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公开(公告)号：US08725071B2
公开(公告)日：2014-05-13
申请号：US13567109
申请日：2012-08-06
Applicant: Yuya Dokai , Noboru Kato , Satoshi Ishino
Inventor： Yuya Dokai , Noboru Kato , Satoshi Ishino
IPC: H04B5/00
CPC classification number: H05K1/0243 , G06K19/07749 , H01L23/49822 , H01L23/642 , H01L23/645 , H01L23/66 , H01L2223/665 , H01L2223/6677 , H01L2224/13144 , H01L2224/16 , H01L2224/16235 , H01L2224/16238 , H01L2924/01079 , H01L2924/09701 , H01L2924/14 , H01L2924/3011 , H05K1/0239 , H05K1/16 , H05K1/162 , H05K1/165 , H05K2201/10098 , H05K2201/10727 , Y02D70/10
Abstract: A wireless IC device includes a wireless IC chip, a power supply circuit board upon which the wireless IC chip is mounted, and in which a power supply circuit is provided, the power supply circuit includes a resonant circuit having a predetermined resonant frequency, and a radiation pattern, which is adhered to the underside of the power supply circuit board, for radiating a transmission signal supplied from the power supply circuit, and for receiving a reception signal to supply this to the power supply circuit. The resonant circuit is an LC resonant circuit including an inductance device and capacitance devices. The power supply circuit board is a multilayer rigid board or a single-layer rigid board, and between the wireless IC chip and the radiation pattern is connected by DC connection, magnetic coupling, or capacitive coupling.
Abstract translation: 无线IC器件包括无线IC芯片，安装有无线IC芯片的电源电路板，并且其中设置有电源电路，电源电路包括具有预定谐振频率的谐振电路，以及 辐射图案，其粘附到电源电路板的下侧，用于辐射从电源电路提供的传输信号，并且用于接收接收信号以将其提供给电源电路。 谐振电路是包括电感器件和电容器件的LC谐振电路。 电源电路板是多层刚性板或单层刚性板，无线IC芯片和辐射图之间通过直流连接，磁耦合或电容耦合连接。
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公开(公告)号：US08400307B2
公开(公告)日：2013-03-19
申请号：US12959454
申请日：2010-12-03
Applicant: Takeshi Kataya , Noboru Kato , Satoshi Ishino , Nobuo Ikemoto , Ikuhei Kimura , Yuya Dokai
Inventor： Takeshi Kataya , Noboru Kato , Satoshi Ishino , Nobuo Ikemoto , Ikuhei Kimura , Yuya Dokai
CPC classification number: G06K19/07749 , G06K19/0775 , H01L2224/16225 , H01L2224/16227 , H01Q1/2225 , H01Q1/38 , H01Q1/48 , H01Q7/00 , H04Q2213/13095 , H05K1/0239 , H05K1/0243 , H05K1/141 , H05K1/16 , H05K2201/10098
Abstract: A radio frequency IC device includes a radio frequency IC chip arranged to process a transmitted/received signal, a printed circuit board on which the radio frequency IC chip is mounted, an electrode arrange on the circuit board, and a loop electrode that is arranged on the circuit board so that the loop electrode is electrically connected to the radio frequency IC chip and is coupled to the electrode by electromagnetic coupling. The electrode is coupled to the radio frequency IC chip via the loop electrode so as to transmit or receive a high-frequency signal. A power supply circuit board including a resonance circuit and/or a matching circuit may be disposed between the radio frequency IC chip and the loop electrode.
