circuit board has an active end metallization that is electrically connected to the active electrode plates and a ground end metallization that is electrically connected to the at least one ground electrode plates of the chip capacitor. There is a ground path electrically extending between the ground end metallization of the chip capacitor and the ferrule. The ground path comprises at least a first electrical connection material connected directly to the first gold braze, and at least an internal ground plate disposed within the circuit board substrate with the internal ground plate being electrically connected to both the first electrical connection material and the ground end metallization of the chip capacitor. An active path electrically extends between the active end metallization of the chip capacitor and the lead wire.

    Ground electrical path from an MLCC filter capacitor on an AIMD circuit board to the ferrule of a hermetic feedthrough
    30.
    发明授权
    Ground electrical path from an MLCC filter capacitor on an AIMD circuit board to the ferrule of a hermetic feedthrough 有权

    公开(公告)号：US10857369B2

    公开(公告)日：2020-12-08

    申请号：US16364953

    申请日：2019-03-26

    Applicant: Greatbatch Ltd.

    Inventor： Robert A. Stevenson ,  Christine A. Frysz ,  Richard L. Brendel

    IPC: A61N1/08 ,  H05K9/00 ,  A61N1/37 ,  A61N1/375 ,  H05K5/00 ,  H05K1/18 ,  H03H7/01 ,  H01R13/7195 ,  H01G4/40 ,  H01G4/35 ,  H01G4/06 ,  H03H1/00

    Abstract: An EMI/energy dissipating filter for an active implantable medical device (AIMD) is described. The filter comprises a first gold braze hermetically sealing the insulator to a ferrule that is configured to be mounted in an opening in a housing for the AIMD. A lead wire is hermetically sealed in a passageway through the insulator by a second gold braze. A circuit board substrate is disposed adjacent the insulator. A two-terminal chip capacitor disposed adjacent to the circuit board has an active end metallization that is electrically connected to the active electrode plates and a ground end metallization that is electrically connected to the at least one ground electrode plates of the chip capacitor. There is a ground path electrically extending between the ground end metallization of the chip capacitor and the ferrule. The ground path comprises at least a first electrical connection material connected directly to the first gold braze, and at least an internal ground plate disposed within the circuit board substrate with the internal ground plate being electrically connected to both the first electrical connection material and the ground end metallization of the chip capacitor. An active path electrically extends between the active end metallization of the chip capacitor and the lead wire.

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