公开(公告)号：US20200158645A1

公开(公告)日：2020-05-21

申请号：US16074368

申请日：2016-04-22

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Zhizhang Chen ,  Chien-Hua Chen ,  James E Abbott

IPC: G01N21/65 ,  G01N21/05

Abstract: A method for forming a surface enhanced Raman spectroscopy (SERS) sensing apparatus may include providing a body having an internal microfluidic passage, the microfluidic passage having an interior surrounded by an interior surface, depositing a conformal inorganic passivation film onto the interior surface so as to continuously surround the interior by atomic layer deposition and positioning a SERS sensor in connection with the microfluidic passage after the depositing of the conformal inorganic film.

公开(公告)号：US20200147972A1

公开(公告)日：2020-05-14

申请号：US16604516

申请日：2017-08-28

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Jeffrey A. Nielsen ,  Michael W. Cumbie ,  Chien-Hua Chen

IPC: B41J2/175 ,  B41J2/03

Abstract: An apparatus includes a print head coupled to a substrate to dispense fluid from the substrate in response to a command. A reservoir coupled to the substrate transports the fluid to the print head. A preloaded storage container mounted on the reservoir stores the fluid and provides the fluid to the reservoir in response to pressure applied to the container.

公开(公告)号：US10647128B2

公开(公告)日：2020-05-12

申请号：US16092652

申请日：2016-04-21

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie ,  Anthony D. Studer

IPC: B41J2/175 ,  G01F23/24

Abstract: A method of forming a fluid level sensor includes coupling an array of heating elements and sensors to a first side of a substrate. A second side of the substrate is coupled to a carrier. The method also includes coupling an electrical interface to the carrier and electrically coupling the array to the electrical interface via a conductive wire. The method further includes overmolding the electrical interface, the first side of the substrate, and the conductive wire to form an overmolded fluid level sensor. The carrier may be coupled to the second side of the substrate and the electrical interface via a releasable adhesive and may be removed after overmolding the fluid level sensor.

公开(公告)号：US10603916B2

公开(公告)日：2020-03-31

申请号：US15654084

申请日：2017-07-19

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie

IPC: B41J2/16 ,  B41J2/14 ,  B41J2/155 ,  H05K1/18 ,  H05K3/28 ,  H05K3/32 ,  B29C69/00 ,  H05K3/40

Abstract: A method of making a fluid channel in a printhead structure includes positioning a printhead die on a carrier; compression molding the die into a molded printhead structure; compression molding a first segment of a fluid channel into the molded printhead structure simultaneously with compression molding the die; and materially ablating a second segment of the fluid channel to couple the channel with a fluid feed hole in the die.

公开(公告)号：US10557798B2

公开(公告)日：2020-02-11

申请号：US16098096

申请日：2016-07-22

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie ,  Devin A. Mourey

IPC: G01J3/44 ,  G01N21/65

Abstract: A housing may include sidewalls and a base extending between and supported by the sidewalls. The base and the sidewalls form a cavity. The housing support they substrate. The substrate supports a surface enhanced luminescence stage between the substrate and the base.

公开(公告)号：US10369793B2

公开(公告)日：2019-08-06

申请号：US15747619

申请日：2015-10-15

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Devin Alexander Mourey ,  Chien-Hua Chen ,  Michael W. Cumbie

IPC: B41J2/16 ,  B41J2/14

Abstract: In example implementations, an apparatus with an embedded service structure is provided. The apparatus may include an epoxy molded compound (EMC). At least one print head die may be embedded in the EMC. A service structure may be located within the EMC adjacent to the at least one print head die.

公开(公告)号：US20190232673A1

公开(公告)日：2019-08-01

申请号：US16316921

申请日：2016-10-05

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Ning Ge ,  Chien-Hua Chen ,  Michael W. Cumbie

IPC: B41J2/175 ,  G01F23/24

CPC classification number: B41J2/17566 ,  B41J2002/17579 ,  G01F23/24 ,  G01F23/241

Abstract: A sensing structure in an example may include at least three electrodes along an interior surface of a reservoir from a top portion of the reservoir to a bottom portion of the reservoir wherein at least one of the electrodes is closer to at least another electrode at the top portion of the reservoir than at the bottom portion of the reservoir.

公开(公告)号：US20190226930A1

公开(公告)日：2019-07-25

申请号：US16375409

申请日：2019-04-04

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Michael W. Cumbie ,  Chien-Hua Chen

IPC: G01L7/08 ,  B41J2/175 ,  G01L9/06 ,  G01L27/00 ,  G01L19/14

Abstract: An apparatus may include a liquid container and a sense unit mounted to the liquid container. The sense unit may include a substrate, a liquid level sensor supported by the substrate and a pressure sensor. The sense unit may further include an electrical interconnect, wherein the liquid level sensor and a pressure sensor are to each communicate through the electrical interconnect.

公开(公告)号：US20190162576A1

公开(公告)日：2019-05-30

申请号：US16092531

申请日：2016-07-21

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie ,  Robert N.K. Browning

IPC: G01F23/24 ,  B41J2/175

Abstract: In one example in accordance with the present disclosure a liquid level sensor is described. The sensor includes a carrier and a liquid level sensing interface disposed on the carrier. The liquid level sensing interface includes a number of liquid level sensing devices disposed on an elongated strip. The number of liquid level sensing devices detect a liquid level in a liquid container. The liquid level sensing interface also includes a number of thermal isolation components formed on the elongated strip to thermally isolate adjacent liquid level sensing devices.

公开(公告)号：US10300701B2

公开(公告)日：2019-05-28

申请号：US15890058

申请日：2018-02-06

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie

IPC: B41J2/14 ,  B41J2/16 ,  B41J2/145 ,  B41J2/155 ,  B41J25/34

Abstract: In an example, a fluid ejection apparatus includes a printhead die embedded in a printed circuit board. Fluid may flow to the printhead die through a plunge-cut fluid feed slot in the printed circuit board and into the printhead die.