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公开(公告)号：US07067030B2
公开(公告)日：2006-06-27
申请号：US10400792
申请日：2003-03-28
Applicant: Kazuyuki Kiuchi , Toshiyuki Oshima , Akihisa Murata , Yukio Arimitsu
Inventor： Kazuyuki Kiuchi , Toshiyuki Oshima , Akihisa Murata , Yukio Arimitsu
CPC classification number: H01L21/6835 , C09J7/22 , C09J7/26 , C09J7/29 , C09J7/38 , C09J2201/36 , C09J2205/11 , C09J2400/243 , C09J2421/006 , C09J2423/006 , C09J2433/00 , C09J2467/006 , H01L21/6836 , H01L2221/68327 , H01L2221/68331 , H01L2924/19041 , Y10T156/1064 , Y10T156/1082 , Y10T156/1153 , Y10T428/249984 , Y10T428/28 , Y10T428/2839 , Y10T428/2848 , Y10T428/2861
Abstract: A heat-peelable adhesive sheet which comprises a substrate and, formed on at least one side thereof, a heat-expandable layer containing heat-expandable microspheres and an adhesive layer comprising an adhesive substance and in which the substrate has heat resistance and stretchability can be used to cut an adherend so as to form and secure a sufficient space between the resultant cut pieces and can withstand a heat treatment for expanding the heat-expandable layer. Consequently, the adhesive sheet can heighten the operating efficiency and working efficiency in the step of separating and recovering the cut pieces.
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22.发明授权公开(公告)号：US08436481B2
公开(公告)日：2013-05-07
申请号：US12974620
申请日：2010-12-21
Applicant: Shinji Hoshino , Yukio Arimitsu , Kazuyuki Kiuchi , Akihisa Murata
Inventor： Shinji Hoshino , Yukio Arimitsu , Kazuyuki Kiuchi , Akihisa Murata
IPC: H01L23/28
CPC classification number: H01L21/568 , H01L23/3107 , H01L23/3114 , H01L23/5389 , H01L24/24 , H01L24/96 , H01L2224/24137 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01024 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01051 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/181 , Y10T428/28 , Y10T428/287 , H01L2924/00
Abstract: The present invention is intended to solve the following problems with a method for fabricating a substrateless semiconductor package using an adhesive sheet as a temporary fixing supporter. A chip can be displaced from a specified position by pressure during resin encapsulation because the chip is not properly held by the adhesive sheet. If such displacement occurs, the relative positional relationship between the chip and an interconnect to be connected to a specified position in a subsequent wiring step also changes by the displacement of the chip from the specified position. Another problem is that if adhesive deposits occur during peeling of the adhesive sheet and the surface of a package is contaminated with the adhesive deposits, adhesive components left on the surface of the chip can inhibit connection between the interconnect and the chip in a subsequent wiring step. To solve these problems, the present invention provides an adhesive sheet for semiconductor device fabrication that is attached to a substrateless semiconductor chip when the chip is encapsulated with resin. The adhesive sheet includes a base material layer and an adhesive layer. The adhesive layer has a specific adhesion strength and peel strength.
Abstract translation: 本发明旨在解决使用粘合片作为临时固定支撑件制造无基底半导体封装的方法的以下问题。 由于芯片没有被粘合片正确地夹持，所以在树脂封装期间，芯片可以通过压力从指定位置移位。 如果发生这种位移，则芯片与在后续布线步骤中连接到指定位置的互连件之间的相对位置关系也随着芯片从指定位置的位移而改变。 另一个问题是如果在粘合片剥离期间发生粘合剂沉积，并且包装表面被粘合剂沉积物污染，残留在芯片表面上的粘合剂组分可以在随后的布线步骤中阻止互连和芯片之间的连接 。 为了解决这些问题，本发明提供了一种用于半导体器件制造的粘合片，其在芯片被树脂封装时附接到无基底半导体芯片。 粘合片包括基材层和粘合剂层。 粘合剂层具有特定的粘合强度和剥离强度。
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23.发明申请公开(公告)号：US20110117706A1
公开(公告)日：2011-05-19
申请号：US13000395
申请日：2009-10-09
Applicant: Akinori Nishio , Kazuyuki Kiuchi , Masayuki Yamamoto , Naoki Ishii
Inventor： Akinori Nishio , Kazuyuki Kiuchi , Masayuki Yamamoto , Naoki Ishii
CPC classification number: H01L21/67132
Abstract: A cooling plate having a cooling pipe mounted therein in a serpentine shape is placed in a stack manner on a rear face of a chuck table for suction-holding a rear face of the semiconductor wafer. A coolant is circulated through the cooling pipe, thereby cooling the chuck table. The semiconductor wafer is suction-held while the chuck table is cooled. In addition, the protective tape is joined to the semiconductor wafer while the chuck table is cooled. That is, the protective tape is joined to the surface of the semiconductor wafer while being cooled indirectly via the semiconductor wafer cooled in advance through direct contact to the chuck table during joining of the protective tape.
