公开(公告)号：US20140218787A1

公开(公告)日：2014-08-07

申请号：US14019471

申请日：2013-09-05

Applicant: NVIDIA Corporation

Inventor： Shuang Xu

IPC: G02F1/1335 ,  G02F1/167

CPC classification number: G02F1/167 ,  G02F1/133603 ,  G02F2001/1672

Abstract: A display panel is provided that includes a plurality of pixel units, each having a first surface and a second surface opposite to the first surface, and comprising an electrophoretic gel part with a shape tapered in a direction from the first surface to the second surface, wherein a top surface of the electrophoretic gel part forms the first surface and electrophoretic particles are provided in the electrophoretic gel part; a light guiding part with a shape tapered in a direction from the second surface to the first surface, wherein the light guiding part and the electrophoretic glue part match in shape and abut with each other, and a bottom surface of the light guiding part forms at least a portion of the second surface; and a light-emitting device provided on the bottom surface of the light guiding part and operable to emit light toward the first surface.

Abstract translation: 提供一种显示面板，其包括多个像素单元，每个像素单元具有第一表面和与第一表面相对的第二表面，并且包括具有在从第一表面到第二表面的方向上渐缩的形状的电泳凝胶部分， 其中所述电泳凝胶部分的顶表面形成所述第一表面，并且所述电泳凝胶部分中提供电泳颗粒; 具有从所述第二面到所述第一面的方向成锥形的导光部，所述导光部和所述电泳胶部的形状相互抵接，所述导光部的底面形成为 第二表面的至少一部分; 以及设置在导光部的底面上并可操作以朝向第一表面发光的发光装置。

公开(公告)号：US09078380B2

公开(公告)日：2015-07-07

申请号：US13655830

申请日：2012-10-19

Applicant: NVIDIA CORPORATION

Inventor： Shuang Xu

IPC: H01L25/00 ,  H03F1/00 ,  H01L29/08 ,  H05K3/30

CPC classification number: H05K3/30 ,  H01L25/00 ,  H01L2924/0002 ,  H05K1/0243 ,  H05K1/181 ,  H05K2201/10166 ,  Y02P70/611 ,  Y10T29/4913 ,  H01L2924/00

Abstract: Embodiments of the invention provide methods and configuration for packaging multiple semiconductor ships in a semiconductor package. In one embodiment, an integrated circuit system includes a printed circuit board, a first MOSFET device disposed on a first surface of the printed circuit board, and a second MOSFET device disposed on a second surface of the printed circuit board, wherein the first MOSFET device overlaps an edge of the second MOSFET device in a direction extending through the printed circuit board.

Abstract translation: 本发明的实施例提供了用于在半导体封装中封装多个半导体船的方法和配置。 在一个实施例中，集成电路系统包括印刷电路板，设置在印刷电路板的第一表面上的第一MOSFET器件和布置在印刷电路板的第二表面上的第二MOSFET器件，其中第一MOSFET器件 在延伸穿过印刷电路板的方向上与第二MOSFET器件的边缘重叠。