公开(公告)号：US07779538B2

公开(公告)日：2010-08-24

申请号：US11917527

申请日：2006-06-21

Applicant: Yoshiaki Sato ,  Kohichiro Kawate ,  James R. White

Inventor： Yoshiaki Sato ,  Kohichiro Kawate ,  James R. White

IPC: H05K3/36

CPC classification number: H05K3/365 ,  H01L2224/73204 ,  H01L2224/83101 ,  H05K1/117 ,  H05K3/305 ,  H05K3/361 ,  H05K2201/09245 ,  H05K2201/09263 ,  H05K2201/09427 ,  H05K2201/10977 ,  H05K2203/1189 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49174 ,  Y10T29/49179 ,  Y10T29/49195

Abstract: A method for connecting circuit boards, comprising: (i) preparing a first circuit board having connection parts assigned to end parts of a plurality of conductor wirings, and a second circuit board having connection parts assigned to corresponding end parts of a plurality of conductor wirings; (ii) disposing the connection parts of the first circuit board to face the connection parts of the second circuit board with a thermosetting adhesive film between the connection parts of the circuit boards; and (iii) applying heat and pressure to the connection parts and to the thermosetting adhesive film sufficiently high to thoroughly push away the adhesive film so as to establish electrical contact between connection parts of the circuit boards facing each other and to allow for curing of the adhesive; wherein the conductor wirings constituting the connection parts of at least one of the first and second circuit boards contain non-linear wirings.

Abstract translation: 一种用于连接电路板的方法，包括：（i）制备具有分配给多个导体布线的端部的连接部分的第一电路板和具有分配给多个导体布线的相应端部的连接部分的第二电路板 ; （ii）将第一电路板的连接部分设置成与电路板的连接部分之间的热固性粘合膜面对第二电路板的连接部分; 和（iii）对连接部分和热固性粘合剂膜施加足够高的热量和压力，以充分地推开粘合剂膜，以便在彼此面对的电路板的连接部分之间建立电接触，并允许固化 胶粘剂; 其中构成第一和第二电路板中的至少一个的连接部分的导体配线包含非线性配线。

公开(公告)号：US20100206623A1

公开(公告)日：2010-08-19

申请号：US12682333

申请日：2008-10-06

Applicant: Kohichiro Kawate ,  Hiroko Arita ,  Hideaki Yasui ,  Yoshiaki Sato

Inventor： Kohichiro Kawate ,  Hiroko Arita ,  Hideaki Yasui ,  Yoshiaki Sato

IPC: H05K1/02 ,  C08L63/00 ,  B32B38/10

CPC classification number: H05K3/361 ,  C08K9/10 ,  C08L51/06 ,  C08L2666/04 ,  C09J163/00 ,  H05K3/305 ,  H05K2201/0212 ,  H05K2201/10977 ,  H05K2203/1189

Abstract: To provide a nonconductive adhesive film, for electrically connecting a flexible printed circuit board to a circuit board, which is superior in both storage stability and curability and which suppresses the formation of air bubbles at the time of press bonding. A nonconductive adhesive film substantially comprising a heat-curable epoxy resin, a latent curing agent, and organic elastic fine particles of an average particle size of approximately 1 μm or less, a film being formed by aggregation of the organic elastic fine particles, is provided.

Abstract translation: 为了提供一种用于将柔性印刷电路板电连接到电路板的非导电粘合剂膜，其在储存稳定性和固化性方面均优异，并且抑制了压接时气泡的形成。 提供了一种基本上包含热固性环氧树脂，潜在性固化剂和平均粒径为约1μm以下的有机弹性细颗粒的非导电粘合剂膜，通过有机弹性微粒的聚集形成的膜 。

公开(公告)号：US20100197368A1

公开(公告)日：2010-08-05

申请号：US11909622

申请日：2006-04-04

Applicant: Yoshihisa Kawate ,  Takuro Miya ,  Kohichiro Kawate

Inventor： Yoshihisa Kawate ,  Takuro Miya ,  Kohichiro Kawate

IPC: H04M1/00 ,  H01R12/00 ,  H01R43/00

CPC classification number: H01R4/04 ,  H01R12/598 ,  H01R12/61 ,  H01R12/613 ,  H05K1/117 ,  H05K3/305 ,  H05K3/361 ,  H05K2201/0212 ,  H05K2201/10356 ,  H05K2201/10977 ,  Y10T29/49117

Abstract: To provide a connecting means that can facilitate electrical connection between the circuit boards mounted in an electronic apparatus and can attain the miniaturization of connecting parts. A cable harness body comprising a plurality of cables for electrically connecting circuit boards mounted in an electronic apparatus and the terminal members disposed on both ends of said cables, wherein at least one of said terminal members is comprised of a flexible circuit board and an adhesive layer on the surface of the electric connecting part of said flexible circuit board.

