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    Packaged wavelength converted light emitting device
    21.
    发明授权
    Packaged wavelength converted light emitting device 有权

    公开(公告)号：US10998473B2

    公开(公告)日：2021-05-04

    申请号：US15319095

    申请日：2015-06-23

    Applicant: Lumileds LLC

    Inventor： Grigoriy Basin ,  Jing Liu ,  Joseph Chungchih Juan ,  R B Syivaram Balakrishnan ,  Thierry Maurice Francois De Smet

    IPC: H01L33/50 ,  H01L33/54 ,  H01L33/48 ,  H01L25/075

    Abstract: Embodiments of the invention include a plurality of light emitting devices, each light emitting device having a top surface, a bottom surface opposite the top surface, and at least one side surface connecting the top surface and the bottom surface. A wavelength converting layer is disposed in direct contact with the top surface and one side surface of each of the plurality of light emitting devices to mechanically connect each of the plurality of light emitting devices together. The wavelength converting layer is made up of a wavelength converting material, an adhesive material, and a transparent material that has a thermal conductivity of at least 0.2 W/mK. The adhesive material and the transparent material have indices of refraction that vary less than ten percent.

    Light emitting device with an optical element and a reflector
    23.
    发明授权
    Light emitting device with an optical element and a reflector 有权

    公开(公告)号：US10199549B2

    公开(公告)日：2019-02-05

    申请号：US14891332

    申请日：2014-05-15

    Applicant: Lumileds LLC

    Inventor： Jerome Chandra Bhat ,  Grigoriy Basin ,  Kenneth Vampola

    IPC: H01L33/60 ,  H01L33/58 ,  H01L33/50 ,  H01L33/44

    Abstract: A structure according to embodiments of the invention includes a semiconductor light emitting device and an optical element disposed over the semiconductor light emitting device. The semiconductor light emitting device is disposed in a recess in the optical element. A reflector is disposed on a bottom surface of the optical element. A method according to embodiments of the invention includes disposing a semiconductor light emitting device on a substrate and forming a reflector adjacent the semiconductor light emitting device. An optical element is formed over the semiconductor light emitting device. The semiconductor light emitting device is removed from the substrate.

    Glueless light emitting device with phosphor converter
    26.
    发明授权
    Glueless light emitting device with phosphor converter 有权

    公开(公告)号：US11024781B2

    公开(公告)日：2021-06-01

    申请号：US15102986

    申请日：2014-12-30

    Applicant: Lumileds LLC

    Inventor： Grigoriy Basin ,  Paul Martin ,  Han Ho Choi

    IPC: H01L33/00 ,  H01L33/50 ,  H01L33/60 ,  H01L33/58

    Abstract: A multi-stage lamination process is used to laminate a wavelength conversion film to a transparent substrate, and subsequently to a light emitting element. The wavelength conversion film may be an uncured phosphor-embedded silicone polymer, and the lamination process includes heating the polymer so that it adheres to the transparent substrate, but is not fully cured. The phosphor-laminated transparent substrate is sliced/diced and the wavelength conversion film of each diced substrate is placed upon each light emitting element. The semi-cured wavelength conversion film is then laminated to the light emitting element via heating, consequently curing the phosphor film. Throughout the process, no glue is used, and the optical losses associated with glue material are not introduced.

    LED with ceramic green phosphor and protected red phosphor layer
    27.
    发明授权
    LED with ceramic green phosphor and protected red phosphor layer 有权

    公开(公告)号：US10205067B2

    公开(公告)日：2019-02-12

    申请号：US15170442

    申请日：2016-06-01

    Applicant: Lumileds LLC

    Inventor： April Dawn Schricker ,  Kim Kevin Mai ,  Grigoriy Basin ,  Uwe Mackens ,  Joost Peter Andre Vogels ,  Aldegonda Lucia Weijers ,  Karl Adriaan Zijtveld

    IPC: H01L33/50 ,  H01L33/00 ,  H01L33/60 ,  H01L33/64

    Abstract: A ceramic green wavelength conversion element (120) is coated with a red wavelength conversion material (330) and placed above a blue light emitting element (110) such that the ceramic element (120) is attached to the light emitting element (110), thereby providing an efficient thermal coupling from the red and green converters (330, 120) to the light emitting element (110) and its associated heat sink. To protect the red converter coating (330) from the effects of subsequent processes, a sacrificial clear coating (340) is created above the red converter element (330). This clear coating (340) may be provided as a discrete layer of clear material, or it may be produced by allowing the red converters to settle to the bottom of its suspension material, thereby forming a converter-free upper layer that can be subjected to the subsequent fabrication processes.

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