公开(公告)号：US10857368B2

公开(公告)日：2020-12-08

申请号：US15936495

申请日：2018-03-27

Applicant: Greatbatch Ltd.

Inventor： Keith W. Seitz ,  Xiaohong Tang ,  William C. Thiebolt ,  Jonathan Calamel ,  Thomas Shi ,  Thomas Marzano

IPC: A61N1/375 ,  H05K5/00 ,  H05K1/03 ,  H05K3/00 ,  H01L23/15 ,  C03C8/14 ,  H01L23/00 ,  H01L23/10

Abstract: Disclosed herein are electrically conductive and hermetic vias disposed within an insulator substrate of a feedthrough assembly and methods for making and using the same. Such aspects of the present invention consequently provide for the miniaturization of feedthrough assemblies inasmuch as the feedthrough components of the present invention are capable of supporting very small and hermetic conductively filled via holes in the absence of additional components, such as, for example, terminal pins, leadwires, and the like.

公开(公告)号：US10420949B2

公开(公告)日：2019-09-24

申请号：US16101639

申请日：2018-08-13

Applicant: Greatbatch Ltd.

Inventor： Keith W. Seitz ,  Thomas Marzano ,  Robert A. Stevenson ,  Christine A. Frysz ,  Dallas J. Rensel ,  Brian P. Hohl

IPC: A61N1/375 ,  A61N1/05 ,  H01G4/40 ,  B23K35/30 ,  A61N1/08 ,  H01R43/00 ,  H01G4/35 ,  C22C29/12 ,  H01G4/12 ,  H01G2/10 ,  H01G4/005 ,  H02G3/22 ,  H01G4/30 ,  A61N1/372

Abstract: A method of manufacturing a feedthrough dielectric body for an active implantable medical device includes the steps of forming a ceramic body in a green state, or, stacking discrete layers of ceramic in a green state upon one another and laminating together. The ceramic body has a first side opposite a second side. At least one via hole is formed straight through the ceramic body extending between the first and second sides. At least one via hole is filled with a conductive paste. The ceramic body and the conductive paste are then dried. The ceramic body and the conductive paste are isostatically pressed at above 1000 psi to remove voids and to form a closer interface for sintering. The ceramic body and the conductive paste are sintered together to form the feedthrough dielectric body. The feedthrough dielectric body is hermetically sealed to a ferrule.

公开(公告)号：US20190244729A1

公开(公告)日：2019-08-08

申请号：US16362862

申请日：2019-03-25

Applicant: Greatbatch Ltd.

Inventor： Keith W. Seitz ,  Dallas J. Rensel ,  Brian P. Hohl ,  Jonathan Calamel ,  Xiaohong Tang ,  Robert A. Stevenson ,  Christine A. Frysz ,  Thomas Marzano ,  Jason Woods ,  Richard L. Brendel

IPC: H01B17/30 ,  B23K1/00 ,  H01B19/02 ,  B23K1/008 ,  B23K1/19 ,  B23K26/32 ,  A61N1/375 ,  C04B41/00 ,  C04B41/51 ,  C04B41/88 ,  C04B41/45 ,  B23K26/21

CPC classification number: H01B17/30 ,  A61N1/3754 ,  B22F7/04 ,  B22F7/08 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/19 ,  B23K26/21 ,  B23K26/32 ,  B23K2101/36 ,  B23K2103/14 ,  C04B41/0072 ,  C04B41/4578 ,  C04B41/5122 ,  C04B41/5177 ,  C04B41/5194 ,  C04B41/88 ,  H01B19/02

Abstract: A method for manufacturing a feedthrough dielectric body for an active implantable medical device includes the steps of first forming a ceramic reinforced metal composite (CRMC) paste by mixing platinum with a ceramic material to form a CRMC material, subjecting the CRMC material to a first sintering step to thereby form a sintered CRMC material, ball-milling or grinding the sintered CRMC material to form a powdered CRMC material; and then mixing the powdered CRMC material with a solvent to form the CRMC paste. The method further includes forming an alumina ceramic body in a green state, forming at least one via hole through the alumina ceramic body, filling the via hole with the CRMC paste, drying the ceramic body including the CRMC paste to form a first CRMC material filling the via hole, forming a second via hole through the first CRMC material, providing a metal core in the second via hole, and subjecting the ceramic body including the first CRMC material and the metal core to a second sintering step to thereby form the dielectric body. The dielectric body is then sealed in a ferrule opening to form a feedthrough.

