公开(公告)号：USD821902S1

公开(公告)日：2018-07-03

申请号：US35502890

申请日：2016-10-25

Applicant: HAMAMATSU PHOTONICS K.K.

Designer： Masaki Hirose ,  Katsumi Shibayama ,  Takashi Kasahara ,  Toshimitsu Kawai ,  Hiroki Oyama ,  Yumi Teramachi ,  Takafumi Yokino ,  Katsuhiko Kato

公开(公告)号：USD821898S1

公开(公告)日：2018-07-03

申请号：US35502860

申请日：2016-10-25

Applicant: HAMAMATSU PHOTONICS K.K.

Designer： Masaki Hirose ,  Katsumi Shibayama ,  Takashi Kasahara ,  Toshimitsu Kawai ,  Hiroki Oyama ,  Yumi Teramachi ,  Takafumi Yokino ,  Katsuhiko Kato

公开(公告)号：US09851305B2

公开(公告)日：2017-12-26

申请号：US14780755

申请日：2014-02-07

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Masashi Ito ,  Katsumi Shibayama ,  Kazuto Ofuji ,  Hiroki Oyama ,  Yoshihiro Maruyama

IPC: G01N21/01 ,  G01N21/65 ,  B01L9/00 ,  G02B21/34

CPC classification number: G01N21/658 ,  B01L9/52 ,  B01L2200/18 ,  B01L2300/041 ,  B01L2300/0858 ,  G02B21/34

Abstract: A SERS unit 1A comprises a SERS element 2 having a substrate 21 and an optical function part 20 formed on the substrate 21, the optical function part 20 for generating surface-enhanced Raman scattering; a transportation board 3 supporting the SERS element 2 during transportation, the SERS element 2 being removed from the transportation board 3 upon measurement; and a holding part 4 having a pinching part 41 pinching the SERS element 2 in cooperation with the transportation board 3, and detachably holding the SERS element 2 in the transportation board 3.

公开(公告)号：USD750799S1

公开(公告)日：2016-03-01

申请号：US29528795

申请日：2015-06-01

Applicant: HAMAMATSU PHOTONICS K.K.

Designer： Masashi Ito ,  Katsumi Shibayama ,  Kazuto Ofuji ,  Hiroki Oyama ,  Yoshihiro Maruyama

公开(公告)号：USD739954S1

公开(公告)日：2015-09-29

申请号：US29477946

申请日：2013-12-30

Applicant: HAMAMATSU PHOTONICS K.K.

Designer： Masashi Ito ,  Katsumi Shibayama ,  Kazuto Ofuji ,  Hiroki Oyama ,  Yoshihiro Maruyama

公开(公告)号：US20250052612A1

公开(公告)日：2025-02-13

申请号：US18931815

申请日：2024-10-30

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takashi Kasahara ,  Katsumi Shibayama ,  Kei Tabata ,  Masaki Hirose ,  Hiroki Oyama ,  Yumi Kuramoto

IPC: G01J3/26 ,  G01J3/02 ,  G01J3/45 ,  G02B5/28 ,  G02B26/00

Abstract: A light detection device of the present invention includes: a wiring board; a first support part disposed on a mounting surface of the wiring board; a Fabry-Perot interference filter having a first mirror part and a second mirror part between which a distance is variable and having an outer edge portion disposed in a first support region of the first support part; a light detector disposed on the mounting surface to face the first mirror part and the second mirror part on one side of the first support part; and a temperature detector disposed on the mounting surface, wherein the temperature detector is disposed on the mounting surface such that at least a part of the temperature detector overlaps a part of the Fabry-Perot interference filter when seen in a first direction perpendicular to the mounting surface and such that at least a part of the temperature detector overlaps a part of the first support part when seen in a second direction in which the first support part and the light detector are aligned with each other, and wherein a first distance between the temperature detector and the first support part in the second direction is smaller than a first width of the first support region in the second direction.

