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公开(公告)号：US20210284883A1
公开(公告)日：2021-09-16
申请号：US17262508
申请日：2019-07-25
Applicant: LG Chem, Ltd.
Inventor： Min Jin Ko
IPC: C09J163/00 , C09J7/38
Abstract: An epoxy-based adhesive composition and the methods of manufacturing the same are provided. The adhesive composition provides excellent adhesion strength, peel strength and impact-resistant strength uniformly over a wide temperature range.
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公开(公告)号：US09870970B2
公开(公告)日：2018-01-16
申请号：US15035903
申请日：2015-01-28
Applicant: LG CHEM, LTD.
Inventor： Min Jin Ko , Kyung Mi Kim , Jae Ho Jung , Bum Gyu Choi , Min Kyoun Kim
IPC: C08G77/12 , H01L23/29 , C08G77/20 , C09J183/04 , C08G77/00 , C08G77/08 , H01L33/56 , C08G77/38 , C08L83/04 , C08K5/5435 , C08L83/06 , C08K5/5419 , C08G77/14
CPC classification number: H01L23/296 , C08G77/08 , C08G77/12 , C08G77/14 , C08G77/20 , C08G77/38 , C08G77/48 , C08G77/80 , C08G2170/00 , C08G2190/00 , C08K5/5419 , C08K5/5435 , C08K5/56 , C08K2201/008 , C08L83/00 , C08L83/04 , C08L83/06 , C08L2201/08 , C08L2201/10 , C08L2203/206 , C08L2205/025 , C09J183/04 , C09J2203/318 , H01L33/56 , H01L2933/0033 , H01L2933/005
Abstract: The present application relates to a cured product and the use thereof. When the cured product, for example, is applied to a semiconductor device such as an LED or the like, the decrease in brightness may be minimized even upon the long-term use of the device, and since the cured product has excellent cracking resistance, the device having high long-term reliability may be provided. The cured product has excellent processability, workability, and adhesive properties or the like, and does not cause whitening and surface stickiness, etc. Further, the cured product exhibits excellent heat resistance at high temperature, gas barrier properties, etc. The cured product may be, for example, applied as an encapsulant or an adhesive material of a semiconductor device.
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公开(公告)号：US09598542B2
公开(公告)日：2017-03-21
申请号：US14133403
申请日：2013-12-18
Applicant: LG CHEM, LTD.
Inventor： Bum Gyu Choi , Min Jin Ko , Myung Sun Moon , Jae Ho Jung , Dae Ho Kang , Min Kyoun Kim , Byung Kyu Cho
IPC: C08G77/04 , C08L83/04 , H01L33/56 , H01L23/29 , C08L83/06 , C08K5/00 , C08G77/12 , C08G77/20 , H01L33/50 , C08K5/5425 , C08K5/54 , C08G77/14
CPC classification number: C08G77/04 , C08G77/12 , C08G77/14 , C08G77/20 , C08K5/0025 , C08K5/54 , C08K5/5425 , C08K5/56 , C08L83/00 , C08L83/04 , C08L83/06 , H01L23/296 , H01L33/501 , H01L33/56 , H01L2924/0002 , H01L2924/00
Abstract: Provided is a curable composition and its use. The curable composition may exhibit excellent processibility and workability. The curable composition has excellent light extraction efficiency, crack resistance, hardness, thermal and shock resistance and an adhesive property after curing. The curable composition may provide a cured product exhibiting stable durability and reliability under severe conditions for a long time and having no whitening and surface stickiness.
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公开(公告)号：US09410018B2
公开(公告)日：2016-08-09
申请号：US14142067
申请日：2013-12-27
Applicant: LG CHEM, LTD.
