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    Arrangement having semiconductor components that emit electromagnetic radiation and production method therefor
    22.
    发明授权
    Arrangement having semiconductor components that emit electromagnetic radiation and production method therefor 有权

    公开(公告)号：US12218109B2

    公开(公告)日：2025-02-04

    申请号：US17614249

    申请日：2020-05-27

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Thomas Schwarz ,  Sebastian Wittmann ,  Andreas Plößl

    IPC: H01L25/075 ,  H01L27/14 ,  H01L33/00 ,  H01L33/46 ,  H01L33/62

    Abstract: In an embodiment an arrangement includes a plurality of optoelectronic semiconductor components arranged in a common plane, wherein each semiconductor component is laterally delimited by side faces, and wherein each semiconductor component includes a semiconductor body having an active region configured to emit electromagnetic radiation, a radiation outlet side configured to couple out the electromagnetic radiation, a rear face opposite to the radiation outlet side, and a contact structure arranged on the rear face, an output element, an electrically insulating insulation layer and an electrical connection structure, wherein the insulation layer is arranged between side faces of adjacent semiconductor components, wherein the output element is arranged at the radiation outlet sides of the semiconductor components, wherein the electrical connection structure is electrically conductively connected with the contact structure, and wherein the connection structure includes an adhesive layer, a growth layer and a connection layer.

    Optoelectronic component and method of producing same
    27.
    发明授权
    Optoelectronic component and method of producing same 有权

    公开(公告)号：US10923640B2

    公开(公告)日：2021-02-16

    申请号：US15771827

    申请日：2016-10-28

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Thomas Schwarz ,  Stefan Listl ,  Björn Hoxhold ,  Frank Singer

    IPC: H01L33/62 ,  H01L25/075 ,  H01L23/00 ,  H01L33/44 ,  H01L33/48 ,  H01L33/50 ,  H01L33/56 ,  H01L33/54 ,  G09F9/302 ,  G09F9/33

    Abstract: An optoelectronic component includes a carrier, and a housing material arranged above a top side of a carrier, wherein a cavity is configured in the housing material, a top side of a first optoelectronic semiconductor chip is arranged in the cavity, the first optoelectronic semiconductor chip has a first electrical connection pad arranged at the top side of the first optoelectronic semiconductor chip, and electrically conductively connects by a bond wire to a first contact pad arranged at the top side of the carrier, a first section of the bond wire is arranged in the cavity and a second section of the bond wire is embedded the housing material, a covering material is arranged in the cavity and covers at least one part of the top side of the first optoelectronic semiconductor chip, and the first section of the bond wire is embedded in the covering material.

    Module for a video wall
    29.
    发明授权
    Module for a video wall 有权

    公开(公告)号：US10553148B2

    公开(公告)日：2020-02-04

    申请号：US15775574

    申请日：2016-11-11

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Alexander Martin ,  Thomas Schwarz ,  Frank Singer ,  Andreas Plössl

    IPC: G09G3/32 ,  G06F3/14 ,  H01L25/075 ,  H01L33/62

    Abstract: A module for a video wall includes a first light emitting chip of an image pixel connecting to a first power line by a first electrical terminal, the first light emitting chip connects to a third power line by a second electrical terminal, a second light emitting chip of the image pixel connects to a second power line by the first electrical terminal, the second light emitting chip of the image pixel connects to a fourth power line by the second electrical terminal, the first and/or the second power line are/is a surface metallization, including contact sections, a light emitting chip is arranged on a contact section, at least between contact sections of a first and of a second power line an insulation layer is provided on a carrier, the insulation layer includes openings above the contact sections, and the light emitting chips are arranged in the openings.

    Electronic component and method for producing an electronic component
    30.
    发明授权
    Electronic component and method for producing an electronic component 有权

    公开(公告)号：US10468317B2

    公开(公告)日：2019-11-05

    申请号：US16047873

    申请日：2018-07-27

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Thomas Schwarz ,  Stefan Groetsch ,  Joerg Erich Sorg ,  Christoph Koller

    IPC: H01L23/14 ,  H01L29/866 ,  H01L31/02 ,  H01L31/024 ,  H01L33/48 ,  H01L33/62 ,  H01L33/64 ,  H05K1/02 ,  H05K1/05 ,  H01L23/60 ,  H01L23/00 ,  H01L25/16

    Abstract: Electronic component with a support comprising a first inorganic insulating layer and a second inorganic insulating layer, between which a metal core is arranged, a first, a second and a third electrically conductive structure which are arranged on a top surface of the carrier, a first and a second electrical contact point and a thermal contact point, which are arranged on a bottom surface of the carrier, a component and an electrical protection element which are arranged on the side of the top surface of the carrier, in which the first electrically conductive structure is electrically conductively connected to the first electrical contact point, the second electrically conductive structure is electrically conductively connected to the second electrical contact point, the third electrically conductive structure is electrically conductively connected to the thermal contact point, the component is electrically conductively connected to the first and second electrically conductive structures, the electrical protection element is electrically conductively connected to the third electrically conductive structure and the first or second electrically conductive structure.

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