公开(公告)号：US12169143B2

公开(公告)日：2024-12-17

申请号：US18223209

申请日：2023-07-18

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takashi Kasahara ,  Katsumi Shibayama ,  Kei Tabata ,  Masaki Hirose ,  Hiroki Oyama ,  Yumi Kuramoto

IPC: G01J3/26 ,  G01J3/02 ,  G01J3/45 ,  G02B5/28 ,  G02B26/00

Abstract: A light detection device of the present invention includes: a wiring board; a first support part disposed on a mounting surface of the wiring board; a Fabry-Perot interference filter having a first mirror part and a second mirror part between which a distance is variable and having an outer edge portion disposed in a first support region of the first support part; a light detector disposed on the mounting surface to face the first mirror part and the second mirror part on one side of the first support part; and a temperature detector disposed on the mounting surface, wherein the temperature detector is disposed on the mounting surface such that at least a part of the temperature detector overlaps a part of the Fabry-Perot interference filter when seen in a first direction perpendicular to the mounting surface and such that at least a part of the temperature detector overlaps a part of the first support part when seen in a second direction in which the first support part and the light detector are aligned with each other, and wherein a first distance between the temperature detector and the first support part in the second direction is smaller than a first width of the first support region in the second direction.

公开(公告)号：US11609420B2

公开(公告)日：2023-03-21

申请号：US17861721

申请日：2022-07-11

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Toshimitsu Kawai ,  Katsumi Shibayama ,  Takashi Kasahara ,  Masaki Hirose ,  Hiroki Oyama ,  Yumi Kuramoto

IPC: G02B26/00

Abstract: A wafer includes a substrate layer, a first mirror layer having a plurality of two-dimensionally arranged first mirror portions, and a second mirror layer having a plurality of two-dimensionally arranged second mirror portions. A plurality of Fabry-Perot interference filter portions are formed in an effective area, in each of the plurality of Fabry-Perot interference filter portions a gap is formed between the first mirror portion and the second mirror portion. A plurality of dummy filter portions are formed in a dummy area disposed along an outer edge of the substrate layer and surrounding the effective area, in each of the plurality of dummy filter portions an intermediate layer is provided between the first mirror portion and the second mirror portion. At least the second mirror portion is surrounded by the first groove in each of the plurality of Fabry-Perot interference filter portions and the plurality of dummy filter portions.

公开(公告)号：US11448869B2

公开(公告)日：2022-09-20

申请号：US16765547

申请日：2018-11-09

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Toshimitsu Kawai ,  Katsumi Shibayama ,  Takashi Kasahara ,  Masaki Hirose ,  Hiroki Oyama ,  Yumi Kuramoto

IPC: G02B26/00

Abstract: A wafer includes a substrate layer, a first mirror layer having a plurality of two-dimensionally arranged first mirror portions, and a second mirror layer having a plurality of two-dimensionally arranged second mirror portions. A plurality of Fabry-Perot interference filter portions are formed in an effective area, in each of the plurality of Fabry-Perot interference filter portions a gap is formed between the first mirror portion and the second mirror portion. A plurality of dummy filter portions are formed in a dummy area disposed along an outer edge of the substrate layer and surrounding the effective area, in each of the plurality of dummy filter portions an intermediate layer is provided between the first mirror portion and the second mirror portion. At least the second mirror portion is surrounded by the first groove in each of the plurality of Fabry-Perot interference filter portions and the plurality of dummy filter portions.

公开(公告)号：US10908022B2

公开(公告)日：2021-02-02

申请号：US16065856

申请日：2017-05-01

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takashi Kasahara ,  Katsumi Shibayama ,  Masaki Hirose ,  Toshimitsu Kawai ,  Hiroki Oyama ,  Yumi Kuramoto

IPC: G01J3/26 ,  B23K26/53 ,  B23K26/00 ,  B23K26/064 ,  B81B3/00 ,  B81C1/00 ,  G01J3/02 ,  G02B5/28 ,  G02B26/00 ,  B23K103/00 ,  B23K101/40 ,  B23K26/06

Abstract: A method of manufacturing a Fabry-Perot interference filter includes a forming step of forming a first thinned region, a first mirror layer, a sacrificial layer, and a second mirror layer are formed on a first main surface of a wafer, and the first thinned region in which at least one of the first mirror layer, the sacrificial layer, and the second mirror layer is partially thinned along each of a plurality of lines is formed; a cutting step of cutting the wafer into a plurality of substrates along each of the plurality of lines by forming a modified region within the wafer along each of the plurality of lines through irradiation of a laser light, after the forming step; and a removing step of removing a portion from the sacrificial layer through etching, between the forming step and the cutting step or after the cutting step.