LOW IMPEDANCE OXIDE RESISTANT GROUNDED CAPACITOR FOR AN AIMD
    3.
    发明申请
    LOW IMPEDANCE OXIDE RESISTANT GROUNDED CAPACITOR FOR AN AIMD 有权
    用于AIMD的低阻抗氧化物接地电容器

    公开(公告)号:US20140194964A1

    公开(公告)日:2014-07-10

    申请号:US14202653

    申请日:2014-03-10

    Abstract: A hermetically sealed filtered feedthrough assembly for an AIMD includes an insulator hermetically sealed to a conductive ferrule or housing. A conductor is hermetically sealed and disposed through the insulator in non-conductive relation to the conductive ferrule or housing between a body fluid side and a device side. A feedthrough capacitor is disposed on the device side. A first low impedance electrical connection is between a first end metallization of the capacitor and the conductor. A second low impedance electrical connection is between a second end metallization of the capacitor and the ferrule or housing. The second low impedance electrical connection includes an oxide-resistant metal addition attached directly to the ferrule or housing and an electrical connection coupling the second end metallization electrically and physically directly to the oxide-resistant metal addition.

    Abstract translation: 用于AIMD的气密密封的过滤馈通组件包括密封到导电套圈或壳体的绝缘体。 导体被气密地密封并且通过绝缘体以非导电关系设置在导体套管或壳体之间,在体液侧和器件侧之间。 馈通电容器设置在器件侧。 第一低阻抗电连接在电容器的第一端金属化和导体之间。 第二低阻抗电连接在电容器的第二端金属化和套圈或壳体之间。 第二低阻抗电连接包括直接连接到套圈或壳体的耐氧化金属添加剂和将第二端金属化物电和物理直接耦合到耐氧化金属添加物的电连接。

    Low impedance oxide resistant grounded capacitor for an AIMD
    5.
    发明授权
    Low impedance oxide resistant grounded capacitor for an AIMD 有权
    用于AIMD的低阻抗氧化物接地电容器

    公开(公告)号:US09108066B2

    公开(公告)日:2015-08-18

    申请号:US14202653

    申请日:2014-03-10

    Abstract: A hermetically sealed filtered feedthrough assembly for an AIMD includes an insulator hermetically sealed to a conductive ferrule or housing. A conductor is hermetically sealed and disposed through the insulator in non-conductive relation to the conductive ferrule or housing between a body fluid side and a device side. A feedthrough capacitor is disposed on the device side. A first low impedance electrical connection is between a first end metallization of the capacitor and the conductor. A second low impedance electrical connection is between a second end metallization of the capacitor and the ferrule or housing. The second low impedance electrical connection includes an oxide-resistant metal addition attached directly to the ferrule or housing and an electrical connection coupling the second end metallization electrically and physically directly to the oxide-resistant metal addition.

    Abstract translation: 用于AIMD的气密密封的过滤馈通组件包括密封到导电套圈或壳体的绝缘体。 导体被气密地密封并且通过绝缘体以非导电关系设置在导体套管或壳体之间,在体液侧和器件侧之间。 馈通电容器设置在器件侧。 第一低阻抗电连接在电容器的第一端金属化和导体之间。 第二低阻抗电连接在电容器的第二端金属化和套圈或壳体之间。 第二低阻抗电连接包括直接连接到套圈或壳体的耐氧化金属添加剂和将第二端金属化物电和物理直接耦合到耐氧化金属添加物的电连接。

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