Abstract translation: 为了提供能够促进安装在电子设备中的电路板之间的电连接的连接装置，并且可以实现连接部件的小型化。 一种电缆线束体，包括多个电缆，用于电连接安装在电子设备中的电路板和设置在所述电缆的两端的端子构件，其中至少一个所述端子构件包括柔性电路板和粘合层 在所述柔性电路板的电连接部分的表面上。

公开(公告)号：US20090321015A1

公开(公告)日：2009-12-31

申请号：US12304577

申请日：2007-06-18

Applicant: Kohichiro Kawate ,  Hitoshi Yamaguchi ,  Noriko Kikuchi ,  Tomihiro Hara ,  Yoshiyuki Ohkura

Inventor： Kohichiro Kawate ,  Hitoshi Yamaguchi ,  Noriko Kikuchi ,  Tomihiro Hara ,  Yoshiyuki Ohkura

IPC: B32B7/12 ,  C08K5/3445

CPC classification number: C08K5/5442 ,  C08G65/336 ,  C08G2650/56 ,  C08L33/06 ,  C08L63/00 ,  C08L71/12 ,  C08L81/06 ,  C08L2666/22 ,  C09J171/00 ,  H01L24/83 ,  H01L2224/2929 ,  H01L2224/2939 ,  H01L2224/83851 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/09701 ,  H05K3/305 ,  H05K3/321 ,  H05K3/361 ,  H05K2201/0212 ,  Y02P70/613 ,  H01L2924/0665 ,  H01L2924/00014 ,  H01L2924/00

Abstract: To provide an adhesive composition which can exhibit high adhesion to a circuit board and also has ability capable of releasing the connection to the circuit board connected and reconnecting the circuit board (repairing properties). An adhesive composition comprising: (i) one or more aromatic-group-containing polyhydroxy ether resins, (ii) a compound having an alkoxysilyl group and an imidazole group in the molecule, and (iii) organic particles, wherein the content of the organic particles is 50% by weight or more based on the weight of the adhesive composition.

Abstract translation: 提供一种能够对电路板具有高粘附性的粘合剂组合物，并且还具有能够释放与连接并重新连接电路板的电路板的连接（修复特性）的能力。 一种粘合剂组合物，其包含：（i）一种或多种含芳族基团的多羟基醚树脂，（ii）分子中具有烷氧基甲硅烷基和咪唑基的化合物，和（iii）有机颗粒，其中有机 基于粘合剂组合物的重量，颗粒为50重量％以上。

公开(公告)号：US20090127692A1

公开(公告)日：2009-05-21

申请号：US11577921

申请日：2005-10-14

Applicant: Kohichiro Kawate ,  Yoshiaki Sato ,  Miwa Monma ,  Yoshihisa Kawate

Inventor： Kohichiro Kawate ,  Yoshiaki Sato ,  Miwa Monma ,  Yoshihisa Kawate

IPC: H01L23/498 ,  H01L21/98

CPC classification number: H01L21/6835 ,  H01L21/563 ,  H01L23/293 ,  H01L24/29 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/1579 ,  H01L2924/351 ,  H05K3/284 ,  H05K3/305 ,  H05K3/3436 ,  H05K3/3457 ,  H05K2201/10977 ,  H05K2203/0278 ,  Y02P70/613 ,  H01L2924/0665 ,  H01L2224/73204 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A method of electrically connecting a bump array package to a wiring board, comprising the steps of: arranging a thermofluidizing, thermosetting adhesive film on a surface of a bump array package having metal bumps; creating a bump array package having a flat surface comprising said metal bumps and said adhesive film, and connecting the bump array package to the wiring board by arranging the flat surface comprising said metal bumps and said adhesive film on the wiring board, and heating the adhesive film at a temperature high enough for finishing the setting of said adhesive film and higher than the melting temperature of said solder.

