公开(公告)号：US20100307823A1

公开(公告)日：2010-12-09

申请号：US12452665

申请日：2008-07-17

Applicant: Yuji Kawamata ,  Minoru Ueshima ,  Tomu Tamura ,  Kazuhiro Matsushita ,  Masashi Sakamoto

Inventor： Yuji Kawamata ,  Minoru Ueshima ,  Tomu Tamura ,  Kazuhiro Matsushita ,  Masashi Sakamoto

IPC: H01R4/02 ,  C22C13/02 ,  B23K1/00

CPC classification number: C22C13/00 ,  B23K35/26 ,  B23K35/262 ,  H05K3/3463

Abstract: A lead-free solder alloy which can be used for soldering of vehicle-mounted electronic circuits and which exhibits high reliability is provided.The alloy consists essentially of Ag: 2.8-4 mass %, In: 3-5.5 mass %, Cu: 0.5-1.1 mass %, if necessary Bi: 0.5-3 mass %, and a remainder of Sn. In is at least partially in solid solution in the Sn matrix.

Abstract translation: 提供了可用于车载电子电路的焊接并且具有高可靠性的无铅焊料合金。 该合金基本上由Ag：2.8-4质量％，In：3-5.5质量％，Cu：0.5-1.1质量％，如果需要Bi：0.5-3质量％，余量为Sn。 In至少部分为Sn基体中的固溶体。

公开(公告)号：US20100294565A1

公开(公告)日：2010-11-25

申请号：US12452610

申请日：2008-07-14

Applicant: Yuji Kawamata ,  Minoru Ueshima ,  Tomu Tamura ,  Kazuhiro Matsushita ,  Masashi Sakamoto

Inventor： Yuji Kawamata ,  Minoru Ueshima ,  Tomu Tamura ,  Kazuhiro Matsushita ,  Masashi Sakamoto

IPC: H01R4/02 ,  C22C13/02 ,  B23K1/00

CPC classification number: C22C13/00 ,  B23K35/262 ,  C22C13/02 ,  H05K3/3463

Abstract: A Sn—Ag—Cu—Bi lead-free solder which can be used for soldering of vehicle-mounted electronic circuits and which has excellent resistance to heat cycles and mechanical strength is provided. The solder consists essentially of Ag: 2.8-4 mass %, Bi: 1.5-6 mass %, Cu: 0.8-1.2 mass %, and a remainder of Sn.

Abstract translation: 提供了可用于车载电子电路的焊接并且具有优异的耐热循环性和机械强度的Sn-Ag-Cu-Bi无铅焊料。 焊料主要由Ag：2.8-4质量％，Bi：1.5-6质量％，Cu：0.8-1.2质量％和余量的Sn组成。

公开(公告)号：US07800230B2

公开(公告)日：2010-09-21

申请号：US12226764

申请日：2007-04-26

Applicant: Naohiko Hirano ,  Yoshitsugu Sakamoto ,  Tomomi Okumura ,  Kaichi Tsuruta ,  Minoru Ueshima ,  Takashi Ishii

Inventor： Naohiko Hirano ,  Yoshitsugu Sakamoto ,  Tomomi Okumura ,  Kaichi Tsuruta ,  Minoru Ueshima ,  Takashi Ishii

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H05K3/3478 ,  B23K35/262 ,  B23K35/40 ,  H01L23/492 ,  H01L23/49866 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/291 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29211 ,  H01L2224/29355 ,  H01L2224/29499 ,  H01L2224/29582 ,  H01L2224/29611 ,  H01L2224/29694 ,  H01L2224/29695 ,  H01L2224/32225 ,  H01L2224/83101 ,  H01L2224/83455 ,  H01L2224/83801 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/15747 ,  H05K2201/0215 ,  H05K2201/2036 ,  H05K2203/0415 ,  H01L2924/00 ,  H01L2924/01028 ,  H01L2924/01026 ,  H01L2924/01049 ,  H01L2924/01083 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/13111 ,  H01L2224/13109 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

Abstract: A solder preform according to the present invention has a variation in the size of high melting point metal particles which is at most 20 micrometers when the metal particle diameter is 50 micrometers, and an alloy layer of the high melting point metal particles and the main component of solder is formed around the high melting point metal particles. In addition, no voids at all are present in the solder. An electronic component according to the present invention has a semiconductor element bonded to a substrate with the above-described solder preform and has excellent resistance to heat cycles.

