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    FLUID EJECTION DEVICE WITH INK FEEDHOLE BRIDGE
    21.
    发明申请
    FLUID EJECTION DEVICE WITH INK FEEDHOLE BRIDGE 有权
    带有墨水桥的流体喷射装置

    公开(公告)号：US20160101620A1

    公开(公告)日：2016-04-14

    申请号：US14785706

    申请日：2013-04-30

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： Rio Rivas ,  Anthony M. Fuller ,  Ed Friesen

    IPC: B41J2/14

    CPC classification number: B41J2/1433 ,  B41J2/14145

    Abstract: In an embodiment, a fluid ejection device includes a substrate with a fluid slot formed therein, a chamber layer formed on the substrate defining fluid chambers on both sides of the fluid slot, a thin-film layer between the substrate and chamber layer that defines an ink feedhole (IFH) between the fluid slot and the chamber layer, and a chamber layer extension that forms a bridge across the IFH between two chambers.

    Abstract translation: 在一个实施例中，流体喷射装置包括其中形成有流体槽的基板，形成在基板上的室层，其在流体槽的两侧限定流体室;衬底和室层之间的薄膜层， 在液体槽和室层之间的供墨孔（IFH）以及在两个室之间形成跨越IFH的桥的室层延伸。

    Heating element for a printhead
    22.
    发明授权
    Heating element for a printhead 有权
    用于打印头的加热元件

    公开(公告)号：US09289987B2

    公开(公告)日：2016-03-22

    申请号：US14397720

    申请日：2012-10-31

    Applicant: Hewlett-Packard Development Company, L.P.

    Inventor： Galen P. Cook ,  Bradley D. Chung ,  Anthony M. Fuller

    IPC: B41J2/05 ,  B41J2/14 ,  B41J2/16 ,  F22B1/28

    CPC classification number: B41J2/14129 ,  B41J2/1601 ,  B41J2/1603 ,  B41J2/1626 ,  B41J2/164 ,  B41J2/1646 ,  F22B1/284 ,  Y10T29/49083 ,  Y10T29/49401

    Abstract: An exemplary embodiment of the present invention provides for a fluid ejection device. The fluid ejection device includes a substrate, a conductive layer, a resistive layer, and at least one upper layer. The conductive layer is disposed on the substrate and an outer perimeter and an inner region thinner than the outer perimeter. The outer perimeter includes conductive elements spaced apart from one another. The resistive layer includes an outer resistive portion overlying the conductive elements and a central resistive portion lying on top of a raised bridge of the substrate, wherein the width of the raised bridge is substantially greater than the width of the central resistive portion. The at least one upper layer defines a boundary of a fluid chamber, and the boundary is aligned vertically above a border of the central resistive portion.

    Abstract translation: 本发明的示例性实施例提供了一种流体喷射装置。 流体喷射装置包括基板，导电层，电阻层和至少一个上层。 导电层设置在基板上，外周和比外周更薄的内区。 外周边包括彼此间隔开的导电元件。 电阻层包括覆盖导电元件的外部电阻部分和位于衬底的凸起桥的顶部上的中心电阻部分，其中凸起电桥的宽度基本上大于中央电阻部分的宽度。 所述至少一个上层限定流体室的边界，并且所述边界垂直地对准所述中心电阻部分的边界。

    Printhead die with damage detection conductor between multiple termination rings
    23.
    发明授权
    Printhead die with damage detection conductor between multiple termination rings 有权
    具有多个端接环之间的损坏检测导体的打印头模具

    公开(公告)号：US08870337B1

    公开(公告)日：2014-10-28

    申请号：US13872314

    申请日：2013-04-29

    Applicant: Hewlett-Packard Development Company, L.P.

    Inventor： Kellie S. Jensen ,  Rio Rivas ,  Anthony M. Fuller

    IPC: B41J29/393 ,  B41J2/01 ,  B41J29/00

    CPC classification number: B41J2/01 ,  B41J2/14129 ,  B41J29/00 ,  B41J2202/13

    Abstract: In one example implementation, a printhead die includes a SiO2 layer grown into a surface of a silicon substrate, a dielectric layer formed on the surface over an interior area of the substrate, a first termination ring surrounding the interior area and defined by an absence of the dielectric layer, a berm surrounding the first termination ring and defined by the presence of the dielectric layer, a damage detection conductor formed under the berm on the SiO2 layer, and a second termination ring surrounding the berm and defined by an absence of the dielectric layer.

