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    CORROSION TOLERANT MICRO-ELECTROMECHANICAL FLUID EJECTION DEVICE
    1.
    发明公开
    CORROSION TOLERANT MICRO-ELECTROMECHANICAL FLUID EJECTION DEVICE 审中-公开

    公开(公告)号：US20230415482A1

    公开(公告)日：2023-12-28

    申请号：US18465031

    申请日：2023-09-11

    Applicant: Hewlett-Packard Development Company, L.P.

    Inventor： Stanley J. Wang ,  Anthony M. Fuller

    IPC: B41J2/14 ,  B01L3/00 ,  B81B7/00

    CPC classification number: B41J2/1433 ,  B01L3/502715 ,  B81B7/0025 ,  B01L2200/12 ,  B81B2201/052

    Abstract: Aspects of the present disclosure are directed to an apparatus including a circuit region and a fluidic region. In a particular example, the circuit region with logical circuits thereon, includes a thermal oxide layer on a silicon substrate, and a dielectric layer over the field oxide layer, the dielectric layer including a doped dielectric film. The microfluidic device further includes a fluidic region including fluid ports formed through a surface of the apparatus and including an un-doped dielectric film. The fluidic region includes an aperture in the dielectric layer, where the aperture is defined by a dielectric wall which forms part of the dielectric layer. A sealing film deposited over the dielectric wall may prevent the doped dielectric film from contacting fluid contained in the fluid port.

    SUBSTRATE PLATE FOR MEMS DEVICES
    8.
    发明申请
    SUBSTRATE PLATE FOR MEMS DEVICES 有权
    用于MEMS器件的基板

    公开(公告)号：US20150102835A1

    公开(公告)日：2015-04-16

    申请号：US14512105

    申请日：2014-10-10

    Applicant: OCE-TECHNOLOGIES B.V.

    Inventor： Maikel A.J. HUYGENS ,  René J. VAN DER MEER ,  Reinier PANNEKOEK ,  Alex N. WESTLAND

    IPC: B81C99/00 ,  G01R31/02 ,  G01R31/26 ,  B81C1/00 ,  H05K1/11

    CPC classification number: B81C99/004 ,  B41J2/14233 ,  B41J2/161 ,  B41J2/1632 ,  B41J2/1635 ,  B41J2002/14241 ,  B41J2002/14459 ,  B41J2002/14491 ,  B81B7/007 ,  B81B2201/052 ,  B81B2207/03 ,  B81C1/00301 ,  G01R31/02 ,  G01R31/2601 ,  H05K1/0268 ,  H05K1/111 ,  H05K2201/09372

    Abstract: A substrate plate is provided for at least one MEMS device to be mounted thereon. The MEMS device has a certain footprint on the substrate plate, and the substrate plate has a pattern of electrically conductive leads to be connected to electric components of the MEMS device. The pattern forms contact pads within the footprint of the MEMS device and includes at least one lead structure that extends on the substrate plate outside of the footprint of the MEMS device and connects a number of the contact pads to an extra contact pad. The lead structure is a shunt bar that interconnects a plurality of contact pads of the MEMS device and is arranged to be removed by means of a dicing cut separating the substrate plate into a plurality of chip-sized units. At least a major part of the extra contact pad is formed within the footprint of one of the MEMS devices.

    Abstract translation: 为安装在其上的至少一个MEMS装置提供基板。 MEMS器件在衬底板上具有一定的占地面积，并且衬底板具有连接到MEMS器件的电气部件的导电引线的图案。 该图案形成MEMS器件的覆盖区内的接触焊盘，并且包括至少一个引线结构，该引线结构在MEMS器件的覆盖区外部的衬底板上延伸，并将多个接触焊盘连接到额外的接触焊盘。 引线结构是将MEMS器件的多个接触焊盘互连的分流棒，并且被布置成通过将衬底板分成多个芯片尺寸的单元的切割切割来去除。 额外接触焊盘的至少主要部分形成在MEMS器件之一的覆盖区内。

    CORRUGATED MEMBRANE MEMS ACTUATOR FABRICATION METHOD
    9.
    发明申请
    CORRUGATED MEMBRANE MEMS ACTUATOR FABRICATION METHOD 有权
    腐蚀膜MEMS致动器制造方法

    公开(公告)号：US20140024147A1

    公开(公告)日：2014-01-23

    申请号：US13552721

    申请日：2012-07-19

    Applicant: Yonglin Xie ,  Weibin Zhang

    Inventor： Yonglin Xie ,  Weibin Zhang

    IPC: H01L21/308

    CPC classification number: B41J2/1601 ,  B41J2/1607 ,  B41J2/1628 ,  B41J2/1631 ,  B41J2/1639 ,  B41J2/1645 ,  B81B2201/032 ,  B81B2201/052 ,  B81C1/00158

    Abstract: A MEMS device fabrication method includes providing a substrate and a chamber wall material layer on a first surface of the substrate, the chamber wall material layer including a chamber cavity having a sacrificial material located therein. A mask material is deposited on the chamber wall material layer and the sacrificial material and patterned to form a mask pattern including a plurality of discrete portions. The mask material and some of the sacrificial material are removed to transfer the mask pattern including the plurality of discrete portions to the sacrificial material. A membrane material layer is deposited on the chamber wall material layer and the sacrificial material that includes the transferred mask pattern including the plurality of discrete portions. Some of the substrate and the sacrificial material are removed to release the membrane material layer using at least one process initiated from a second surface of the substrate.

    Abstract translation: MEMS器件制造方法包括在衬底的第一表面上提供衬底和室壁材料层，室壁材料层包括具有位于其中的牺牲材料的腔室腔。 掩模材料沉积在室壁材料层和牺牲材料上并被图案化以形成包括多个离散部分的掩模图案。 去除掩模材料和一些牺牲材料以将包括多个离散部分的掩模图案转移到牺牲材料。 膜材料层沉积在室壁材料层和牺牲材料上，该牺牲材料包括包含多个离散部分的转印掩模图案。 使用从衬底的第二表面引发的至少一种工艺，去除一些衬底和牺牲材料以释放膜材料层。

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