Abstract translation: 根据本发明的焊料预成型体在金属粒径为50微米时具有至多20微米的高熔点金属颗粒的尺寸变化，并且高熔点金属颗粒和主要组分的合金层 的焊料形成在高熔点金属颗粒周围。 另外，在焊料中也不存在空隙。 根据本发明的电子部件具有利用上述焊料预成型件与基板结合的半导体元件，并具有优异的耐热循环性。

公开(公告)号：US07537728B2

公开(公告)日：2009-05-26

申请号：US10866102

申请日：2004-06-14

Applicant: Minoru Ueshima

Inventor： Minoru Ueshima

IPC: C22C13/00

CPC classification number: B23K35/262 ,  B23K35/264 ,  C22B25/08 ,  C22C13/00

Abstract: A manufacturing method for a material increases the effectiveness of a component so the component can be present in an amount which does not produce undesirable effects. A material is prepared containing the component in a first concentration. The component is at least partially removed to lower the concentration of the component to a second concentration. The concentration of the component may then be increased to a third concentration above the second concentration.

Abstract translation: 材料的制造方法增加了组分的有效性，使得组分可以以不产生不期望的效果的量存在。 制备含有第一浓度的组分的材料。 至少部分去除组分以将组分的浓度降低至第二浓度。 然后可以将组分的浓度增加至高于第二浓度的第三浓度。

公开(公告)号：US09185812B2

公开(公告)日：2015-11-10

申请号：US11920962

申请日：2006-05-24

Applicant: Minoru Ueshima

Inventor： Minoru Ueshima

IPC: B23K35/26 ,  B23K35/22 ,  B23K35/00 ,  H05K3/34 ,  B23K35/02 ,  B23K35/362

CPC classification number: H05K3/3484 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/22 ,  B23K35/262 ,  B23K35/362 ,  H05K2201/0215 ,  H05K2201/0257

Abstract: In a conventional Sn—Zn based lead-free solder, Zn crystallized to a large size of several tens of micrometers, and it was difficult to suppress the formation of coarse crystallizates and to increase the bonding strength without changing the soldering temperature. There were alloys which improved strength by the addition of a minute amount of a Group 1B metal, but the alloys had an increased melting temperature so that reflow could not be performed with the same temperature profile as for Sn—Pb, so the alloys had advantages and disadvantages.By using a solder paste formed by mixing an ethanol solution containing nanoparticles having a particle diameter of 5-300 nm and containing at least one of Ag, Au, and Cu with a flux and solder powder for an Sn—Zn based lead-free solder paste, the formation of an alloy of Au, Au, or Cu with Zn occurs during soldering, thereby forming fine clusters in the resulting liquid phase of molten solder, and a fine solder structure is obtained following melting.

Abstract translation: 在常规的Sn-Zn基无铅焊料中，Zn结晶到几十微米的大尺寸，并且难以抑制粗结晶的形成，并且在不改变焊接温度的情况下提高接合强度。 存在通过添加少量1B族金属来提高强度的合金，但是合金具有增加的熔融温度，使得不能以与Sn-Pb相同的温度分布进行回流，因此合金具有优点 和缺点。 通过使用通过将含有粒径为5-300nm并含有Ag，Au和Cu中的至少一种的纳米颗粒的乙醇溶液与用于Sn-Zn基无铅焊料的助焊剂和焊料粉末混合而形成的焊膏 在焊接中发生Au，Au或Cu与Zn的合金的形成，从而在熔融焊料的液相中形成微细的簇，熔融后得到细小的焊料结构。

公开(公告)号：US08790472B2

公开(公告)日：2014-07-29

申请号：US11628746

申请日：2005-05-09

Applicant: Minoru Ueshima ,  Takashi Ishii

Inventor： Minoru Ueshima ,  Takashi Ishii

IPC: B22D17/00

CPC classification number: B23K35/40 ,  B23K35/0222 ,  B23K35/025 ,  B23K35/22 ,  C22C2001/1052 ,  Y10T428/1216