    Abstract translation: 在一个示例性实施例中，打印头芯片包括生长到硅衬底的表面中的SiO 2层，形成在衬底的内部区域上的表面上的电介质层，围绕内部区域并由不存在 电介质层，围绕第一端接环并由电介质层的存在限定的护套，形成在SiO2层上的护堤下方的损伤检测导体，以及围绕护堤并由不存在电介质限定的第二端接环 层。

    CORROSION TOLERANT MICRO-ELECTROMECHANICAL FLUID EJECTION DEVICE
    24.
    发明公开
    CORROSION TOLERANT MICRO-ELECTROMECHANICAL FLUID EJECTION DEVICE 审中-公开

    公开(公告)号：US20230415482A1

    公开(公告)日：2023-12-28

    申请号：US18465031

    申请日：2023-09-11

    Applicant: Hewlett-Packard Development Company, L.P.

    Inventor： Stanley J. Wang ,  Anthony M. Fuller

    IPC: B41J2/14 ,  B01L3/00 ,  B81B7/00

    CPC classification number: B41J2/1433 ,  B01L3/502715 ,  B81B7/0025 ,  B01L2200/12 ,  B81B2201/052

    Abstract: Aspects of the present disclosure are directed to an apparatus including a circuit region and a fluidic region. In a particular example, the circuit region with logical circuits thereon, includes a thermal oxide layer on a silicon substrate, and a dielectric layer over the field oxide layer, the dielectric layer including a doped dielectric film. The microfluidic device further includes a fluidic region including fluid ports formed through a surface of the apparatus and including an un-doped dielectric film. The fluidic region includes an aperture in the dielectric layer, where the aperture is defined by a dielectric wall which forms part of the dielectric layer. A sealing film deposited over the dielectric wall may prevent the doped dielectric film from contacting fluid contained in the fluid port.

    FLUID EJECTION DEVICE WITH BREAK(S) IN COVER LAYER
    25.
    发明申请
    FLUID EJECTION DEVICE WITH BREAK(S) IN COVER LAYER 有权

    公开(公告)号：US20220072858A1

    公开(公告)日：2022-03-10

    申请号：US17311593

    申请日：2019-04-29

    Applicant: Hewlett-Packard Development Company, L.P.

    Inventor： Michael W. Cumbie ,  Anthony M. Fuller ,  Chien-Hua Chen

    IPC: B41J2/14 ,  B41J2/16

    Abstract: In various examples, a fluid ejection device may include a fluid ejection die formed with a first material and that includes a bondpad and a plurality of fluid ejectors, and a cover layer adjacent the fluid ejection die. The cover may be formed with a second material that is different than the first material and may include a first region that overlays the bondpad and a second region that overlays the plurality of fluid ejectors. In various examples, the first and second regions are separated by a break in the cover layer. The break may be filled with a third material that is different than one or both of the first and second material.

    DIE FOR A PRINTHEAD
    28.
    发明申请
    DIE FOR A PRINTHEAD 有权

    公开(公告)号：US20210354462A1

    公开(公告)日：2021-11-18

    申请号：US16766525

    申请日：2019-02-06

    Applicant: Hewlett-Packard Development Company, L.P.

    Inventor： Michael W. Cumbie ,  Scott A. Linn ,  Anthony M. Fuller ,  James Michael Gardner

    IPC: B41J2/14

    Abstract: A die for a printhead is described herein. The die includes a number of fluid feed holes disposed in a line parallel to a longitudinal axis of the die, wherein the fluid feed holes are formed through a substrate of the die. The die includes a number of fluidic actuators, proximate to the fluid feed holes, to eject fluid received from the fluid feed holes. Circuitry on the die operates the fluidic actuators, wherein traces are provided in layers between adjacent fluid feed holes, connecting circuitry on each side of the fluid feed holes.

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