Abstract translation: 将其中安装有蛇形形状的冷却管的冷却板以堆叠方式放置在卡盘台的后表面上，用于吸持保持半导体晶片的后表面。 冷却剂通过冷却管循环，从而冷却卡盘台。 当卡盘台被冷却时，半导体晶片被吸住。 另外，在卡盘台被冷却的同时将保护带接合到半导体晶片。 也就是说，在保护带的接合期间，保护带通过预先冷却的半导体晶片被间接冷却而与半导体晶片的表面接合，同时直接接触到卡盘台。
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24.发明申请REMOVABLE PRESSURE SENSITIVE ADHESIVE SHEET AND METHOD FOR PROCESSING ADHEREND USING THE SAME 审中-公开可拆卸的压力敏感性粘合片和使用它的加工方法公开(公告)号：US20100252185A1
公开(公告)日：2010-10-07
申请号：US12754858
申请日：2010-04-06
Applicant: Kazuyuki Kiuchi , Akinori Nishio
Inventor： Kazuyuki Kiuchi , Akinori Nishio
CPC classification number: H01L21/6836 , C09J7/29 , C09J2201/162 , C09J2203/326 , H01L2221/68318 , H01L2221/68327 , H01L2221/68386 , Y10T428/14
Abstract: The present invention provides a removable pressure sensitive adhesive sheet, which includes: a self-rolling pressure sensitive adhesive sheet which is capable of spontaneously rolling up by a thermal stimulation, the self-rolling pressure sensitive adhesive sheet including a first pressure sensitive adhesive layer, a first rigid film layer, an elastic layer and a heat contractible film layer laminated in this order; and a second pressure sensitive adhesive layer and a second rigid film layer laminated in this order on the heat contractible film layer side of the self-rolling pressure sensitive adhesive sheet, in which the second pressure sensitive adhesive layer is removable from the heat contractible film layer or the second rigid film layer is removable from the second pressure sensitive adhesive layer.
Abstract translation: 本发明提供一种可除去的压敏粘合片，其包括：能够通过热刺激自发卷起的自动滚压压敏粘合片，所述自动压敏粘合片包括第一压敏粘合剂层， 依次层叠第一刚性膜层，弹性层和热收缩膜层; 以及第二压敏粘合剂层和第二刚性膜层，其顺序层叠在自动压敏粘合片的热收缩膜层侧，其中第二压敏粘合剂层可从热收缩膜层移除 或者第二刚性膜层可从第二压敏粘合剂层移除。
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Patent Agency Ranking
公开(公告)号：US07214424B2
公开(公告)日：2007-05-08
申请号：US10123113
申请日：2002-04-17
Applicant: Kazuyuki Kiuchi , Toshiyuki Oshima , Akihisa Murata , Yukio Arimitsu
Inventor： Kazuyuki Kiuchi , Toshiyuki Oshima , Akihisa Murata , Yukio Arimitsu
IPC: B32B7/12
CPC classification number: H01L21/6836 , C09J7/38 , C09J2201/36 , C09J2205/11 , C09J2433/00 , C09J2467/006 , H01L2221/68327 , Y10S428/901 , Y10T428/249987 , Y10T428/249991 , Y10T428/249992 , Y10T428/28 , Y10T428/2817 , Y10T428/2852
Abstract: A heat-peelable adhesive sheet which shows small increase in the degree of contamination caused by a heat treatment for lowering an adhesive force is disclosed. The heat-peelable pressure sensitive adhesive sheet comprises a heat-expandable layer containing heat-expandable microspheres and expanding upon heating, and a non-heat expandable pressure-sensitive adhesive layer formed on at least one side thereof. The heat-peelable pressure-sensitive adhesive sheet can achieve the desired adhesive properties such as an excellent adhesive force before heating and also show a quick lowering of the adhesive force upon heating. Further, it shows small increase in the degree of contamination due to the treatment for lowering the adhesive force. Due to those characteristics, the heat-peelable pressure-sensitive adhesive sheet is practically applicable to, for example, the production of electronic parts made of thinner semiconductor wafers.
