公开(公告)号：US11651904B2

公开(公告)日：2023-05-16

申请号：US17873020

申请日：2022-07-25

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

IPC: H01G4/40 ,  H01G4/12

CPC classification number: H01G4/40 ,  H01G4/12

Abstract: A multilayer structure includes a first insulating layer including a first body of an anodized oxide material, a first via conductor penetrating through the first body, and a first internal wiring layer electrically connected to the first via conductor, a second insulating layer including a second body of the anodized oxide material, a second via conductor penetrating through the second body, and a second connection pad electrically connected to the second via conductor, and a solder hump provided on one of the first internal wiring layer and the second connection pad and between the first insulating layer and the second insulating layer. The first via conductor, the first internal wiring layer, the second connection pad, and the second via conductor are electrically connected to each other through the solder bump.

公开(公告)号：US11548170B2

公开(公告)日：2023-01-10

申请号：US16377083

申请日：2019-04-05

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun ,  Tae Hwan Song

IPC: B25J15/06 ,  B65G47/91

Abstract: The present invention relates to a micro LED grip body and a system having the same for inspecting a micro LED, the micro LED grip body having a vacuum-suction structure capable of being used for transferring a micro LED, thereby solving problems of micro LED transfer heads that have been proposed in the related art.

公开(公告)号：US11437196B2

公开(公告)日：2022-09-06

申请号：US16776134

申请日：2020-01-29

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

IPC: H01G4/40 ,  H01G4/12

Abstract: A multilayer ceramic substrate includes a first insulating portion including a body of a ceramic material, a first via conductor penetrating through the body, and a first internal wiring layer and a first connection pad connected to the first via conductor, and a second insulating portion including a body of an anodized oxide material, a second via conductor penetrating through the body, and a second internal wiring layer and a second connection pad connected to the second via conductor.

公开(公告)号：US11337347B2

公开(公告)日：2022-05-17

申请号：US16414521

申请日：2019-05-16

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

IPC: H05K13/04 ,  H01L27/32 ,  H01L33/00 ,  H01L33/08 ,  H01L33/36

Abstract: A system for transferring a micro LED includes a micro LED dropped into a solution. The system further includes a micro LED grip body immersed in the solution, the micro LED grip body including a porous member having pores, and gripping the micro LED with a grip surface where the pores are provided. An upper surface of the porous member is configured with a seating recess having a guide inclined portion on which the micro LED is mounted and a shielding portion provided around the seating recess.

公开(公告)号：US10533253B2

公开(公告)日：2020-01-14

申请号：US15369042

申请日：2016-12-05

Applicant: Point Engineering Co., Ltd.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

IPC: C23C16/455 ,  C25D11/24 ,  B01D67/00 ,  C25D11/04 ,  C23C16/44 ,  B01D71/02 ,  H01J37/32 ,  B01D69/06

Abstract: A fluid permeable anodic oxide film includes a plurality of regularly-disposed pores formed by anodizing metal and a plurality of permeation holes having an inner width larger than an inner width of the pores and extending through the fluid permeable anodic oxide film. Also provided is a fluid permeable body which makes use of the fluid permeable anodic oxide film.

公开(公告)号：US10433370B2

公开(公告)日：2019-10-01

申请号：US15634626

申请日：2017-06-27

Applicant: Point Engineering Co., Ltd.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

IPC: H05B1/02 ,  H05B3/00 ,  G01N27/12 ,  H05B3/08 ,  H05B3/26

Abstract: A micro multi-array heater and a micro multi-array sensor provided with the micro multi-array heater are provided. The micro multi-array heater includes a substrate and a heater electrode formed on the substrate. The heater electrode includes a first heater electrode having a first heat generation pattern and a second heater electrode having a second heat generation pattern. The first heat generation pattern and the second heat generation pattern are formed to have different heat generation amounts.

公开(公告)号：US20180007740A1

公开(公告)日：2018-01-04

申请号：US15634626

申请日：2017-06-27

Applicant: Point Engineering Co., Ltd.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

IPC: H05B1/02 ,  H05B3/00 ,  G01N27/12 ,  H05B3/26 ,  H05B3/08

CPC classification number: H05B1/0294 ,  G01N27/123 ,  G01N27/125 ,  G01N27/128 ,  H05B3/0019 ,  H05B3/08 ,  H05B3/26 ,  H05B2203/002

Abstract: A micro multi-array heater and a micro multi-array sensor provided with the micro multi-array heater are provided. The micro multi-array heater includes a substrate and a heater electrode formed on the substrate. The heater electrode includes a first heater electrode having a first heat generation pattern and a second heater electrode having a second heat generation pattern. The first heat generation pattern and the second heat generation pattern are formed to have different heat generation amounts.

公开(公告)号：US20180003661A1

公开(公告)日：2018-01-04

申请号：US15634645

申请日：2017-06-27

Applicant: Point Engineering Co., Ltd.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

IPC: G01N27/12 ,  G01N27/14 ,  G01N33/00

CPC classification number: G01N27/128 ,  G01N27/14 ,  G01N33/0016 ,  G01N33/0031

Abstract: A micro multi-array sensor includes a substrate, a sensor electrode formed on the substrate, and a heater electrode formed on the substrate. The sensor electrode includes a first sensor electrode formed on the substrate and a second sensor electrode formed on an opposite surface of the substrate from the first sensor electrode. The heater electrode is disposed more adjacent to the first sensor electrode than the second sensor electrode.

公开(公告)号：US11852655B2

公开(公告)日：2023-12-26

申请号：US17038642

申请日：2020-09-30

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

IPC: G01R1/073 ,  H05K1/02 ,  H05K3/10 ,  H05K3/46

CPC classification number: G01R1/07342 ,  H05K1/0298 ,  H05K3/107 ,  H05K3/462

Abstract: Proposed is a multilayer wiring substrate having excellent joining strength, a method of manufacturing the multilayer wiring substrate, and a probe card having the multilayer wiring substrate.

公开(公告)号：US20230090643A1

公开(公告)日：2023-03-23

申请号：US18058177

申请日：2022-11-22

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

IPC: B32B3/26 ,  B32B7/12 ,  B32B15/20 ,  C25D11/04 ,  B32B43/00 ,  B32B37/12 ,  B32B15/04 ,  B23P6/00

Abstract: Proposed are a manufacturing method of an anodic oxide film structure, and an anodic oxide film structure. More particularly, proposed are a manufacturing method of an anodic oxide film structure, and an anodic oxide film structure, wherein production yield of the entire product can be improved by repairing a defective region to be made normal.