公开(公告)号：US12116506B2

公开(公告)日：2024-10-15

申请号：US17262501

申请日：2019-07-25

Applicant: LG Chem, Ltd.

Inventor： Min Jin Ko ,  Jae Ho Jung ,  Min A Yu ,  Min Kyoun Kim ,  Byung Kyu Cho ,  Taek Yong Lee ,  Dong Yong Kim

IPC: C09J163/04 ,  C08F212/08 ,  C08F220/14 ,  C08F236/06 ,  C08G18/10 ,  C08G18/24 ,  C08G18/48 ,  C08G18/67 ,  C08G18/75 ,  C08G59/14 ,  C08G59/24 ,  C08G59/40 ,  C08L51/04 ,  C09J11/08 ,  C09J151/04 ,  C09J175/08

CPC classification number: C09J163/04 ,  C08F212/08 ,  C08F220/14 ,  C08F236/06 ,  C08G18/10 ,  C08G18/24 ,  C08G18/4825 ,  C08G18/6715 ,  C08G18/755 ,  C08G59/14 ,  C08G59/245 ,  C08G59/4021 ,  C08L51/04 ,  C09J11/08 ,  C09J151/04 ,  C09J175/08 ,  C08L2201/08 ,  C08L2205/025 ,  C08L2205/035 ,  C08L2205/18 ,  C08L2207/53 ,  C09J2301/30 ,  C09J2301/414 ,  C09J2451/00 ,  C09J2463/00 ,  C09J2475/00

Abstract: An epoxy-based adhesive composition and methods for manufacturing the same are provided. The adhesive composition provides excellent adhesion strength, peel strength and impact-resistant strength uniformly over a wide temperature range.

公开(公告)号：US12054648B2

公开(公告)日：2024-08-06

申请号：US17262508

申请日：2019-07-25

Applicant: LG Chem, Ltd.

Inventor： Min Jin Ko

IPC: C09J163/00 ,  C09J7/38

CPC classification number: C09J163/00 ,  C09J7/38 ,  C09J2409/00 ,  C09J2433/00 ,  C09J2463/00 ,  C09J2475/00

Abstract: An epoxy-based adhesive composition and the methods of manufacturing the same are provided. The adhesive composition provides excellent adhesion strength, peel strength and impact-resistant strength uniformly over a wide temperature range.

公开(公告)号：US20210284884A1

公开(公告)日：2021-09-16

申请号：US17262431

申请日：2019-07-25

Applicant: LG Chem, Ltd.

Inventor： Min Jin Ko ,  Jae Ho Jung ,  Min A Yu ,  Min Kyoun Kim ,  Byung Kyu Cho ,  Taek Yong Lee ,  Dong Yong Kim

IPC: C09J163/04 ,  C09J175/08 ,  C09J151/04 ,  C09J11/08 ,  C08F236/06 ,  C08F212/08 ,  C08F220/14 ,  C08L51/04 ,  C08G18/10 ,  C08G18/24 ,  C08G18/48 ,  C08G18/67 ,  C08G18/75 ,  C08G59/24 ,  C08G59/40

Abstract: An epoxy-based adhesive composition and methods for manufacturing the same are provided. The adhesive composition provides excellent adhesion strength, peel strength and impact-resistant strength uniformly over a wide temperature range.

公开(公告)号：US09688820B2

公开(公告)日：2017-06-27

申请号：US14778506

申请日：2014-04-04

Applicant: LG CHEM, LTD.

Inventor： Min Jin Ko ,  Kyung Mi Kim ,  Young Ju Park

IPC: C08G77/12 ,  C08G77/20 ,  C08L83/04 ,  H01L33/56 ,  C08G77/14 ,  H01L23/29 ,  C08G77/00

CPC classification number: C08G77/12 ,  C08G77/14 ,  C08G77/20 ,  C08G77/80 ,  C08K5/5419 ,  C08L83/00 ,  C08L83/04 ,  H01L23/296 ,  H01L33/56 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Provided are a curable composition and its use. The curable composition may provide a cured product having excellent processability and workability, no surface stickiness, and an excellent adhesive property. The curable composition has excellent thermal resistance, crack resistance, and gas permeability. The curable composition may have stable performance when being applied to a semiconductor device at a high temperature for a long time.

公开(公告)号：US09624345B2

公开(公告)日：2017-04-18

申请号：US14606443

申请日：2015-01-27

Applicant: LG CHEM, LTD.