公开(公告)号：US10249415B2

公开(公告)日：2019-04-02

申请号：US15863194

申请日：2018-01-05

Applicant: Greatbatch Ltd.

Inventor： Keith W. Seitz ,  Dallas J. Rensel ,  Brian P. Hohl ,  Jonathan Calamel ,  Xiaohong Tang ,  Robert A. Stevenson ,  Christine A. Frysz ,  Thomas Marzano ,  Jason Woods ,  Richard L. Brendel

IPC: A61N1/37 ,  B23K1/00 ,  B23K35/00 ,  C04B41/45 ,  H01B17/30 ,  A61N1/375 ,  C04B41/51 ,  C04B41/88 ,  H01B19/02 ,  C04B41/00 ,  B23K1/008 ,  B23K1/19 ,  B23K26/32 ,  B23K26/21 ,  B22F7/04 ,  B23K101/36 ,  B23K103/14

Abstract: A method of manufacturing a feedthrough dielectric body for an active implantable medical device includes the steps of: a) forming an alumina ceramic body in a green state, or, stacking upon one another discrete layers of alumina ceramic in a green state and pressing; b) forming at least one via hole straight through the alumina ceramic body; c) filling the at least one via hole with a ceramic reinforced metal composite paste; d) drying the alumina ceramic body and the ceramic reinforced metal composite paste; e) forming a second hole straight through the ceramic reinforced metal composite paste being smaller in diameter in comparison to the at least one via hole; f) filling the second hole with a substantially pure metal paste; g) sintering the alumina ceramic body, the ceramic reinforced metal composite paste and the metal paste; and h) hermetically sealing the feedthrough dielectric body to a ferrule.

公开(公告)号：US20180304084A1

公开(公告)日：2018-10-25

申请号：US16004569

申请日：2018-06-11

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Christine A. Frysz ,  Keith W. Seitz ,  Thomas Marzano ,  Marc Gregory Martino

IPC: A61N1/375 ,  H02G3/22 ,  H01R43/00 ,  A61N1/05 ,  A61N1/08 ,  H01G4/40 ,  H01G4/35 ,  H01G4/30 ,  H01G4/12 ,  H01G4/005 ,  H01G2/10 ,  C22C29/12 ,  B23K35/30 ,  A61N1/372

CPC classification number: A61N1/3754 ,  A61N1/05 ,  A61N1/08 ,  A61N1/372 ,  A61N1/375 ,  B23K35/3013 ,  C22C29/12 ,  H01G2/103 ,  H01G4/005 ,  H01G4/12 ,  H01G4/30 ,  H01G4/35 ,  H01G4/40 ,  H01R43/00 ,  H02G3/22 ,  Y10T156/1052

Abstract: A hermetically sealed filtered feedthrough assembly attachable to an AIMD includes an insulator hermetically sealing a ferrule opening of an electrically conductive ferrule with a gold braze. A co-fired and electrically conductive sintered paste is disposed within and hermetically seals at least one via hole extending in the insulator. At least one capacitor is disposed on the device side. An active electrical connection electrically connects a capacitor active metallization and the sintered paste. A ground electrical connection electrically connects the gold braze to a capacitor ground metallization, wherein at least a portion of the ground electrical connection physically contacts the gold braze. The dielectric of the capacitor may be less than 1000 k. The ferrule may include an integrally formed peninsula portion extending into the ferrule opening spatially aligned with a ground passageway and metallization of an internally grounded feedthrough capacitor. The sintered paste may be of substantially pure platinum.

公开(公告)号：US20180272137A1

公开(公告)日：2018-09-27

申请号：US15936495

申请日：2018-03-27

Applicant: Greatbatch Ltd.