Abstract translation: 公开了一种可降低粘合力的热处理引起的污染程度小的可热剥离的粘合片。 可热剥离的压敏粘合片包括含有热膨胀性微球并在加热时膨胀的热膨胀层，以及在其至少一侧上形成的不可热膨胀的压敏粘合剂层。 可热剥离的粘合片可以达到所需的粘合性能，例如加热前的优异的粘合力，并且还显示加热时粘合力的快速降低。 此外，由于用于降低粘合力的处理，显示出小的污染程度的增加。 由于这些特征，可热剥离的粘合片实际上可应用于例如制造由较薄的半导体晶片制成的电子部件。
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公开(公告)号：US07163597B2
公开(公告)日：2007-01-16
申请号：US10404861
申请日：2003-04-02
Applicant: Akihisa Murata , Toshiyuki Oshima , Yukio Arimitsu , Kazuyuki Kiuchi
Inventor： Akihisa Murata , Toshiyuki Oshima , Yukio Arimitsu , Kazuyuki Kiuchi
IPC: B32B37/14 , H01L21/46 , H01L21/78 , H01L21/301
CPC classification number: H01L21/6836 , C09J7/385 , C09J2201/36 , C09J2205/11 , C09J2433/00 , H01L2221/68327 , Y10T156/1082 , Y10T156/1142 , Y10T428/28 , Y10T428/2839 , Y10T428/2848
Abstract: A heat-peelable pressure-sensitive adhesive sheet which ensures an efficient contact area even in case where the area of an adherend to be adhered is decreased and thus makes it possible to avoid adhesion failures such as chip-scattering or chipping. The heat-peelable pressure-sensitive adhesive sheet comprises a substrate and a heat-expandable pressure-sensitive adhesive layer containing heat-expandable microspheres, formed on at least one side of the substrate, wherein the surface of the heat-expandable pressure-sensitive adhesive layer before heating has a center line average roughness of 0.4 μm or less.
Abstract translation: 即使在粘附被粘物的面积减小的情况下也能够确保有效的接触面积的热剥离性粘合片，因此能够避免诸如芯片散射或碎裂的粘合破坏。 可热剥离的压敏粘合片包括基材和形成在基材的至少一侧的含有热膨胀性微球的热膨胀性压敏粘合剂层，其中，热膨胀性压敏粘合剂的表面 加热前的层的中心线平均粗糙度为0.4μm以下。
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27.发明授权公开(公告)号：US07029550B2
公开(公告)日：2006-04-18
申请号：US10399476
申请日：2001-10-17
Applicant: Kazuyuki Kiuchi , Toshiyuki Oshima , Akihisa Murata , Yukio Arimitsu
Inventor： Kazuyuki Kiuchi , Toshiyuki Oshima , Akihisa Murata , Yukio Arimitsu
CPC classification number: H01L21/6835 , C09J7/22 , C09J7/38 , C09J2201/36 , C09J2205/11 , H01L21/67092 , H01L21/67132 , H01L21/6836 , H01L2221/68327 , H01L2221/68381 , H01L2924/19041 , Y10T156/1052 , Y10T428/1405 , Y10T428/1476 , Y10T428/1495 , Y10T428/24843 , Y10T428/2486 , Y10T428/28 , Y10T428/2809 , Y10T428/2839 , Y10T428/2852 , Y10T428/2883
Abstract: An energy-beam-curable thermal-releasable pressure-sensitive adhesive sheet has, on at least one side of a base material, an energy-beam-curable viscoelastic layer and a thermo-expandable pressure-sensitive adhesive layer containing thermo-expandable microspheres stacked in this order. The energy-beam-curable viscoelastic layer is, for example, composed of a composition of an organic viscoelastic body and an energy-beam-curable compound or an energy-beam-curable resin. The energy-beam-curable viscoelastic layer has a thickness of about 5 to 300 μm or may be not greater than the maximum particle size of the thermo-expandable microspheres. The energy-beam-curable thermal-releasable pressure-sensitive adhesive layer according to the invention has adhesion enough to withstand a carrying step of an adherend, causes neither winding up of the adhesive nor chipping upon cutting and facilitates peeling and collection of cut pieces after cutting.