Inventor： Min Jin Ko ,  Bum Gyu Choi ,  Jae Ho Jung ,  Dae Ho Kang ,  Min Kyoun Kim ,  Byung Kyu Cho

IPC: H01L23/29 ,  C08L83/04 ,  C08G77/04 ,  H01L33/56 ,  C08L83/06 ,  C08G77/14 ,  C08G77/20 ,  C08G77/00

CPC classification number: C08G77/04 ,  C08G77/14 ,  C08G77/20 ,  C08G77/80 ,  C08G2190/00 ,  C08K5/5419 ,  C08K5/56 ,  C08L83/00 ,  C08L83/04 ,  C08L83/06 ,  H01L23/293 ,  H01L23/296 ,  H01L33/56 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Provided are a curable composition and its use. The curable composition exhibits excellent processability and workability before curing, and excellent light extraction efficiency, hardness, thermal and shock resistance, moisture resistance, gas permeability, and adhesiveness after curing. In addition, the curable composition may provide a cured product that exhibits long-lasting durability and reliability even under harsh conditions, and does not causing whitening and surface stickiness.

公开(公告)号：US09455210B2

公开(公告)日：2016-09-27

申请号：US13952798

申请日：2013-07-29

Applicant: LG CHEM, LTD.

Inventor： Min Jin Ko ,  Bum Gyu Choi ,  Jae Ho Jung ,  Dae Ho Kang ,  Min Kyoun Kim ,  Byung Kyu Cho

IPC: H01L23/29 ,  H01L33/56 ,  C08L83/04 ,  C08L83/14 ,  C08G77/12 ,  C08G77/14 ,  C08G77/20 ,  C08G77/00

CPC classification number: H01L23/296 ,  C08G77/12 ,  C08G77/14 ,  C08G77/20 ,  C08G77/80 ,  C08K5/56 ,  C08L83/00 ,  C08L83/04 ,  C08L83/06 ,  C08L83/14 ,  H01L33/56 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Provided are a curable composition and its use. The curable composition can exhibit excellent processibility and workability. The curable composition exhibits excellent light extraction efficiency, hardness, thermal and shock resistance, moisture resistance, gas permeability and adhesiveness, after curing. In addition, the curable composition can provide a cured product that exhibits long-lasting durability and reliability, and that does not cause whitening and surface stickiness even under harsh conditions.

Abstract translation: 提供可固化组合物及其用途。 固化性组合物可以表现出优异的加工性和加工性。 固化性组合物在固化后表现出优异的光提取效率，硬度，耐热和抗冲击性，耐湿性，透气性和粘合性。 此外，固化性组合物可以提供具有持久耐久性和可靠性的固化物，即使在苛刻条件下也不会引起白化和表面粘性。

公开(公告)号：US09362468B2

公开(公告)日：2016-06-07

申请号：US14606532

申请日：2015-01-27

Applicant: LG CHEM, LTD.

Inventor： Min Jin Ko ,  Jae Ho Jung ,  Bum Gyu Choi ,  Dae Ho Kang ,  Min Kyoun Kim ,  Byung Kyu Cho

IPC: C08G77/04 ,  H01L33/56 ,  C08L83/04 ,  H01L23/29 ,  G02F1/1335 ,  C08G77/12 ,  C08G77/20 ,  C08G77/00 ,  C08G77/14

CPC classification number: H01L33/56 ,  C08G77/04 ,  C08G77/12 ,  C08G77/14 ,  C08G77/20 ,  C08G77/70 ,  C08G77/80 ,  C08G2190/00 ,  C08K5/5419 ,  C08K5/56 ,  C08L83/00 ,  C08L83/04 ,  C08L83/06 ,  G02F1/133603 ,  G02F1/133617 ,  H01L23/293 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Provided are a curable composition and its use. The curable composition having excellent processability, workability, heat resistance, and light resistance, and having no problem of discoloring despite using for a long time may be provided. The curable composition which may scatter light and disperse linearity of light when used as an encapsulant of an optical semiconductor such as an LED may be provided.

Abstract translation: 提供可固化组合物及其用途。 可以提供加工性，加工性，耐热性和耐光性优异的固化性组合物，并且尽管长期使用也不会出现褪色问题。 可以提供当用作诸如LED的光学半导体的密封剂时可散射光并分散光线的可固化组合物。

公开(公告)号：US09029493B2

公开(公告)日：2015-05-12

申请号：US14275439

申请日：2014-05-12

Applicant: LG Chem, Ltd.