Inventor： Min Jin Ko , Myung Sun Moon , Jae Ho Jung , Bum Gyu Choi , Dae Ho Kang , Min Kyoun Kim
IPC: C08G77/12 , H01L33/56 , C08K5/5419 , C08K5/5425 , C08L83/04 , H01L23/29 , C08G77/20 , C08G77/00
CPC classification number: C08G77/12 , C08G77/20 , C08G77/70 , C08K5/5419 , C08K5/5425 , C08L83/04 , H01L23/296 , H01L33/56 , H01L2924/0002 , C08L83/00 , H01L2924/00
Abstract: The present application relates to a curable composition. A curable composition may be provided; which shows excellent processability and workability; which shows excellent light extraction efficiency, crack resistance, hardness, thermal shock resistance and adhesive strength after curing; and which has excellent reliability and long-term reliability under high-temperature and/or high-moisture conditions. Also, turbidity and surface stickiness may be prevented in the cured product.
Abstract translation: 本申请涉及可固化组合物。 可以提供可固化组合物; 显示出优异的加工性和可加工性; 显示出优异的光提取效率，抗裂性，硬度，耐热冲击性和固化后的粘合强度; 并且在高温和/或高湿度条件下具有优异的可靠性和长期的可靠性。 此外，可以防止在固化产物中的浊度和表面粘性。
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公开(公告)号：US09243143B2
公开(公告)日：2016-01-26
申请号：US14459184
申请日：2014-08-13
Applicant: LG CHEM, LTD.
Inventor： Min Jin Ko , Kyung Mi Kim , Young Ju Park , Bum Gyu Choi , Dae Ho Kang , Byung Kyu Cho , You Na Yang
CPC classification number: C08L83/04 , C08G77/12 , C08G77/14 , C08G77/20 , C08G77/80 , C08L2203/206 , C08L2205/025 , H01L23/296 , H01L33/56 , H01L2924/0002 , C08L83/00 , H01L2924/00
Abstract: Provided are a curable composition and its use. The curable composition may provide a cured product having excellent processability and workability, no whitening and surface stickiness, and an excellent adhesive property. Since the curable composition has excellent thermal resistance, gas barrier-ability, and crack resistance, even when a semiconductor device to which the composition is applied is used at a high temperature for a long time, performance of the device may be stably maintained. Specifically the curable composition is a blend of three different polyorganosiloxanes having aliphatic unsaturated groups and specific Ar/Si ratios and a polyorganosiloxane having SiH groups.
Abstract translation: 提供可固化组合物及其用途。 固化性组合物可以提供加工性和加工性优异的固化物，不会发白，表面发粘，粘合性优异。 由于可固化组合物具有优异的耐热性，阻气性和抗裂性，所以即使长时间在高温下使用组合物使用的半导体器件，也可以稳定地保持器件的性能。 具体地说，可固化组合物是具有脂族不饱和基团和特定Ar / Si比率的三种不同聚有机硅氧烷和具有SiH基团的聚有机硅氧烷的共混物。
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Patent Agency Ranking
公开(公告)号：US08946350B2
公开(公告)日：2015-02-03
申请号：US13953493
申请日：2013-07-29
Applicant: LG Chem, Ltd.
Inventor： Min Jin Ko , Jae Ho Jung , Bum Gyu Choi , Min A Yu
CPC classification number: H01L33/56 , C08G77/12 , C08G77/20 , C08G77/80 , C08K7/02 , C08K7/10 , C08L83/14 , C09D183/04 , H01L23/296 , H01L2924/0002 , H01L2924/00
Abstract: Provided are a curable composition and its use. The curable composition can exhibit excellent processibility and workability. The curable composition exhibits excellent light extraction efficiency, hardness, thermal and shock resistance, moisture resistance, gas permeability and adhesiveness, after curing. In addition, the curable composition can provide a cured product that exhibits long-lasting durability and reliability even under harsh conditions, and that does not cause whitening and surface stickiness.
Abstract translation: 提供可固化组合物及其用途。 固化性组合物可以表现出优异的加工性和加工性。 固化性组合物在固化后表现出优异的光提取效率，硬度，耐热和抗冲击性，耐湿性，透气性和粘合性。 此外，固化性组合物可以提供即使在恶劣条件下也具有持久耐久性和可靠性的固化物，并且不会引起白化和表面粘性。
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公开(公告)号：US12173194B2
公开(公告)日：2024-12-24
申请号：US17262850
申请日：2019-07-25
Applicant: LG Chem, Ltd.
