公开(公告)号：US20170232465A1

公开(公告)日：2017-08-17

申请号：US15582432

申请日：2017-04-28

Applicant: NORDSON CORPORATION

Inventor： Ron Abernathy ,  Alec J. Babiarz ,  Nicholas Anthony Barendt ,  Robert Ciardella ,  James Everett Cooper ,  Kenneth S. Espenschied ,  Erik Fiske ,  Christopher L. Giusti ,  Patrick R. Jenkins ,  Alan Lewis ,  Raymond Andrew Merritt ,  Naoya Ian Nagano ,  Horatio Quinones ,  Thomas Ratledge ,  Joe Sherman ,  Floriana Suriawidjaja ,  Todd Weston

IPC: B05C11/10 ,  G05D7/06 ,  H05K3/28 ,  B05C5/00

CPC classification number: B05C11/1034 ,  B05C5/001 ,  B05C5/0225 ,  B05C11/10 ,  G05D7/0629 ,  H05K3/28 ,  H05K3/3484 ,  H05K2203/0736

Abstract: A viscous material noncontact jetting system has a jetting dispenser mounted for relative motion with respect to a surface. A control is operable to cause the jetting dispenser to jet a viscous material droplet that is applied to the surface as a viscous material dot. A device, such as a camera or weigh scale, is connected to the control and provides a feedback signal representing a size-related physical characteristic of the dot applied to the surface. The size-related physical characteristics of subsequently applied dots are controlled by heating and cooling, or adjusting a piston stroke in the jetting dispenser, in response to the size-related physical characteristic feedback. Dispensed material volume control and velocity offset compensation are also provided.

公开(公告)号：US20160221022A1

公开(公告)日：2016-08-04

申请号：US15095872

申请日：2016-04-11

Applicant: NORDSON CORPORATION

Inventor： Stanley Cruz Aguilar ,  Mani Ahmadi ,  Stephen Russell des Jardins ,  Erik Fiske ,  Mark Meier ,  Horatio Quinones ,  Thomas L. Ratledge ,  Robert James Wright

IPC: B05C5/02 ,  B05C11/10

CPC classification number: B05C5/0225 ,  B05B1/304 ,  B05B1/3046 ,  B05B15/65 ,  B05C5/02 ,  B05C5/0237 ,  B05C5/027 ,  B05C5/0291 ,  B05C11/1002 ,  B05C11/1013 ,  B05C11/1034 ,  F16K31/1221

Abstract: A jetting device and/or fluid module includes a nozzle with a fluid outlet, a body including a fluid chamber and a fluid inlet in fluid communication with the fluid chamber, and a valve seat disposed in the fluid chamber, where the valve seat includes an opening in fluid communication with the fluid outlet. The jetting device also includes a movable element having a top portion and a bottom portion, where the top portion is disposed external to the fluid chamber and arranged to be contacted by a reciprocating drive pin, and where the bottom portion is disposed within the fluid chamber. Finally, the jetting device also includes a sealing member contacting the movable element between the top portion and the bottom portion, where the sealing member also contacts the body, and defines a portion of a boundary of the fluid chamber to seal the fluid chamber

Abstract translation: 喷射装置和/或流体模块包括具有流体出口的喷嘴，包括流体室的主体和与流体室流体连通的流体入口，以及设置在流体室中的阀座，其中阀座包括一个 打开与流体出口流体连通。 喷射装置还包括具有顶部和底部的可移动元件，其中顶部设置在流体室外部并且布置成与往复驱动销接触，并且其中底部设置在流体室内 。 最后，喷射装置还包括在顶部和底部之间接触可移动元件的密封构件，密封构件也与主体接触，并且限定流体室的边界的一部分以密封流体室

公开(公告)号：US20160005668A1

公开(公告)日：2016-01-07

申请号：US14855487

申请日：2015-09-16

Applicant: NORDSON CORPORATION

Inventor： Joseph E. Donner ,  Michael Gorman ,  Christopher L. Giusti ,  Alan R. Lewis ,  Horatio Quinones ,  Thomas L. Ratledge ,  Yuriy Suhinin

IPC: H01L21/66 ,  G01G17/06 ,  H01L21/56 ,  G01F1/00

CPC classification number: H01L22/26 ,  B05B15/50 ,  B05C5/0225 ,  B05C11/1013 ,  B05C11/1034 ,  G01F1/00 ,  G01G17/06 ,  H01L21/563

Abstract: Methods and systems of accurately dispensing a viscous fluid onto a substrate. In an embodiment, a method includes using an electronic flow meter device to produce electrical flow meter output signals and performing a responsive control function in a closed loop manner by adjusting at least one dispensing parameter to correct for a difference between an output data set and a reference data set. In another embodiment, a system includes a control operatively coupled to a gas flow meter device and to a weigh scale allowing for a density of an amount of viscous material to be determined. In another embodiment, a method includes using a control coupled to both a gas flow meter device and a weigh scale and performing a responsive control function in a closed loop manner by adjusting at least one dispensing parameter using gas flow meter output signals and weigh scale output signals.