Inventor： Keith W. Seitz ,  Xiaohong Tang ,  William C. Thiebolt ,  Jonathan Calamel ,  Thomas Shi ,  Thomas Marzano

IPC: A61N1/375 ,  H01L23/10 ,  H05K5/00 ,  H05K1/03 ,  H05K3/00 ,  H01L23/15 ,  C03C8/14 ,  H01L23/00

CPC classification number: A61N1/3754 ,  C03C8/14 ,  C04B2237/343 ,  C04B2237/348 ,  C04B2237/361 ,  C04B2237/363 ,  C04B2237/365 ,  C04B2237/403 ,  C04B2237/408 ,  H01L23/10 ,  H01L23/15 ,  H01L24/26 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K3/0047 ,  H05K5/0095

Abstract: Disclosed herein are electrically conductive and hermetic vias disposed within an insulator substrate of a feedthrough assembly and methods for making and using the same. Such aspects of the present invention consequently provide for the miniaturization of feedthrough assemblies inasmuch as the feedthrough components of the present invention are capable of supporting very small and hermetic conductively filled via holes in the absence of additional components, such as, for example, terminal pins, leadwires, and the like.

公开(公告)号：US20180197661A1

公开(公告)日：2018-07-12

申请号：US15863194

申请日：2018-01-05

Applicant: Greatbatch Ltd.

Inventor： Keith W. Seitz ,  Dallas J. Rensel ,  Brian P. Hohl ,  Jonathan Calamel ,  Xiaohong Tang ,  Robert A. Stevenson ,  Christine A. Frysz ,  Thomas Marzano ,  Jason Woods ,  Richard L. Brendel

IPC: H01B17/30 ,  A61N1/375 ,  C04B41/51 ,  C04B41/45 ,  C04B41/00 ,  C04B41/88 ,  H01B19/02

CPC classification number: H01B17/30 ,  A61N1/3754 ,  B22F7/04 ,  B22F7/08 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/19 ,  B23K26/21 ,  B23K26/32 ,  B23K2101/36 ,  B23K2103/14 ,  C04B41/0072 ,  C04B41/4578 ,  C04B41/5122 ,  C04B41/5177 ,  C04B41/5194 ,  C04B41/88 ,  H01B19/02

Abstract: A method of manufacturing a feedthrough dielectric body for an active implantable medical device includes the steps of: a) forming an alumina ceramic body in a green state, or, stacking upon one another discrete layers of alumina ceramic in a green state and pressing; b) forming at least one via hole straight through the alumina ceramic body; c) filling the at least one via hole with a ceramic reinforced metal composite paste; d) drying the alumina ceramic body and the ceramic reinforced metal composite paste; e) forming a second hole straight through the ceramic reinforced metal composite paste being smaller in diameter in comparison to the at least one via hole; f) filling the second hole with a substantially pure metal paste; g) sintering the alumina ceramic body, the ceramic reinforced metal composite paste and the metal paste; and h) hermetically sealing the feedthrough dielectric body to a ferrule.

公开(公告)号：US20170291034A1

公开(公告)日：2017-10-12

申请号：US15628741

申请日：2017-06-21

Applicant: Greatbatch Ltd.

Inventor： Thomas Marzano ,  Keith W. Seitz ,  Michael F. Scalise

IPC: A61N1/375 ,  H01R13/719 ,  H01R13/52 ,  H01G4/35 ,  H01R13/426

CPC classification number: H01R13/5224 ,  A61N1/3754 ,  H01G4/35 ,  H01R13/426 ,  H01R13/521 ,  H01R13/719 ,  Y10T29/49204

Abstract: A feedthrough filter capacitor assembly comprising a terminal pin connector is described. The terminal pin connector is designed to facilitate an electrical connection between the terminal pin comprising a multitude of compositions to a circuit board of an implantable medical device. The terminal pin connector comprises a clip portion positioned within a connector housing. The connector clip mechanically attaches to the terminal pin of the feedthrough with at least one prong and an exterior surface of the connector housing electrically contacts the circuit board, creating an electrical connection therebetween. The connector housing comprises a material that is conducive to a weld or solder attachment process to the circuit board. The feedthrough filter capacitor assembly is particularly useful for incorporation into implantable medical devices such as cardiac pacemakers, cardioverter defibrillators, and the like, to decouple and shield internal electronic components of the medical device from undesirable electromagnetic interference (EMI) signals.

公开(公告)号：US09492659B2

公开(公告)日：2016-11-15

申请号：US14182569

申请日：2014-02-18

Applicant: Greatbatch Ltd.