Abstract translation: 一种将凸块阵列封装电连接到布线板的方法，包括以下步骤：在具有金属凸块的凸块阵列封装的表面上布置热流化热固性粘合剂膜; 产生具有包括所述金属凸块和所述粘合膜的平坦表面的凸块阵列封装，并且通过将包括所述金属凸块和所述粘合剂膜的平坦表面布置在所述布线板上并将所述粘合剂加热来将所述凸块阵列封装连接到所述布线板 在足够高的温度下完成所述粘合剂膜的设置并高于所述焊料的熔化温度的膜。

公开(公告)号：US06753379B1

公开(公告)日：2004-06-22

申请号：US10111113

申请日：2002-04-19

Applicant: Kohichiro Kawate ,  Yorinobo Takamatsu ,  Hitoshi Yamaguchi ,  Akito Muramatsu

Inventor： Kohichiro Kawate ,  Yorinobo Takamatsu ,  Hitoshi Yamaguchi ,  Akito Muramatsu

IPC: C08L2518

CPC classification number: C09J133/062 ,  C08L67/04 ,  C08L2666/18

Abstract: The present invention provides thermally activated adhesive compositions comprising polymer and polyester wherein the adhesive polymer comprises a polymer having hydroxyl and phenyl groups and adhesive films made from the adhesive compositions.

Abstract translation: 本发明提供了包含聚合物和聚酯的热活化粘合剂组合物，其中粘合剂聚合物包含具有羟基和苯基的聚合物以及由粘合剂组合物制成的粘合剂膜。

公开(公告)号：US06265460B1

公开(公告)日：2001-07-24

申请号：US09355602

申请日：1999-07-30

Applicant: Kohichiro Kawate ,  Shigeyoshi Ishii ,  Mario A. Perez

Inventor： Kohichiro Kawate ,  Shigeyoshi Ishii ,  Mario A. Perez

IPC: C08F246

CPC classification number: C09J7/10 ,  C09J2423/00 ,  H01L2224/2919 ,  H01L2224/83855 ,  H01L2224/83885 ,  H01L2924/01005 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/00

Abstract: A hot-melt adhesive composition, which has a high curing rate, requires no water for a curing reaction or no solvent for the formation of a film, has good storage stability, and is suitable for adhering electronic parts or producing integrated circuit (IC) packages is provided. Specifically, a thermosetting hot-melt adhesive composition comprising a polyethylene copolymer having epoxy groups in a molecule as an epoxy component, which further comprises a cationic polymerization catalyst, is provided herein. Also disclosed are heat-bonding film adhesives and adhering methods using the hot-melt adhesive composition.

Abstract translation: 具有高固化速度的热熔粘合剂组合物不需要用于固化反应的水或没有用于形成膜的溶剂，具有良好的储存稳定性，并且适用于粘附电子部件或生产集成电路（IC） 提供包裹。 具体地说，本发明提供了包含分子中具有环氧基的聚环氧基作为环氧成分的热固性热熔粘合剂组合物，其还包含阳离子聚合催化剂。 还公开了使用热熔粘合剂组合物的热粘合膜粘合剂和粘合方法。

公开(公告)号：US06228500B1

公开(公告)日：2001-05-08

申请号：US09341806

申请日：1999-07-19

Applicant: Yuji Hiroshige ,  Kohichiro Kawate

Inventor： Yuji Hiroshige ,  Kohichiro Kawate

IPC: B32B1508

CPC classification number: H05K3/285 ,  C08L2666/14 ,  C08L2666/54 ,  C09J163/00 ,  C09J171/00 ,  H05K1/0393 ,  H05K3/386 ,  Y10T428/31529

Abstract: An adhesive composition, which is useful as an adhesive for FPC protective film and is particularly superior in dimensional stability and adhesion is described herein. The adhesive composition comprises a resin component containing an phenoxy resin, an epoxy resin and a curing agent, characterized in that said resin component further contains a polyester polyol and an inorganic colloid dispersed in said resin component.

Abstract translation: 这里描述了一种粘合剂组合物，其可用作FPC保护膜的粘合剂，并且在尺寸稳定性和粘合力方面特别优异。 粘合剂组合物包含含有苯氧基树脂，环氧树脂和固化剂的树脂组分，其特征在于所述树脂组分还含有分散在所述树脂组分中的聚酯多元醇和无机胶体。