公开(公告)号：US10153404B2

公开(公告)日：2018-12-11

申请号：US15697087

申请日：2017-09-06

Applicant: Lumileds LLC

Inventor： Grigoriy Basin ,  Mikhail Fouksman

IPC: H01L33/50 ,  H01L23/00 ,  H01L25/075 ,  H01L33/52 ,  H01L33/60 ,  H01L33/64

Abstract: In one embodiment, a solid cylindrical tablet is pre-formed for a reflective cup containing an LED die, such as a blue LED die. The tablet comprises uniformly-mixed phosphor particles and transparent/translucent particles of a high TC material, such as quartz, in a hardened silicone binder, where the index of refraction of the high TC material is matched to that of the silicone to minimize internal reflection. Tablets can be made virtually identical in composition and size. The bulk of the tablet will be the high TC material. After the tablet is placed in the cup, the LED module is heated, preferably in a vacuum, to melt the silicone so that the mixture flows around the LED die and fills the voids to encapsulate the LED die. The silicone is then cooled to harden.

公开(公告)号：US20230178690A1

公开(公告)日：2023-06-08

申请号：US18055969

申请日：2022-11-16

Applicant: Lumileds LLC

Inventor： Grigoriy Basin ,  Mikhail Fouksman ,  Norbert Lesch

IPC: H01L33/46 ,  H01L25/075 ,  H01L33/58

CPC classification number: H01L33/46 ,  H01L25/0753 ,  H01L33/58 ,  H01L2933/0025 ,  H01L2933/0058

Abstract: Described is a light-emitting device and methods of manufacturing thereof. The light-emitting device comprises unpackaged light-emitting diodes arranged in a grid. The unpackaged light-emitting diodes in the are fixed in place by the reflective coating material. Each of the plurality of unpackaged light-emitting diodes are surrounded by a reflective coating material and may be separated by a layer of light absorbing material.

公开(公告)号：US10895669B2

公开(公告)日：2021-01-19

申请号：US16572074

申请日：2019-09-16

Applicant: Lumileds LLC

Inventor： Walter Daeschner ,  Mikhail Fouksman ,  Mohiuddin Mala ,  Ashim Shatil Haque

IPC: G02B3/00 ,  H01L33/58 ,  F21V5/00 ,  F21V17/10 ,  F21V19/00 ,  G02B19/00 ,  H01L25/075 ,  H01L33/60 ,  H01L33/62

Abstract: A light emitting diode (LED) light source is disclosed. The LED light source comprises a lens structure that includes a hemispherical dome with a base. The LED light source comprises a cavity in the base. The cavity has an opening and a taper such that a cross-section area within the cavity is smaller than an area of the opening. The LED light source comprises a light emitting device comprising an LED die contacting the taper. The taper allows for easy insertion of the LED die into the lens structure. The taper serves to accurately align the LED die when the LED die is inserted.

公开(公告)号：US20210132263A1

公开(公告)日：2021-05-06

申请号：US17149129

申请日：2021-01-14

Applicant: Lumileds LLC

Inventor： Walter Daeschner ,  Mikhail Fouksman ,  Mohiuddin Mala ,  Ashim Shatil Haque

IPC: G02B3/00 ,  H01L33/58 ,  F21V5/00 ,  F21V17/10 ,  F21V19/00 ,  G02B19/00 ,  H01L25/075 ,  H01L33/60 ,  H01L33/62

Abstract: A light emitting diode (LED) light source is disclosed. The LED light source comprises a lens structure that includes a hemispherical dome with a base. The LED light source comprises a cavity in the base. The cavity has an opening and a taper such that a cross-section area within the cavity is smaller than an area of the opening. The LED light source comprises a light emitting device comprising an LED die contacting the taper. The taper allows for easy insertion of the LED die into the lens structure. The taper serves to accurately align the LED die when the LED die is inserted.

