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公开(公告)号：US11758255B2
公开(公告)日：2023-09-12
申请号：US17750743
申请日：2022-05-23
Applicant: NINGBO SUNNY OPOTECH CO., LTD.
Inventor： Zhen Huang , Qimin Mei , Bojie Zhao , Zhewen Mei , Li Liu , Jiawei Chen , Zongchun Yang , Chenxiang Xu
CPC classification number: H04N23/55 , B29C43/18 , H04N23/54 , H04N23/57 , B29L2011/00 , B29L2031/34
Abstract: A camera module includes an optical assembly, a filter and a molded photosensitive assembly mounted under the optical assembly and the filter, wherein the molded photosensitive assembly comprises a main body, a plurality of electronic components, a photosensitive chip, and a circuit board electrically connected with the electronic components and the photosensitive chip, wherein the electronic components, the photosensitive chip and the circuit board are positionally fixed with each other by the main body, wherein the photosensitive chip is fixed and surrounded by the bottom of the main body to keep distance with the filter, wherein the main body comprises a container body supporting the optical assembly thereon and a lower body supporting the filter thereon, wherein the lower body is extended from the inner side of the container body.
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公开(公告)号：US11627239B2
公开(公告)日：2023-04-11
申请号：US17540642
申请日：2021-12-02
Applicant: Ningbo Sunny Opotech Co., Ltd.
Inventor： Mingzhu Wang , Zhenyu Chen , Takehiko Tanaka , Zhongyu Luan , Bojie Zhao , Zhen Huang , Nan Guo , Fengsheng Xi , Heng Jiang , Zilong Deng
IPC: H04N5/225
Abstract: A camera module and its photosensitive assembly and manufacturing method thereof are provided. The photosensitive assembly includes a photosensitive element, a window circuit board and a packaging body integrally packaged the photosensitive element and the window circuit board to form an integrated body, wherein the window circuit board has at least one window for receiving the photosensitive element therein.
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公开(公告)号：US11451693B2
公开(公告)日：2022-09-20
申请号：US17314723
申请日：2021-05-07
Applicant: Ningbo Sunny Opotech Co., Ltd.
Inventor： Mingzhu Wang , Duanliang Cheng , Fengsheng Xi , Bojie Zhao , Takehiko Tanaka , Zhen Huang , Zhenyu Chen , Nan Guo
Abstract: The present invention provides a camera module and a molding circuit board assembly, circuit board and application thereof, the circuit board comprising a digital circuit unit, an analog circuit unit and a substrate. The digital circuit nit and the analog circuit unit are respectively formed on the substrate, and the digital circuit unit and the analog circuit unit are conductively connected to each other, wherein at least one part of the analog circuit unit has a safe distance from the digital circuit unit, so as to prevent an electromagnetic wave generated by a circuit of the digital circuit unit from interfering with an electrical signal transmitted and processed by the analog circuit unit, thereby improving the stability and reliability of the transmission and the processing of the electrical signal by the circuit board.
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公开(公告)号：US11412116B2
公开(公告)日：2022-08-09
申请号：US17195785
申请日：2021-03-09
Applicant: NINGBO SUNNY OPOTECH CO., LTD.
Inventor： Zhen Huang , Qimin Mei , Bojie Zhao , Zhewen Mei , Li Liu , Jiawei Chen , Zongchun Yang , Chenxiang Xu
Abstract: A camera module includes an optical assembly, a filter and a molded photosensitive assembly mounted under the optical assembly and the filter, wherein the molded photosensitive assembly comprises a main body, a plurality of electronic components, a photosensitive chip, and a circuit board electrically connected with the electronic components and the photosensitive chip, wherein the electronic components, the photosensitive chip and the circuit board are positionally fixed with each other by the main body, wherein the photosensitive chip is fixed and surrounded by the bottom of the main body to keep distance with the filter, wherein the main body comprises a container body supporting the optical assembly thereon and a lower body supporting the filter thereon, wherein the lower body is extended from the inner side of the container body.
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25.发明授权公开(公告)号：US11289521B2
公开(公告)日：2022-03-29
申请号：US16088435
申请日：2016-10-25
Applicant: NINGBO SUNNY OPOTECH CO., LTD.
Inventor： Mingzhu Wang , Zhenyu Chen , Nan Guo , Bojie Zhao , Takehiko Tanaka , Zhen Huang , Zhongyu Luan , Heng Jiang
IPC: H01L27/146 , H04N5/225 , H01L23/00
Abstract: A molded photosensitive assembly of a camera module includes at least one supporting member formed by a first substance, at least one photosensitive element, at least one circuit board, at least one set of wires electrically connecting the photosensitive element to the circuit board, and at least one molded base. Two ends of each of the wires are respectively connected to a chip connector of the photosensitive element and a circuit connector of the circuit board. The molded base is formed by a second substance and comprises a molded body and has at least one light window, wherein the photosensitive element and the wires are protected by a supporting member which is provided for avoiding an upper mold of a molding-die pressing on the wires during the molding process.