Abstract translation: 射频IC器件包括布置成处理发送/接收信号的射频IC芯片，安装射频IC芯片的印刷电路板，布置在电路板上的电极和布置在电路板上的环形电极 电路板，使得环形电极电连接到射频IC芯片，并通过电磁耦合耦合到电极。 电极通过环形电极耦合到射频IC芯片，以便发送或接收高频信号。 包括谐振电路和/或匹配电路的电源电路板可以设置在射频IC芯片和环形电极之间。
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公开(公告)号：US08228765B2
公开(公告)日：2012-07-24
申请号：US13295153
申请日：2011-11-14
Applicant: Yuya Dokai , Noboru Kato , Ikuhei Kimura
Inventor： Yuya Dokai , Noboru Kato , Ikuhei Kimura
IPC: G11B11/00
CPC classification number: G11B23/286 , G11B20/00086 , G11B20/00094 , G11B20/00173 , G11B20/0021 , G11B20/00253 , G11B20/00275 , G11B20/00492 , G11B20/00695 , G11B20/00876 , G11B23/30 , G11B2220/2537
Abstract: An optical disc includes an electromagnetic coupling module mounted therein. The electromagnetic coupling module includes a wireless IC chip and a feeder circuit substrate in which a feeder circuit including a resonant circuit having a predetermined resonant frequency is disposed. The electromagnetic coupling module is electromagnetically coupled to a reflective film defining a metal thin film of the optical disc, and the reflective film defines an antenna or radiation pattern of the electromagnetic coupling module.
Abstract translation: 光盘包括安装在其中的电磁耦合模块。 电磁耦合模块包括无线IC芯片和馈电电路基板，其中设置包括具有预定谐振频率的谐振电路的馈电电路。 电磁耦合模块电磁耦合到限定光盘的金属薄膜的反射膜，反射膜限定电磁耦合模块的天线或辐射图。
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公开(公告)号：US08081125B2
公开(公告)日：2011-12-20
申请号：US12350307
申请日：2009-01-08
Applicant: Yuya Dokai , Noboru Kato
Inventor： Yuya Dokai , Noboru Kato
IPC: H01Q1/24
CPC classification number: H01Q1/2225 , G06K7/10178 , G06K19/07749 , G06K19/07756 , G06K19/07779 , G06K19/07783 , G06K19/07784 , G06K19/07786 , H01Q21/28
Abstract: An antenna includes a feeder terminal and a resonance circuit. The resonance circuit is defined by a capacitance element and an inductance element and includes first and second radiation plates. The capacitance element is electromagnetically coupled to the first radiation plate, and the inductance element is electromagnetically coupled to the second radiation plate. A radio IC device includes an electromagnetic coupling module including a feeder circuit substrate on which a radio IC chip is mounted, and radiation plates. The feeder circuit substrate includes an inductance element and a capacitance element. One of the radiation plates faces and is magnetically coupled to the inductance element. The other radiation plate faces and is electrically coupled to the capacitance element. The radio IC chip is operated by signals received by the radiation plates, and a response signal from the radio IC chip is radiated from the radiation plates.
Abstract translation: 天线包括馈线端子和谐振电路。 谐振电路由电容元件和电感元件限定，并且包括第一和第二辐射板。 电容元件与第一辐射板电磁耦合，电感元件与第二辐射板电磁耦合。 无线IC设备包括电磁耦合模块，其包括安装无线IC芯片的馈电电路基板和辐射板。 馈电电路基板包括电感元件和电容元件。 辐射板之一面向磁耦合到电感元件。 另一个辐射板面并且电耦合到电容元件。 无线电IC芯片由辐射板接收的信号操作，并且来自无线IC芯片的响应信号从辐射板辐射。
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公开(公告)号：US08081121B2
公开(公告)日：2011-12-20
申请号：US12401767
申请日：2009-03-11
Applicant: Noboru Kato , Yuya Dokai , Nobuo Ikemoto
Inventor： Noboru Kato , Yuya Dokai , Nobuo Ikemoto
IPC: H01Q1/38
CPC classification number: H04B5/0012 , G06K7/10178 , G06K19/04 , G06K19/07749
Abstract: An article having an electromagnetic coupling module attached thereto includes an electromagnetic coupling module and a PET bottle having the electromagnetic coupling module bonded thereto. The electromagnetic coupling module includes a wireless IC chip arranged to process transmission and reception signals and the feed circuit board having the wireless IC chip mounted thereon. The feed circuit board includes a feed circuit including a resonant circuit having a predetermined resonant frequency. The feed circuit performs characteristic impedance matching between the PET bottle and the wireless IC chip. The PET bottle functions as a radiator arranged to radiate a transmission signal supplied from the feed circuit using electromagnetic field coupling and to supply a received reception signal to the feed circuit using electromagnetic field coupling.