公开(公告)号：US20230155073A1

公开(公告)日：2023-05-18

申请号：US17990450

申请日：2022-11-18

Applicant: LUMILEDS LLC

Inventor： Grigoriy Basin ,  Mikhail Fouksman ,  Venkata Ananth Tamma ,  Tze Yang Hin ,  Kok Siang Saw ,  Ruen Ching Law

IPC: H01L33/50 ,  H01L33/10 ,  H01L33/34 ,  H01L33/60

CPC classification number: H01L33/50 ,  H01L33/10 ,  H01L33/346 ,  H01L33/60

Abstract: A light-emitting diode (LED) package and method of manufacture are described. An LED package includes an LED die that has a top surface, a bottom surface and side surfaces. The package further includes a wavelength converting element having a top surface, a bottom surface and side surfaces. The bottom surface of the wavelength converting element is adjacent the top surface of the LED die. The package further includes a light reflecting coating surrounding at least the side surfaces of both the LED die and the wavelength converting element. The light reflective coating has at a least a portion that extends above the top surface of the wavelength converting element.

公开(公告)号：US11313996B2

公开(公告)日：2022-04-26

申请号：US17149129

申请日：2021-01-14

Applicant: Lumileds LLC

Inventor： Walter Daeschner ,  Mikhail Fouksman ,  Mohiuddin Mala ,  Ashim Shatil Haque

IPC: G02B3/00 ,  H01L33/58 ,  F21V5/00 ,  F21V17/10 ,  F21V19/00 ,  G02B19/00 ,  H01L25/075 ,  H01L33/60 ,  H01L33/62

Abstract: A light emitting diode (LED) light source is disclosed. The LED light source comprises a lens structure that includes a hemispherical dome with a base. The LED light source comprises a cavity in the base. The cavity has an opening and a taper such that a cross-section area within the cavity is smaller than an area of the opening. The LED light source comprises a light emitting device comprising an LED die contacting the taper. The taper allows for easy insertion of the LED die into the lens structure. The taper serves to accurately align the LED die when the LED die is inserted.

公开(公告)号：US10416356B2

公开(公告)日：2019-09-17

申请号：US15110840

申请日：2015-01-04

Applicant: Lumileds LLC

Inventor： Walter Daeschner ,  Mikhail Fouksman ,  Mohiuddin Mala ,  Ashim Shatil Haque

IPC: F21V5/00 ,  G02B3/00 ,  H01L33/58 ,  F21V17/10 ,  F21V19/00 ,  G02B19/00 ,  H01L25/075 ,  H01L33/60 ,  H01L33/62

Abstract: A lens structure is pre-formed with features that facilitate accurate alignment of a light emitting chip within the lens structure. To ease manufacturing, the features include tapered walls that allow for easy insertion of the light emitting chip into the lens structure, the taper serving to accurately align the light emitting chip when the chip is fully inserted. The taper may include linearly sloped or curved walls, including complex shapes. An adhesive may be used to secure the light emitting chip to the lens structure. The light emitting chips may be picked-and-placed into an array of lens structures, or picked-and-placed onto a substrate that may be overlaid by the array of lens structures.

公开(公告)号：US20170365747A1

公开(公告)日：2017-12-21

申请号：US15697087

申请日：2017-09-06

Applicant: Lumileds LLC

Inventor： Grigoriy Basin ,  Mikhail Fouksman

IPC: H01L33/50 ,  H01L33/64 ,  H01L33/52 ,  H01L33/60 ,  H01L25/075 ,  H01L23/00

CPC classification number: H01L33/501 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/505 ,  H01L33/52 ,  H01L33/60 ,  H01L33/644 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0075 ,  H01L2924/00

Abstract: In one embodiment, a solid cylindrical tablet is pre-formed for a reflective cup containing an LED die, such as a blue LED die. The tablet comprises uniformly-mixed phosphor particles and transparent/translucent particles of a high TC material, such as quartz, in a hardened silicone binder, where the index of refraction of the high TC material is matched to that of the silicone to minimize internal reflection. Tablets can be made virtually identical in composition and size. The bulk of the tablet will be the high TC material. After the tablet is placed in the cup, the LED module is heated, preferably in a vacuum, to melt the silicone so that the mixture flows around the LED die and fills the voids to encapsulate the LED die. The silicone is then cooled to harden.