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Patent Agency Ranking
公开(公告)号：US10986257B2
公开(公告)日：2021-04-20
申请号：US16547537
申请日：2019-08-21
Applicant: NINGBO SUNNY OPOTECH CO., LTD.
Inventor： Zhen Huang , Qimin Mei , Bojie Zhao , Zhewen Mei , Li Liu , Jiawei Chen , Zongchun Yang , Chenxiang Xu
IPC: H04N5/225
Abstract: A camera module includes an optical assembly, a filter and a molded photosensitive assembly mounted under the optical assembly and the filter, wherein the molded photosensitive assembly comprises a main body, a plurality of electronic components, a photosensitive chip, and a circuit board electrically connected with the electronic components and the photosensitive chip, wherein the electronic components, the photosensitive chip and the circuit board are positionally fixed with each other by the main body, wherein the photosensitive chip is fixed and surrounded by the bottom of the main body to keep distance with the filter, wherein the main body comprises a container body supporting the optical assembly thereon and a lower body supporting the filter thereon, wherein the lower body is extended from the inner side of the container body.
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公开(公告)号：US10735631B2
公开(公告)日：2020-08-04
申请号：US16136213
申请日：2018-09-19
Applicant: Ningbo Sunny Opotech Co., Ltd.
Inventor： Baozhong Zhang , Mingzhu Wang , Nan Guo , Zhen Huang , Feifan Chen
IPC: H04N5/225 , H01L27/146
Abstract: A camera module includes an optical lens, a plurality of different camera components, and a plurality of connection elements pre-formed on at least one of the camera components for electrical connection. Each of the connection elements includes a first connection element formed on a surface of the camera component and a first conduction element electrically formed on the first connection element and protruded from the first connection element in order to electrically connect with other camera components.
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公开(公告)号：US10356299B2
公开(公告)日：2019-07-16
申请号：US15057071
申请日：2016-02-29
Applicant: NINGBO SUNNY OPOTECH CO., LTD.
Inventor： Mingzhu Wang , Nan Guo , Feifan Chen , Bojie Zhao , Bo Peng , Zhen Huang
IPC: H04N5/225
Abstract: A camera module includes a lens, a photosensitive chip and an electrical holder. The electrical holder has an integrated circuit that the electrical holder serves as an integration of a base and a PCB in a conventional camera module, wherein the electrical holder not only forms an assembling unit for connecting a driver and an optical lens but also forms an electrical connection unit for electrically connecting to the driver, a photosensitive chip and a flexible circuit board with each other, so as to minimize an overall size of the camera module.
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公开(公告)号：US12211864B2
公开(公告)日：2025-01-28
申请号：US17631605
申请日：2020-07-30
Applicant: NINGBO SUNNY OPOTECH CO., LTD.
Inventor： Zhongyu Luan , Zhen Huang , Li Liu , Kai Chen
IPC: H01L27/146 , H01L23/00 , H01L23/433 , H04N23/52 , H04N23/54
Abstract: Disclosed in the present application are a camera module, and a photosensitive assembly and a manufacturing method therefor. The photosensitive assembly comprises a circuit board, a photosensitive chip electrically connected to the circuit board, and a shaping member provided on the circuit board. A lower surface of the photosensitive chip is attached to the shaping member to form an accommodating space with the shaping member and the circuit board. The accommodating space is configured so that the photosensitive chip is bent downward during a process of assembling the photosensitive assembly. In this way, the photosensitive chip is bent into a shape adapted to the actual focal plane during the assembly process, so as to improve the imaging quality.
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公开(公告)号：US11745401B2
公开(公告)日：2023-09-05
申请号：US16307151
申请日：2017-06-06
Applicant: NINGBO SUNNY OPOTECH CO., LTD.
Inventor： Mingzhu Wang , Bojie Zhao , Takehiko Tanaka , Zhen Huang
CPC classification number: B29C45/14336 , B29C45/14065 , H04N23/00 , H05K3/00 , B29L2031/3425 , H04N23/54 , H04N23/55
Abstract: A manufacturing equipment, for manufacturing a molded circuit board assembly of a camera module, includes an upper mould, a lower mould, a mould fixing arrangement, and a temperature controlling arrangement, wherein the mould fixing arrangement controls opening and closing of the upper mould and the lower mound. When a substrate board is placed between the upper mould and the lower mound, a molding cavity is further formed between the upper mould and the lower mound, wherein in the molding cavity, a supporting frame forming groove is formed for forming the module support, and a light window forming element is used for forming a light window. The temperature controlling arrangement provides a molding temperature, the module supporting frame is integrally molded on the substrate board to form the molded circuit board assembly.
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