Abstract translation: 将粘性流体精确分配到基材上的方法和系统。 在一个实施例中，一种方法包括使用电子流量计装置来产生电流量计输出信号并以闭环方式执行响应控制功能，通过调整至少一个分配参数来校正输出数据组和 参考数据集。 在另一个实施例中，系统包括可操作地耦合到气体流量计装置的控制器和允许确定一定量的粘性材料的密度的称重秤。 在另一个实施例中，一种方法包括使用耦合到气体流量计装置和称重秤的控制并且以闭环方式执行响应控制功能，通过使用气体流量计输出信号和称重输出信号调节至少一个分配参数 信号。

公开(公告)号：US20140353333A1

公开(公告)日：2014-12-04

申请号：US14462809

申请日：2014-08-19

Applicant: Nordson Corporation

Inventor： Michael Gorman ,  Yuriy Suhinin ,  Horatio Quinones

IPC: B05C11/10 ,  B05C5/02

CPC classification number: B05C11/1013 ,  B05B12/085 ,  B05B15/50 ,  B05C5/0225 ,  B05C5/0283 ,  B05C5/0291

Abstract: A non-contact jetting dispenser, viscous fluid dispensing system and method. The system includes a viscous fluid dispenser for dispensing the viscous fluid. The system further includes a viscous fluid supply container adapted to hold the viscous fluid. A flow path is provided for the viscous fluid between the viscous fluid supply container and an outlet of the viscous fluid dispenser. An electronic flow meter device is used to produce electrical output signals proportional to the flow rate of the fluid flowing through the flow path. A control is operatively coupled to the electronic flow meter for continuously receiving and processing the electrical output signals and performing a responsive control function in a closed loop manner.

Abstract translation: 非接触喷射分配器，粘性流体分配系统和方法。 该系统包括用于分配粘性流体的粘性流体分配器。 该系统还包括适于保持粘性流体的粘性流体供应容器。 为粘性流体供应容器和粘性流体分配器的出口之间提供流体通道。 电子流量计装置用于产生与流过流路的流体流量成比例的电输出信号。 控制器可操作地耦合到电子流量计，用于连续地接收和处理电输出信号并以闭环方式执行响应控制功能。

公开(公告)号：US20140248421A1

公开(公告)日：2014-09-04

申请号：US14280032

申请日：2014-05-16

Applicant: Nordson Corporation

Inventor： Ronald N. Abernathy ,  Clifford A. Fowler ,  Philip P. Maiorca ,  Horatio Quinones ,  Thomas L. Ratledge

IPC: H05K3/00

CPC classification number: B05B12/084 ,  H05K1/0269 ,  H05K3/0005 ,  H05K3/0008 ,  H05K3/125 ,  H05K13/0465 ,  H05K2203/0126 ,  H05K2203/013 ,  H05K2203/163

Abstract: Methods for applying fluid materials to a substrate, such as circuit board, while continuously moving the fluid dispenser. Some methods generally involve correcting the dispense location for each of the dispensed amounts of fluid material by executing a statistical comparison of either the predicted and actual landing locations on the substrate, or the predicted and actual positions of the dispenser at each of the dispense locations. Other methods generally involve initiating the dispensing of amounts of the fluid material at dispense locations corrected by a correction factor specified in terms of the servo cycle for the movement of the dispenser or by a correction factor specified in terms of partial servo cycles courtesy of a timer.

Abstract translation: 在流体分配器连续移动的同时将流体材料施加到诸如电路板的基底上的方法。 一些方法通常包括通过执行基板上的预测和实际着陆位置的统计比较，或在每个分配位置处的分配器的预测位置和实际位置来校正每个分配量的流体材料的分配位置。 其他方法通常包括在通过针对分配器的运动的伺服循环所指定的校正因子校正的分配位置处引发流体材料的量的分配，或通过由计时器提供的部分伺服循环所指定的校正因子 。