Abstract translation: 具有附接有电磁耦合模块的物品包括电磁耦合模块和具有与其结合的电磁耦合模块的PET瓶。 电磁耦合模块包括布置成处理发送和接收信号的无线IC芯片以及安装有无线IC芯片的馈电电路板。 馈电电路板包括具有预定谐振频率的谐振电路的馈电电路。 馈电电路执行PET瓶和无线IC芯片之间的特征阻抗匹配。 PET瓶用作散热器，其布置成使用电磁场耦合辐射从馈电电路提供的传输信号，并使用电磁场耦合将接收到的接收信号提供给馈电电路。
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Patent Agency Ranking
公开(公告)号：US07630685B2
公开(公告)日：2009-12-08
申请号：US12359690
申请日：2009-01-26
Applicant: Yuya Dokai , Noboru Kato , Satoshi Ishino
Inventor： Yuya Dokai , Noboru Kato , Satoshi Ishino
CPC classification number: H05K1/0243 , G06K19/07749 , H01L23/49822 , H01L23/642 , H01L23/645 , H01L23/66 , H01L2223/665 , H01L2223/6677 , H01L2224/13144 , H01L2224/16 , H01L2224/16235 , H01L2224/16238 , H01L2924/01079 , H01L2924/09701 , H01L2924/14 , H01L2924/3011 , H05K1/0239 , H05K1/16 , H05K1/162 , H05K1/165 , H05K2201/10098 , H05K2201/10727 , Y02D70/10
Abstract: A wireless IC device includes a wireless IC chip, a power supply circuit board upon which the wireless IC chip is mounted, and in which a power supply circuit is provided, the power supply circuit includes a resonant circuit having a predetermined resonant frequency, and a radiation pattern, which is adhered to the underside of the power supply circuit board, for radiating a transmission signal supplied from the power supply circuit, and for receiving a reception signal to supply this to the power supply circuit. The resonant circuit is an LC resonant circuit including an inductance device and capacitance devices. The power supply circuit board is a multilayer rigid board or a single-layer rigid board, and between the wireless IC chip and the radiation pattern is connected by DC connection, magnetic coupling, or capacitive coupling.
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公开(公告)号：US20090065594A1
公开(公告)日：2009-03-12
申请号：US12276444
申请日：2008-11-24
Applicant: Noboru Kato , Yuya Dokai , Satoshi Ishino
Inventor： Noboru Kato , Yuya Dokai , Satoshi Ishino
IPC: G06K19/077
CPC classification number: H01Q1/2208 , G06K19/07749 , G06K19/07756 , G06K19/07779 , G06K19/07783 , G06K19/07784 , H01F17/0006 , H01F38/14 , H01L23/49855 , H01L2224/16225 , H01L2924/09701 , H01L2924/3011 , H01Q1/2283 , H01Q1/242 , H01Q1/50 , H01Q7/00 , H01Q23/00 , H01Q25/02
Abstract: A wireless IC device includes a wireless IC chip, a feed circuit board having the wireless IC chip mounted thereon and including a feed circuit including inductance elements, and a radiation plate electromagnetically coupled to the inductance elements in the feed circuit. A high-permeability magnetic body made of a high-permeability magnetic material is provided in the feed circuit board and a portion of the inductance elements is provided in the high-permeability magnetic body.