Inventor： Xiaohong Tang ,  William C. Thiebolt ,  Christine A. Frysz ,  Keith W. Seitz ,  Robert A. Stevenson ,  Richard L. Brendel ,  Thomas Marzano ,  Jason Woods ,  Dominick J. Frustaci ,  Steven W. Winn

IPC: H01R43/00 ,  A61N1/08 ,  A61N1/05 ,  H01G4/35 ,  H01G2/10 ,  H01G4/005 ,  H01G4/12 ,  H01G4/40 ,  H02G3/22 ,  A61N1/372 ,  A61N1/375 ,  C22C29/12

CPC classification number: A61N1/3754 ,  A61N1/05 ,  A61N1/08 ,  A61N1/372 ,  A61N1/375 ,  B23K35/3013 ,  C22C29/12 ,  H01G2/103 ,  H01G4/005 ,  H01G4/12 ,  H01G4/30 ,  H01G4/35 ,  H01G4/40 ,  H01R43/00 ,  H02G3/22 ,  Y10T156/1052

Abstract: A co-fired hermetically sealed feedthrough is attachable to an active implantable medical device. The feedthrough comprises an alumina dielectric substrate comprising at least 96 or 99% alumina. A via hole is disposed through the alumina dielectric substrate from a body fluid side to a device side. A substantially closed pore, fritless and substantially pure platinum fill is disposed within the via hole forming a platinum filled via electrically conductive between the body fluid side and the device side. A hermetic seal is between the platinum fill and the alumina dielectric substrate, wherein the hermetic seal comprises a tortuous and mutually conformal interface between the alumina dielectric substrate and the platinum fill.

Abstract translation: 共同燃烧的密封馈通可附接到主动植入式医疗装置。 馈通包括包含至少96或99％的氧化铝的氧化铝介电衬底。 通孔穿过氧化铝电介质基板从体液侧设置到器件侧。 在通孔内设置基本封闭的无孔和基本上纯的铂填充物，其在体液侧和装置侧之间形成通过导电的铂填充通孔。 铂填充物和氧化铝电介质基底之间的气密密封，其中气密密封包括在氧化铝电介质基底和铂填充物之间的曲折且相互共形的界面。

公开(公告)号：US20160263373A1

公开(公告)日：2016-09-15

申请号：US15163241

申请日：2016-05-24

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Robert Shawn Johnson ,  Warren S. Dabney ,  Thomas Marzano ,  Richard L. Brendel ,  Christopher Michael Williams ,  Holly Noelle Moschiano ,  Keith W. Seitz ,  John E. Roberts

IPC: A61N1/08 ,  A61N1/375 ,  H01G4/35 ,  H01G4/30 ,  H01G4/005 ,  A61N1/37 ,  H01G4/12

CPC classification number: A61N1/08 ,  A61N1/086 ,  A61N1/3718 ,  A61N1/3754 ,  A61N1/3758 ,  H01G4/005 ,  H01G4/12 ,  H01G4/30 ,  H01G4/35 ,  H03H1/0007

Abstract: An AIMD includes a conductive housing, an electrically conductive ferrule with an insulator hermetically sealing the ferrule opening. A conductive pathway is hermetically sealed and disposed through the insulator. A filter capacitor is disposed on a circuit board within the housing and has a dielectric body supporting at least two active and two ground electrode plates interleaved, wherein the at least two active electrode plates are electrically connected to the conductive pathway on the device side, and the at least two ground electrode plates are electrically coupled to either the ferrule and/or the conductive housing. The dielectric body has a dielectric constant less than 1000 and a capacitance of between 10 and 20,000 picofarads. The filter capacitor is configured for EMI filtering of MRI high RF pulsed power by a low ESR, wherein the ESR of the filter capacitor at an MRI RF pulsed frequency or range of frequencies is less than 2.0 ohms.

Abstract translation: AIMD包括导电壳体，具有绝缘体的导电套圈密封密封套圈开口。 导电通路密封并通过绝缘体设置。 滤波电容器设置在壳体内的电路板上，并且具有支撑交错的至少两个有源和两个接地电极板的电介质体，其中至少两个有源电极板电连接到器件侧的导电路径，以及 所述至少两个接地电极板电耦合到套圈和/或导电壳体。 电介质体的介电常数小于1000，电容为10至20,000皮​​法。 滤波电容器被配置为通过低ESR对MRI高RF脉冲功率进行EMI滤波，其中以RF射频脉冲频率或频率范围的滤波电容器的ESR小于2.0欧姆。