Abstract: [Problems] A conventional process for producing a solder preform in which a predetermined amount of high-melting metal particles are directly put into molten solder and stirred, requires a long time for dispersing the high-melting metal particles by stirring. Therefore, in the conventional method for producing a solder preform, dissolution of the high-melting metal particles into the molten solder occurred during stirring, and their particle diameters became small. If a semiconductor chip and a substrate are soldered with a solder preform containing metal particles having such decreased diameters, the space between portions being soldered becomes narrow, and a sufficient bonding strength is not obtained.[Means for Solving the Problems] In the present invention, a premixed master alloy having a higher proportion of the high-melting metal particles in solder is first prepared, then the premixed master alloy is put into molten solder to disperse the high-melting metal particles. As a result, the high-melting metal particles can be uniformly dispersed in solder in a short length of time. Accordingly, a solder preform which is obtained by the process for producing a solder preform according to the present invention can maintain a predetermined clearance between portions being soldered, and a sufficient bonding strength is obtained.

Abstract translation: [问题]将预定量的高熔点金属颗粒直接投入熔融焊料并搅拌的用于生产焊料预制件的常规方法需要长时间以通过搅拌分散高熔点金属颗粒。 因此，在以往的焊料预制体的制造方法中，在熔融焊料中溶解高熔点金属粒子发生搅拌，粒径变小。 如果半导体芯片和基板与含有直径减小的金属粒子的焊料预制体焊接，则被焊接的部分之间的间隔变窄，并且不能获得充分的接合强度。 解决问题的手段在本发明中，首先准备焊料中高熔点金属颗粒比例较高的预混合母合金，然后将预混合的母合金放入熔融焊料中以分散高熔点金属 粒子。 结果，高熔点金属颗粒可以在短时间内均匀地分散在焊料中。 因此，通过本发明的焊料预成型体的制造方法获得的焊料预成型体可以在被焊接的部分之间保持规定的间隙，并且获得充分的接合强度。

公开(公告)号：US07682468B2

公开(公告)日：2010-03-23

申请号：US11889356

申请日：2007-08-10

Applicant: Osamu Munekata ,  Yoshitaka Toyoda ,  Tsukasa Ohnishi ,  Minoru Ueshima

Inventor： Osamu Munekata ,  Yoshitaka Toyoda ,  Tsukasa Ohnishi ,  Minoru Ueshima

IPC: C22C13/00

CPC classification number: C22C13/00 ,  B23K1/0016 ,  B23K1/085 ,  B23K1/203 ,  B23K35/262 ,  B23K2101/42 ,  H05K3/3463

Abstract: A lead-free solder alloy suitable for use in flow soldering of electronic components to printed wiring boards comprises 0.1-3 wt % of Cu, 0.001-0.1 wt % of P, optionally 0.001-0.1 wt % of Ge, and a balance of Sn. The solder alloy may further contain at least one element of Ag and Sb in a total amount of at most 4 wt %, and/or at least one element of Ni, Co, Fe, Mn, Cr, and Mo in a total amount of at most 0.5 wt % in order to strengthen the alloy, and/or at least one element of Bi, In, and Zn in a total amount of at most 5 wt % in order to lower the melting point of the alloy.

Abstract translation: 适用于电子部件流动焊接到印刷电路板的无铅焊料合金包括0.1〜3wt％的Cu，0.001-0.1wt％的P，0.001-0.1wt％的Ge，余量的Sn 。 焊料合金还可以含有总量最多为4重量％的Ag和Sb的至少一种元素，和/或Ni，Co，Fe，Mn，Cr和Mo中的至少一种元素的总量为 为了降低合金的熔点，为了强化合金，和/或Bi，In和Zn的至少一种元素，其总量最多为5重量％，最多为0.5重量％。

公开(公告)号：US20090236725A1

公开(公告)日：2009-09-24

申请号：US12226764

申请日：2007-04-26

Applicant: Naohiko Hirano ,  Yoshitsugu Sakamoto ,  Tomomi Okumura ,  Kaichi Tsuruta ,  Minoru Ueshima ,  Takashi Ishii

Inventor： Naohiko Hirano ,  Yoshitsugu Sakamoto ,  Tomomi Okumura ,  Kaichi Tsuruta ,  Minoru Ueshima ,  Takashi Ishii