Inventor： Bum Gyu Choi ,  Min Jin Ko ,  Myung Sun Moon ,  Jae Ho Jung ,  Dae Ho Kang ,  Min Kyoun Kim ,  Byung Kyu Cho

IPC: C08G77/04 ,  C09K11/00 ,  H01L33/00 ,  H01L33/56 ,  C08G77/18 ,  C08L83/04 ,  H01L23/29

CPC classification number: H01L33/56 ,  C08G77/04 ,  C08G77/12 ,  C08G77/18 ,  C08G77/20 ,  C08G77/80 ,  C08L83/04 ,  H01L23/296 ,  H01L2924/0002 ,  H01L2924/00 ,  C08L83/00

Abstract: Provided is an organopolysiloxane and its use. The organopolysiloxane may exhibit excellent processibility and workability. In addition, when the organopolysiloxane is used as an encapsulant, it exhibits excellent light extraction efficiency, crack resistance, hardness, thermal and shock resistance and an adhesive property. Moreover, the organopolysiloxane may provide an encapsulant exhibiting stable durability and reliability under severe conditions for a long time and having no whitening and surface stickiness.

Abstract translation: 提供有机聚硅氧烷及其用途。 有机聚硅氧烷可以表现出优异的加工性和可加工性。 此外，当使用有机聚硅氧烷作为密封剂时，其显示出优异的光提取效率，抗裂纹性，硬度，耐热和抗冲击性以及粘合性。 此外，有机聚硅氧烷可以在苛刻条件下长时间提供具有稳定的耐久性和可靠性的密封剂，并且没有美白和表面粘性。

公开(公告)号：US09006374B2

公开(公告)日：2015-04-14

申请号：US14094209

申请日：2013-12-02

Applicant: LG Chem, Ltd.

Inventor： Min Jin Ko ,  Bum Gyu Choi ,  Myung Sun Moon ,  Jae Ho Jung ,  Dae Ho Kang ,  Min Kyoun Kim ,  Byung Kyu Cho

IPC: C08G77/04 ,  C09K11/00 ,  H01L33/00 ,  H01L23/29 ,  H01L33/56 ,  C08K5/5415 ,  C08L83/04

CPC classification number: H01L23/296 ,  C08G77/04 ,  C08G77/12 ,  C08G77/14 ,  C08G77/20 ,  C08K5/5415 ,  C08K5/56 ,  C08L83/00 ,  C08L83/04 ,  C08L83/06 ,  H01L33/56 ,  H01L2924/0002 ,  H01L2924/00

Abstract: This application relates to a curable composition and its use. The curable composition may exhibit excellent processibility and workability. The curable composition has excellent light extraction efficiency, crack resistance, hardness, thermal and shock resistance and an adhesive property after curing. The curable composition may provide a cured product exhibiting stable durability and reliability under severe conditions for a long time and having no whitening and surface stickiness.

Abstract translation: 本申请涉及可固化组合物及其用途。 可固化组合物可表现出优异的加工性和加工性。 该固化性组合物具有优异的光提取效率，耐裂纹性，硬度，耐热冲击性和固化后的粘合性。 可固化组合物可以在苛刻条件下长时间提供稳定的耐久性和可靠性的固化产物，并且没有美白和表面粘性。

公开(公告)号：US08916653B2

公开(公告)日：2014-12-23

申请号：US13935857

申请日：2013-07-05

Applicant: LG Chem, Ltd.

Inventor： Bum Gyu Choi ,  Min Jin Ko ,  Myung Sun Moon ,  Jae Ho Jung ,  Dae Ho Kang ,  Min Kyoun Kim ,  Byung Kyu Cho

IPC: H01L23/29 ,  C08L83/04 ,  H01L33/56 ,  H01L33/52 ,  G02F1/1335 ,  C08G77/20 ,  C08G77/14 ,  C08G77/12

CPC classification number: H01L33/52 ,  C08G77/12 ,  C08G77/14 ,  C08G77/20 ,  C08K5/56 ,  C08L83/00 ,  C08L83/04 ,  G02F1/133603 ,  H01L23/29 ,  H01L23/296 ,  H01L33/56 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A curable composition and use thereof are provided. The exemplary curable composition can show excellent processability and workability. Also, the curable composition can have a high refractive index before or after curing. The composition has low moisture permeability before or after curing and shows excellent crack resistance, thermal shock resistance, adhesive property and hardness. In addition, the composition does not cause color change such as whitening under a high-temperature or high-humidity condition, and does not exhibit stickiness on a surface thereof. The curable composition may be used as an adhesive material or as an encapsulation material for semiconductor devices such as an LED, a CCD, a photo coupler, or a photovoltaic cell.

Abstract translation: 提供了可固化组合物及其用途。 示例性的可固化组合物可显示出优异的加工性和可加工性。 此外，固化性组合物在固化前后可具有高折射率。 该组合物在固化前后的透湿性低，显示出优异的抗裂性，耐热冲击性，粘合性和硬度。 此外，该组合物在高温或高湿度条件下不会引起变色，例如增白，并且在其表面上不显示粘性。 可固化组合物可以用作粘合剂材料或用作诸如LED，CCD，光电耦合器或光伏电池的半导体器件的封装材料。