Abstract translation: 能量束可固化的可热释放的压敏粘合片在基材的至少一侧上具有能量束可固化的粘弹性层和包含热膨胀性微球的热可膨胀压敏粘合剂层 按此顺序 能量束固化型粘弹性层例如由有机粘弹性体和能量束固化性化合物或能量束固化性树脂的组合物构成。 能量束固化型粘弹性层的厚度为约5〜300μm，或者不大于热膨胀性微球的最大粒径。 根据本发明的能量束固化型热剥离性压敏粘合剂层具有足够的粘合力以承受被粘物的携带步骤，在切割时既不会卷起粘合剂也不会碎裂，并且有利于在切割之后的剥离和收集切割片 切割。
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公开(公告)号：US20050186419A1
公开(公告)日：2005-08-25
申请号：US11108648
申请日：2005-04-19
Applicant: Kazuyuki Kiuchi , Toshiyuki Oshima , Akihisa Murata , Yukio Arimitsu
Inventor： Kazuyuki Kiuchi , Toshiyuki Oshima , Akihisa Murata , Yukio Arimitsu
IPC: B32B5/18 , C09J7/02 , C09J11/00 , C09J201/00 , H01L21/68 , B65D1/00 , F16L1/00 , B32B1/08 , B29D22/00 , B29D23/00 , B32B7/12 , B32B15/04
CPC classification number: H01L21/6835 , C09J7/22 , C09J7/26 , C09J7/29 , C09J7/38 , C09J2201/36 , C09J2205/11 , C09J2400/243 , C09J2421/006 , C09J2423/006 , C09J2433/00 , C09J2467/006 , H01L21/6836 , H01L2221/68327 , H01L2221/68331 , H01L2924/19041 , Y10T156/1064 , Y10T156/1082 , Y10T156/1153 , Y10T428/249984 , Y10T428/28 , Y10T428/2839 , Y10T428/2848 , Y10T428/2861
Abstract: A heat-peelable adhesive sheet which comprises a substrate and, formed on at least one side thereof, a heat-expandable layer containing heat-expandable microspheres and an adhesive layer comprising an adhesive substance and in which the substrate has heat resistance and stretchability can be used to cut an adherend so as to form and secure a sufficient space between the resultant cut pieces and can withstand a heat treatment for expanding the heat-expandable layer. Consequently, the adhesive sheet can heighten the operating efficiency and working efficiency in the step of separating and recovering the cut pieces.
Abstract translation: 一种可热剥离的粘合片，其包含基材，并且在其至少一侧上形成包含热膨胀性微球的热膨胀层和包含粘合物质的粘合剂层，并且其中基材具有耐热性和拉伸性， 用于切割被粘物，以形成并确保所得切割片之间的足够的空间，并且可以经受用于膨胀热膨胀层的热处理。 因此，粘合片可以在分离和回收切割件的步骤中提高操作效率和工作效率。
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公开(公告)号：US20050031861A1
公开(公告)日：2005-02-10
申请号：US10912615
申请日：2004-08-05
Applicant: Takeshi Matsumura , Kouji Akazawa , Kazuyuki Kiuchi , Tomokazu Takahashi
Inventor： Takeshi Matsumura , Kouji Akazawa , Kazuyuki Kiuchi , Tomokazu Takahashi
IPC: B32B7/12 , C09J7/02 , C09J9/00 , C09J133/00 , C09J201/00 , H01L21/301 , H01L21/304 , H01L21/68 , H01L21/683
CPC classification number: C09J7/29 , C09J2201/162 , C09J2203/326 , Y10T156/1052 , Y10T428/1471 , Y10T428/1476 , Y10T428/28 , Y10T428/2848
Abstract: The re-peelable pressure-sensitive adhesive sheet of the invention is a re-peelable pressure-sensitive adhesive sheet, which comprises an adhesive agent layer formed over a base film, and which further comprises at least one intermediate layer between the base film and the adhesive agent layer, the intermediate layer having a storage elastic modulus (G′) of 3.0×104 to 1.0×108 Pa at 23° C. and a storage elastic modulus (G′) of 1.0×103 to 8.0×104 Pa at 200° C. Even when this re-peelable pressure-sensitive adhesive sheet and a semiconductor wafer are adhered to each other and they are placed, as they are, in a heating environment, the wafer can be prevented from being warped.
Abstract translation: 本发明的可再剥离粘合片是可再剥离的粘合片，其包含在基膜上形成的粘合剂层，并且还包括在基膜和 粘合剂层，中间层在23℃下的储能弹性模量（G'）为3.0×10 4至1.0×10 8 Pa，储存弹性模量（G'）为1.0×10 3至 在200℃下为8.0×10 4 Pa。即使这种可再剥离粘合片和半导体晶片彼此粘合并且它们被放置在加热环境中，也可以防止晶片 从扭曲。
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