公开(公告)号：US20090307884A1

公开(公告)日：2009-12-17

申请号：US11983195

申请日：2007-11-07

Applicant: Amy Duwel ,  Luke Hohreiter ,  Joung-Mo Kang ,  Douglas W. White ,  David J. Carter ,  Mathew Varghese

Inventor： Amy Duwel ,  Luke Hohreiter ,  Joung-Mo Kang ,  Douglas W. White ,  David J. Carter ,  Mathew Varghese

IPC: H01L41/22

CPC classification number: H03H3/02 ,  H03H9/564 ,  H03H9/582 ,  H03H9/586 ,  H03H2003/027 ,  H03H2009/241 ,  Y10T29/42

Abstract: A method of fabricating a MEMS piezoelectric resonator system includes forming a stack of layers on a substrate, the stack comprising at least one piezoelectric material layer spaced from the substrate by a sacrificial layer, patterning the stack to form a plurality of edge coupled resonators, and removing at least a portion of the sacrificial layer to suspend the resonators relative to the substrate.

Abstract translation: 一种制造MEMS压电谐振器系统的方法包括在衬底上形成层叠层，所述堆叠包括至少一个压电材料层，所述至少一个压电材料层通过牺牲层与所述衬底隔开，图案化所述堆叠以形成多个边缘耦合谐振器，以及 去除所述牺牲层的至少一部分以相对于所述衬底悬挂所述谐振器。

公开(公告)号：US07215213B2

公开(公告)日：2007-05-08

申请号：US11181035

申请日：2005-07-13

Applicant: Mark J. Mescher ,  Mathew Varghese ,  Marc Steven Weinberg ,  Thomas Marinis ,  Joseph W. Soucy

Inventor： Mark J. Mescher ,  Mathew Varghese ,  Marc Steven Weinberg ,  Thomas Marinis ,  Joseph W. Soucy

IPC: H01S1/06 ,  H03B17/00

CPC classification number: B81B7/0012 ,  G04F5/14 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A suspension of a chip-scale device is accomplished using a suspension frame and at least one first tether. The chip-scale suspension frame defines a first plane and an opening through the suspension frame. At least one first tether crosses the opening at a first angle relative to the first plane and can be used to position the chip-scale device at least partially within the opening.

Abstract translation: 使用悬挂框架和至少一个第一系绳来实现芯片级设备的悬架。 芯片级悬挂框架限定了第一平面和通过悬挂框架的开口。 至少一个第一系绳相对于第一平面以第一角度穿过开口，并且可以用于将芯片尺寸装置至少部分地定位在开口内。

公开(公告)号：US20060051883A1

公开(公告)日：2006-03-09

申请号：US11181035

申请日：2005-07-13

Applicant: Mark Mescher ,  Mathew Varghese ,  Marc Weinberg ,  Thomas Marinis ,  Joseph Soucy

Inventor： Mark Mescher ,  Mathew Varghese ,  Marc Weinberg ,  Thomas Marinis ,  Joseph Soucy

IPC: H01L21/00

CPC classification number: B81B7/0012 ,  G04F5/14 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A suspension of a chip-scale device is accomplished using a suspension frame and at least one first tether. The chip-scale suspension frame defines a first plane and an opening through the suspension frame. At least one first tether crosses the opening at a first angle relative to the first plane and can be used to position the chip-scale device at least partially within the opening.

Abstract translation: 使用悬挂框架和至少一个第一系绳来实现芯片级装置的悬架。 芯片级悬挂框架限定了第一平面和通过悬挂框架的开口。 至少一个第一系绳相对于第一平面以第一角度穿过开口，并且可以用于将芯片尺寸装置至少部分地定位在开口内。