IPC: H01L23/488 ,  B23K35/24

CPC classification number: H05K3/3478 ,  B23K35/262 ,  B23K35/40 ,  H01L23/492 ,  H01L23/49866 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/291 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29211 ,  H01L2224/29355 ,  H01L2224/29499 ,  H01L2224/29582 ,  H01L2224/29611 ,  H01L2224/29694 ,  H01L2224/29695 ,  H01L2224/32225 ,  H01L2224/83101 ,  H01L2224/83455 ,  H01L2224/83801 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/15747 ,  H05K2201/0215 ,  H05K2201/2036 ,  H05K2203/0415 ,  H01L2924/00 ,  H01L2924/01028 ,  H01L2924/01026 ,  H01L2924/01049 ,  H01L2924/01083 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/13111 ,  H01L2224/13109 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

Abstract: An electronic component having a semiconductor element bonded to a substrate with solder has a decreased bonding strength if there is not a suitable clearance between the semiconductor element and the substrate. Therefore, a solder preform having high melting point metal particles dispersed in solder has been used in the manufacture of electronic components. However, when an electronic component was manufactured using a conventional solder preform, there were cases in which the semiconductor element leaned or the bonding strength was not adequate.A solder preform according to the present invention has a variation in the size of high melting point metal particles which is at most 20 micrometers when the metal particle diameter is 50 micrometers, and an alloy layer of the high melting point metal particles and the main component of solder is formed around the high melting point metal particles. In addition, no voids at all are present in the solder. An electronic component according to the present invention has a semiconductor element bonded to a substrate with the above-described solder preform and has excellent resistance to heat cycles.

Abstract translation: 如果半导体元件和基板之间没有合适的间隙，则具有用焊料与基板结合的半导体元件的电子部件的接合强度降低。 因此，在电子部件的制造中已经使用了分散在焊料中的高熔点金属粒子的焊料预成型体。 然而，当使用常规的焊料预制件制造电子部件时，存在半导体元件倾斜或接合强度不足的情况。 根据本发明的焊料预成型体在金属粒径为50微米时具有至多20微米的高熔点金属颗粒的尺寸变化，并且高熔点金属颗粒和主要组分的合金层 的焊料形成在高熔点金属颗粒周围。 另外，在焊料中也不存在空隙。 根据本发明的电子部件具有利用上述焊料预成型件与基板结合的半导体元件，并具有优异的耐热循环性。

公开(公告)号：US20090236013A1

公开(公告)日：2009-09-24

申请号：US12453442

申请日：2009-05-11

Applicant: Minoru Ueshima

Inventor： Minoru Ueshima

IPC: B23K35/00

CPC classification number: B23K35/262 ,  B23K35/264 ,  C22B25/08 ,  C22C13/00

Abstract: A manufacturing method for a material increases the effectiveness of a component so the component can be present in an amount which does not produce undesirable effects. A material is prepared containing the component in a first concentration. The component is at least partially removed to lower the concentration of the component to a second concentration. The concentration of the component may then be increased to a third concentration above the second concentration.

公开(公告)号：US20080128105A1

公开(公告)日：2008-06-05

申请号：US10594577

申请日：2005-03-31

Applicant: Minoru Ueshima

Inventor： Minoru Ueshima

IPC: B22D23/00 ,  B22D35/04

CPC classification number: F27D27/00 ,  B22D1/00 ,  B22D41/04 ,  B23K35/0244 ,  B23K35/262 ,  B23K2101/40 ,  H01L24/743 ,  H01L2224/743 ,  Y10S164/90 ,  H01L2924/00

Abstract: A pouring apparatus for molten metal includes a stirrer installed in a reservoir. The stirrer is rotated by a rotational drive mechanism installed on the reservoir. Molten solder is placed into the reservoir, high melting point metal particles are charged into the molten solder, stirring is performed with the stirrer to uniformly disperse the metal particles in the molten solder, and then the molten solder and dispersed metal particles are cast into a mold. Casting can be performed quickly after charging the metal particles into the molten solder, so the metal particles do not significantly melt into the molten solder.

Abstract translation: 用于熔融金属的浇注装置包括安装在储存器中的搅拌器。 搅拌器由安装在储液器上的旋转驱动机构旋转。 将熔融焊料放入储存器中，将高熔点金属颗粒装入熔融焊料中，用搅拌器进行搅拌以使金属颗粒均匀分散在熔融焊料中，然后将熔融的焊料和分散的金属颗粒浇铸成 模子。 在将金属颗粒填充到熔融焊料中之后，可以快速进行铸造，因此金属颗粒不会显着熔化到熔融焊料中。