Inventor： Min Jin Ko , Jae Ho Jung , Min A Yu , Min Kyoun Kim , Byung Kyu Cho , Taek Yong Lee , Dong Yong Kim
IPC: C09J163/00 , B05D3/00
Abstract: An epoxy-based adhesive composition and methods for manufacturing the same are provided. The adhesive composition provides excellent adhesive strength and impact strength uniformly over a wide temperature range. In addition, the adhesive composition of the present application may have a level of viscosity capable of ensuring excellent processability.
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公开(公告)号：US12098306B2
公开(公告)日：2024-09-24
申请号：US17262431
申请日：2019-07-25
Applicant: LG Chem, Ltd.
Inventor： Min Jin Ko , Jae Ho Jung , Min A Yu , Min Kyoun Kim , Byung Kyu Cho , Taek Yong Lee , Dong Yong Kim
IPC: C09J163/00 , B32B27/38 , B32B27/40 , C08F212/08 , C08F220/14 , C08F236/06 , C08G18/10 , C08G18/24 , C08G18/48 , C08G18/67 , C08G18/75 , C08G59/24 , C08G59/40 , C08L51/04 , C09J11/08 , C09J151/04 , C09J163/04 , C09J175/08
CPC classification number: C09J163/04 , C08F212/08 , C08F220/14 , C08F236/06 , C08G18/10 , C08G18/24 , C08G18/4825 , C08G18/6715 , C08G18/755 , C08G59/245 , C08G59/4021 , C08L51/04 , C09J11/08 , C09J151/04 , C09J175/08 , C08L2201/08 , C08L2205/025 , C08L2205/035 , C08L2205/18 , C08L2207/53 , C09J2301/30 , C09J2301/414 , C09J2451/00 , C09J2463/00 , C09J2475/00
Abstract: An epoxy-based adhesive composition and methods for manufacturing the same are provided. The adhesive composition provides excellent adhesion strength, peel strength and impact-resistant strength uniformly over a wide temperature range.
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公开(公告)号：US20210284885A1
公开(公告)日：2021-09-16
申请号：US17262501
申请日：2019-07-25
Applicant: LG Chem, Ltd.
Inventor： Min Jin Ko , Jae Ho Jung , Min A Yu , Min Kyoun Kim , Byung Kyu Cho , Taek Yong Lee , Dong Yong Kim
IPC: C09J163/04 , C09J11/08 , C09J151/04 , C09J175/08 , C08F236/06 , C08F212/08 , C08F220/14 , C08L51/04 , C08G59/14 , C08G59/24 , C08G59/40 , C08G18/10 , C08G18/24 , C08G18/48 , C08G18/67 , C08G18/75
Abstract: An epoxy-based adhesive composition and methods for manufacturing the same are provided. The adhesive composition provides excellent adhesion strength, peel strength and impact-resistant strength uniformly over a wide temperature range.
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公开(公告)号：US20210284882A1
公开(公告)日：2021-09-16
申请号：US17262340
申请日：2019-07-25
Applicant: LG Chem, Ltd.
Inventor： Min Jin Ko , Jae Ho Jung , Min A Yu , Min Kyoun Kim , Byung Kyu Cho , Taek Yong Lee , Dong Yong Kim
IPC: C09J163/00 , C09J7/38 , C09J11/08 , C09J11/06
Abstract: The present application relates to an epoxy-based adhesive composition, which may include (a) one or more epoxy resins, (b) a urethane resin having a weight average molecular weight (Mw) of 30,000 or less, and having a polytetrahydrofuran unit, (c) a core-shell rubber in the form of secondary particles in which two or more core-shell rubbers in the form of primary particles are aggregated and (d) one or more epoxy curing agents. The adhesive composition of the present application can provide excellent adhesion strength, peel strength and impact-resistant strength uniformly over a wide temperature range.
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