ELECTRONIC COMPONENT MODULE AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT MODULE

    公开(公告)号:US20210204395A1

    公开(公告)日:2021-07-01

    申请号:US17198489

    申请日:2021-03-11

    Abstract: An electronic component module (100) includes a module board (10) having electronic components (40) mounted on at least one of a first surface (front surface) (12) and a second surface (back surface) (14), mold portions (22 and 23), and a shield (32). The mold portions (22 and 23) cover the mounted electronic components (40). The shield (32) covers at least a part of the mold portions (22 and 23) and the side surfaces of the module board (10). Protrusions (15) protruding from the side surfaces are formed on the module board (10). The shield (32) is separated by the protrusions (15).

    SUBSTRATE WITH ANTENNA, AND ANTENNA MODULE
    23.
    发明申请

    公开(公告)号:US20200343618A1

    公开(公告)日:2020-10-29

    申请号:US16928365

    申请日:2020-07-14

    Abstract: A substrate with an antenna according to the present disclosure includes a circuit board having one main surface and the other main surface, and an antenna element mounted on the one main surface of the circuit board. When viewed from a thickness direction, an area of the one main surface of the circuit board is larger than an area of the other main surface, and the antenna element is mounted on at least a part of a region that is on the one main surface of the circuit board and that protrudes from the other main surface.

    CERAMIC ELECTRONIC COMPONENT
    24.
    发明申请

    公开(公告)号:US20190166690A1

    公开(公告)日:2019-05-30

    申请号:US16264882

    申请日:2019-02-01

    Abstract: A ceramic electronic component according to the present disclosure includes a wiring formation layer including a ceramic insulation layer containing a low-temperature co-fired ceramic material and a wiring pattern formed on the ceramic insulation layer. The wiring formation layer further has a plurality of dummy patterns formed on a portion of the ceramic insulation layer where the wiring pattern is not formed. The wiring width of the dummy patterns is less than the minimum value of the wiring width of the wiring pattern.

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