MICROELECTROMECHANICAL STRUCTURE AND A METHOD FOR MAKING THE SAME
    21.
    发明申请
    MICROELECTROMECHANICAL STRUCTURE AND A METHOD FOR MAKING THE SAME 有权
    微电子结构及其制造方法

    公开(公告)号:US20060266730A1

    公开(公告)日:2006-11-30

    申请号:US10805610

    申请日:2004-03-18

    CPC classification number: B81C1/00793 B81B2201/042 B81C2201/053

    Abstract: A microstructure and the method for making the same are disclosed herein. The microstructure has structural members, at least one of which comprises an intermetallic compound. In making such a microstructure, a sacrificial material is employed. After completion of forming the structural layers, the sacrificial material is removed by a spontaneous vapor phase chemical etchant.

    Abstract translation: 本文公开了微结构及其制造方法。 微结构具有结构构件,其中至少一个包括金属间化合物。 在制造这样的微结构时,采用牺牲材料。 在完成形成结构层之后,牺牲材料通过自发气相化学腐蚀剂除去。

    Method and apparatus for isolative substrate edge area processing
    26.
    发明申请
    Method and apparatus for isolative substrate edge area processing 审中-公开
    用于隔离衬底边缘区域处理的方法和装置

    公开(公告)号:US20070062647A1

    公开(公告)日:2007-03-22

    申请号:US11230263

    申请日:2005-09-19

    CPC classification number: H01L21/67063 G03F7/168 H01L21/02087 H01L21/6708

    Abstract: An isolative substrate edge area processing method and apparatus is described. The apparatus has an isolator for isolating and processing by dry chemical technique a portion of a substrate including a substrate edge region. The isolator has nozzles for directing a flow of reactive species towards the edge area of the substrate and a purge plenum for biasing flow of reactive species towards an exhaust plenum while the substrate rotates on a chuck. Tuned flow control prevents migration of reactive species and reaction byproducts out of the processing area. A method for processing a substrate with the isolator involves directing a flow of reactive species at an angle towards an edge area of the substrate while forming a boundary around the processing area with flow control provided by the purge plenum, and exhaust plenum.

    Abstract translation: 描述了隔离衬底边缘区域处理方法和装置。 该装置具有用于通过干化学技术隔离和处理包括衬底边缘区域的衬底的一部分的隔离器。 隔离器具有用于将反应物质流引导到基底的边缘区域的喷嘴和用于在衬底在卡盘上旋转的同时将反应物质的流动偏向排气室的吹扫气室。 调节流量控制可防止反应物质和反应副产物迁离加工区域。 用隔离器处理衬底的方法包括以一定角度朝向衬底的边缘区域引导反应物种的流动,同时通过由净化气室和排气室提供的流动控制在处理区域周围形成边界。

    Optical coating on light transmissive substrates of micromirror devices
    27.
    发明申请
    Optical coating on light transmissive substrates of micromirror devices 有权
    微镜器件的透光基板上的光学涂层

    公开(公告)号:US20060227406A1

    公开(公告)日:2006-10-12

    申请号:US11102531

    申请日:2005-04-08

    CPC classification number: G02B26/0841

    Abstract: Disclosed herein is method of operating a device that comprises an array of micromirrors. The method comprises a process usable for repairing stuck micromirrors of the micromirror array during the operation. The reparation process applies, at the ON state, two consecutive refresh voltages to the mirror plates of the micromirrors in the array with the pulses being separated in time longer than the characteristic oscillation time of the micromirrors. The reparation process can be applied independently to the micromirrors. Alternatively, the reparation process can be incorporated with a bias inversion process.

    Abstract translation: 这里公开了一种操作包括微镜阵列的装置的方法。 该方法包括可用于在操作期间修复微镜阵列的粘性微镜的过程。 修复过程在ON状态下,对阵列中的微镜的镜板施加两个连续的刷新电压,其中脉冲在时间上比微镜的特征振荡时间长。 修复过程可独立应用于微镜。 或者,修复过程可以结合偏置反转过程。

    Micromirror array device with compliant adhesive
    28.
    发明申请
    Micromirror array device with compliant adhesive 有权
    具有柔性粘合剂的微镜阵列器件

    公开(公告)号:US20060220045A1

    公开(公告)日:2006-10-05

    申请号:US11100104

    申请日:2005-04-05

    Abstract: A microstructure is packaged with a device substrate of the microstructure being attached to a package substrate. For dissipating possible deformation of the microstructure, which may result in device failure or quality degradation of the microstructure, an adhesive material comprising a compliant adhesive component is applied and positioned between the device substrate and package substrate.

    Abstract translation: 微观结构与微结构的装置基板一起包装,所述装置基板附接到封装基板。 为了消散微结构的可能的变形,这可能导致器件故障或微结构的质量下降,包括柔性粘合剂组分的粘合剂材料被施加并定位在器件衬底和封装衬底之间。

    Electrical connections in microelectromechanical devices
    30.
    发明申请
    Electrical connections in microelectromechanical devices 有权
    微机电装置中的电气连接

    公开(公告)号:US20050250362A1

    公开(公告)日:2005-11-10

    申请号:US11181079

    申请日:2005-07-13

    CPC classification number: G02B26/0841 G02B26/0833 Y10T29/49155

    Abstract: A micromirror device and a method of making the same are disclosed herein. The micromirror device comprises a mirror plate, hinge, and post each having an electrically conductive layer. One of the hinge, mirror plate, and post further comprises an electrically insulating layer. To enable the electrical connections between the conducting layers of the hinge, mirror plate, and post, the insulating layer is patterned.

    Abstract translation: 本文公开了一种微镜器件及其制造方法。 微镜装置包括各自具有导电层的镜板,铰链和柱。 铰链,镜板和柱中的一个还包括电绝缘层。 为了实现铰链,镜板和柱的导电层之间的电连接,绝缘层被图案化。

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