公开(公告)号：US20220344239A1

公开(公告)日：2022-10-27

申请号：US17240688

申请日：2021-04-26

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Harvey J. Lunsman ,  Ernesto Ferrer ,  Brady Dulian ,  Steven Dean

IPC: H01L23/373 ,  H05K1/02

Abstract: Examples described herein relate to a cooling assembly. In some examples, the cooling assembly includes a cooling component and a thermal gap pad disposed in thermal contact with the cooling component. The thermal gap pad includes thermally conductive fabric that is curved at a plurality of locations along one or both of its length or its breadth, wherein a first side of the thermal gap pad is disposed in thermal contact with the cooling component and a second side of the thermal gap pad is disposable in thermal contact with a heat generating component. Certain examples described herein also relate to an electronic circuit module having the cooling assembly.

公开(公告)号：US20220253118A1

公开(公告)日：2022-08-11

申请号：US17656684

申请日：2022-03-28

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Torsten Wilde ,  Andy Warner ,  Steven Dean ,  Steven Martin ,  Pat Donlin

IPC: G06F1/3203 ,  G06F1/30 ,  H04L41/0833 ,  G06Q50/06 ,  G06F9/50

Abstract: Systems and methods described herein make previously stranded power capacity (power that is provisioned for a data center according to a computing system's nameplate power consumption but is currently not useable) available to the data center. Systems described herein generate empirical power profiles that specify expected upper bounds for the power consumption levels that applications trigger. Using the upper bounds for application power-consumption levels, a computing system described herein can reliably release part of its provisioned nameplate power for other systems or data center consumers, reducing the amount of stranded power in a data center. The method described herein avoids performance penalties for most jobs by using sensor measurements made at a rapid rate explained herein to ensure that a system power cap based on running application's measured peak power consumption is reliable with reference to the power capacitance inherent in the computing system.

公开(公告)号：US11406036B2

公开(公告)日：2022-08-02

申请号：US16682077

申请日：2019-11-13

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Brian T. Purcell ,  Steven Dean ,  Harvey J. Lunsman ,  Jonathan Daniel Befort

IPC: G06F1/22 ,  H05K7/14 ,  H05K7/10 ,  G06F1/16 ,  H05K5/00 ,  G06F13/00

Abstract: A flexible input/output (I/O) expansion card connection and communication technique are provided. The flexible I/O expansion card is, in some examples, a mezzanine expansion card that may be a single width mezzanine expansion card, a double width expansion card, or a quad width expansion card. Multiple connectors on a mainboard provide a slot to receive plug in (insertion) of an expansion card. A slot is associated with a communication bus (e.g., Peripheral Component Interconnect (PCI)) established between the expansion card and an associated processor. The expansion card (or more than one expansion card) may be inserted in multiple orientations with respect to the multiple connectors. Automatic adjustment of communication on the communication bus may be implemented via one or more hardware level and/or software assisted translations to allow the mezzanine expansion card to function in a normal or a reverse (180 degrees relative to normal) orientation.

公开(公告)号：US20210341984A1

公开(公告)日：2021-11-04

申请号：US16863217

申请日：2020-04-30

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Torsten Wilde ,  Andy Warner ,  Steven Dean ,  Steven Martin ,  Pat Donlin

IPC: G06F1/3203 ,  G06F1/30 ,  G06F9/50 ,  G06Q50/06 ,  H04L12/24

Abstract: Systems and methods described herein make previously stranded power capacity (power that is provisioned for a data center according to a computing system's nameplate power consumption but is currently not useable) available to the data center. Systems described herein generate empirical power profiles that specify expected upper bounds for the power consumption levels that applications trigger. Using the upper bounds for application power-consumption levels, a computing system described herein can reliably release part of its provisioned nameplate power for other systems or data center consumers, reducing the amount of stranded power in a data center. The method described herein avoids performance penalties for most jobs by using sensor measurements made at a rapid rate explained herein to ensure that a system power cap based on running application's measured peak power consumption is reliable with reference to the power capacitance inherent in the computing system.

公开(公告)号：US20210144875A1

公开(公告)日：2021-05-13

申请号：US16682077

申请日：2019-11-13

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Brian T. Purcell ,  Steven Dean ,  Harvey J. Lunsman ,  Jonathan Daniel Befort

IPC: H05K7/14 ,  H05K7/10 ,  H05K5/00 ,  G06F1/22 ,  G06F1/16

Abstract: A flexible input/output (I/O) expansion card connection and communication technique are provided. The flexible I/O expansion card is, in some examples, a mezzanine expansion card that may be a single width mezzanine expansion card, a double width expansion card, or a quad width expansion card. Multiple connectors on a mainboard provide a slot to receive plug in (insertion) of an expansion card. A slot is associated with a communication bus (e.g., Peripheral Component Interconnect (PCI)) established between the expansion card and an associated processor. The expansion card (or more than one expansion card) may be inserted in multiple orientations with respect to the multiple connectors. Automatic adjustment of communication on the communication bus may be implemented via one or more hardware level and/or software assisted translations to allow the mezzanine expansion card to function in a normal or a reverse (180 degrees relative to normal) orientation.

公开(公告)号：US10763191B1

公开(公告)日：2020-09-01

申请号：US16438271

申请日：2019-06-11

Applicant: Hewlett Packard Enterprise Development LP

Inventor： John Franz ,  Harvey Lunsman ,  Steven Dean

IPC: H05K7/20 ,  G06F1/20 ,  F28F7/00 ,  H01L23/473 ,  F28D15/02 ,  F16F1/02

Abstract: Systems and apparatus are provided for thermal cooling of integrated circuits, such as dual in-line memory modules (DIMMs). The apparatus includes a plurality of rows pieces that include individual leaf springs. Each of the leaf springs can exert compression to support thermal contact and a stable coupling with a received DIMM. The plurality of row pieces can be assembled to form a single structure, having a space to receive an individual DIMM for insertion. Further, each of the leaf springs are structured to allow a portion of its surface, having a conductive material disposed thereon, to support transfer of heat away from the DIMM at a point of thermal contact. The apparatus can be coupled to a printed circuit assembly (PCA) having additional cooling mechanisms installed thereon, in a manner that allows the additional cooling mechanisms to be integrated with the apparatus and provide increased thermal cooling for the DIMMs.