Abstract translation: 无线IC器件包括无线IC芯片，其上安装有无线IC芯片的馈电电路板，并且包括具有电感元件的馈电电路，以及电磁耦合到馈电电路中的电感元件的辐射板。 由高磁导率磁性材料制成的高导磁率磁体设置在馈电电路板中，并且电感元件的一部分设置在高磁导率磁体中。
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公开(公告)号：US08632014B2
公开(公告)日：2014-01-21
申请号：US12510347
申请日：2009-07-28
Applicant: Noboru Kato , Yuya Dokai , Nobuo Ikemoto
Inventor： Noboru Kato , Yuya Dokai , Nobuo Ikemoto
IPC: G06K19/06
CPC classification number: G06K19/07749 , G06K19/07758 , G06K19/07786
Abstract: A wireless IC device includes a radiating plate, a wireless IC chip, and a feeder circuit board, on which the wireless IC chip is mounted. The feeder circuit board includes a resonant circuit with an inductance element, and the resonant circuit is electromagnetically coupled with the radiating plate. The wireless IC chip is interposed between the radiating plate and the feeder circuit board.
Abstract translation: 无线IC器件包括安装无线IC芯片的辐射板，无线IC芯片和馈电电路板。 馈电电路板包括具有电感元件的谐振电路，并且谐振电路与辐射板电磁耦合。 无线IC芯片插在散热板和馈电电路板之间。
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公开(公告)号：US08418928B2
公开(公告)日：2013-04-16
申请号：US13241823
申请日：2011-09-23
Applicant: Noboru Kato , Yuya Dokai
Inventor： Noboru Kato , Yuya Dokai
IPC: G06K19/05
CPC classification number: G06K19/07754 , G06K19/07749 , G06K19/07756 , H01Q1/2225 , H01Q7/00 , H01Q9/26 , H01Q9/285
Abstract: A wireless IC device includes a wireless IC chip, a coupling electrode, and a radiation plate. The coupling electrode includes coupling portions arranged to be coupled to the wireless IC chip and a pair of opposing ends. The pair of opposing ends are capacitively coupled to each other and oppose the radiation plate to be coupled to the radiation plate. The wireless IC chip uses the radiation plate as an antenna to transmit and receive signals having certain frequencies to and from an RFID system.
Abstract translation: 无线IC器件包括无线IC芯片，耦合电极和辐射板。 耦合电极包括被布置成耦合到无线IC芯片的耦合部分和一对相对的端部。 一对相对的端部彼此电容耦合并且与待耦合到辐射板的辐射板相对。 无线IC芯片使用辐射板作为天线来发射和接收具有一定频率的信号到RFID系统。
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公开(公告)号：US08360324B2
公开(公告)日：2013-01-29
申请号：US12551037
申请日：2009-08-31
Applicant: Shigeyuki Shioya , Noboru Kato , Yuya Dokai
Inventor： Shigeyuki Shioya , Noboru Kato , Yuya Dokai
CPC classification number: G06K19/07749 , H01Q1/2208 , H01Q1/2225 , H01Q1/38 , H01Q9/27 , H01Q9/285 , H01Q9/40 , H01Q21/30
Abstract: A wireless IC device that is operable in a wide band and is suitable for RFID systems includes a radiating plate and an electromagnetically coupled module constituted by a wireless IC that processes transmitted/received signals and a feeding circuit board having a feeding circuit and coupled with the wireless IC. The radiating plate includes a linear electrode bent at a bent portion and apparently sectioned into two linear electrode portions having different lengths. The electromagnetically coupled module is arranged such that the feeding circuit board and the linear electrode portions are electromagnetically coupled. The wireless IC is operated by signals received by the radiating plate, and response signals from the wireless IC are radiated outward from the radiating plate.
Abstract translation: 可在宽带中操作并且适用于RFID系统的无线IC器件包括辐射板和由处理发射/接收信号的无线IC构成的电磁耦合模块，以及具有馈电电路的馈电电路板，并与 无线IC。 辐射板包括在弯曲部分弯曲并且明显地分成具有不同长度的两个线性电极部分的线性电极。 电磁耦合模块被布置成使得馈电电路板和线性电极部分电磁耦合。 无线IC由辐射板接收的信号操作，来自无线IC的响应信号从辐射板向外辐射。
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