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公开(公告)号:US20210150239A1
公开(公告)日:2021-05-20
申请号:US16686063
申请日:2019-11-15
Applicant: QUALCOMM Incorporated
Inventor: Soon Joon Yoon , Changting Xu , Hrishikesh Panchawagh , Kostadin Dimitrov Djordjev
Abstract: Methods, systems, and devices for anti-spoofing detection are described. The methods, systems, and devices include scanning, by a sensor associated with a device, an object placed within a scanning distance of the sensor, identifying a test signal based on scanning the object, comparing the test signal to a reference signal, identifying a first match between the object and a biometric model based on the comparing, identifying, based on the scanning, a second match between a first biometric pattern associated with the object and a stored second biometric pattern, and enabling access to a secure resource associated with the device based on the first match and the second match.
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公开(公告)号:US20210117519A1
公开(公告)日:2021-04-22
申请号:US16655039
申请日:2019-10-16
Applicant: QUALCOMM Incorporated
Inventor: Soon Joon Yoon , Changting Xu , Jessica Liu Strohmann , Hrishikesh Vijaykumar Panchawagh , Kostadin Dimitrov Djordjev
Abstract: A method may involve controlling an apparatus to transmit a first ultrasonic wave by sending first electrical signals to a plurality of separate electrode elements proximate an ultrasonic transceiver layer. The method may involve receiving first electrode layer signals, corresponding to reflections of the first ultrasonic wave, from the electrode layer. The method may involve determining, based on the first electrode layer signals, a location of a target object in contact with the apparatus. The location of the target object may correspond with a proximate electrode element. The method may involve controlling the ultrasonic transceiver layer to transmit a second ultrasonic wave by sending second electrical signals to the proximate electrode element and for receiving receiver pixel signals from at least a portion of the plurality of ultrasonic receiver pixels in an area corresponding with the proximate electrode element.
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公开(公告)号:US20200234021A1
公开(公告)日:2020-07-23
申请号:US16252408
申请日:2019-01-18
Applicant: QUALCOMM Incorporated
Inventor: Yipeng Lu , Hrishikesh Vijaykumar Panchawagh , Kostadin Dimitrov Djordjev , Chin-Jen Tseng , Nicholas Ian Buchan , Tsongming Kao , Jae Hyeong Seo
IPC: G06K9/00
Abstract: An ultrasonic fingerprint sensor system of the present disclosure may be provided with a thick electrically nonconductive acoustic layer and thin electrode layer coupled to a piezoelectric layer of an ultrasonic transmitter or transceiver. The thick electrically nonconductive acoustic layer may have a high density or high acoustic impedance value, and may be adjacent to the piezoelectric layer. The thin electrode layer may be divided into electrode segments. The ultrasonic fingerprint sensor system may use flexible or rigid substrates, and may use an ultrasonic transceiver or an ultrasonic transmitter separate from an ultrasonic receiver.
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公开(公告)号:US10274590B2
公开(公告)日:2019-04-30
申请号:US15782750
申请日:2017-10-12
Applicant: QUALCOMM Incorporated
Inventor: Nai-Kuei Kuo , Kostadin Dimitrov Djordjev , Ranjith Ranganathan , Nao Sugawara Chuei , Ashish Hinger , David William Burns
Abstract: Techniques describe structures and methods for generating larger output signals and improving image quality of ultrasonic sensors by inclusion of an acoustic cavity in the sensor stack. In some embodiments, an ultrasonic sensor unit may be tuned during manufacturing or during a provisioning phase to work with different thicknesses and materials. In some embodiments, a standing wave signal may be generated using an acoustic cavity in the ultrasonic sensor unit for capturing an ultrasonic image of an object placed on a sensor surface. In some implementations, the ultrasonic sensor may include an ultrasonic transmitter, a piezoelectric receiver, a thin film transistor (TFT) layer and a TFT substrate positioned between the transmitter and the receiver, one or more adhesive layers, and optional cover materials and coatings. The thickness, density and speed of sound of the sensor materials and associated adhesive attachment layers may be used to attain the desired acoustic cavity and improved performance.
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公开(公告)号:US10067229B2
公开(公告)日:2018-09-04
申请号:US14864555
申请日:2015-09-24
Applicant: QUALCOMM Incorporated
Inventor: Kostadin Dimitrov Djordjev , Christopher Mark William Daft , David William Burns , Ashish Hinger , Hrishikesh Vijaykumar Panchawagh
Abstract: Methods, systems and storage media are described, each of which may be used to generate an image of an object using ultrasonic plane waves. For example, the generated image may be of a target object positioned on a platen surface. The image may be derived from corrected output signals obtained from a plurality of selected sensor pixels. The corrected output signals may adjust for diffraction of reflected ultrasonic plane waves from a target object positioned on the platen surface. The target object may be a finger or a tip of a stylus.
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公开(公告)号:US20170364726A1
公开(公告)日:2017-12-21
申请号:US15430389
申请日:2017-02-10
Applicant: QUALCOMM Incorporated
Inventor: Nicholas Ian Buchan , Mario Francisco Velez , Chin-Jen Tseng , Hrishikesh Vijaykumar Panchawagh , Firas Sammoura , Jessica Liu Strohmann , Kostadin Dimitrov Djordjev , David Williams Burns , Leonard Eugene Fennell , Jon Gregory Aday
IPC: G06K9/00 , H01L41/107 , H01L41/047 , G02F1/1333 , H01L27/32
CPC classification number: G06K9/0002 , G01N29/22 , G01N29/2437 , G02F1/13338 , H01L27/323 , H01L41/047 , H01L41/107
Abstract: A fingerprint sensor device includes a sensor substrate, a plurality of sensor circuits over a first surface of the sensor substrate, and a transceiver layer located over the plurality of sensor circuits and the first surface of the sensor substrate. The transceiver layer includes a piezoelectric layer and a transceiver electrode positioned over the piezoelectric layer. The piezoelectric layer and the transceiver electrode are configured to generate one or more ultrasonic waves or to receive one or more ultrasonic waves. The fingerprint sensor device may include a cap coupled to the sensor substrate and a cavity formed between the cap and the sensor substrate. The cavity and the sensor substrate may form an acoustic barrier.
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公开(公告)号:US09817108B2
公开(公告)日:2017-11-14
申请号:US14589783
申请日:2015-01-05
Applicant: QUALCOMM Incorporated
Inventor: Nai-Kuei Kuo , Kostadin Dimitrov Djordjev , Ranjith Ranganathan , Nao Sugawara Chuei
CPC classification number: G01S7/52017 , G01S15/02 , G06K9/0002
Abstract: Techniques describe structures and methods for generating larger output signals and improving image quality of ultrasonic sensors by inclusion of an acoustic cavity in the sensor stack. In some embodiments, an ultrasonic sensor unit may be tuned during manufacturing or during a provisioning phase to work with different thicknesses and materials. In some embodiments, a standing wave signal may be generated using an acoustic cavity in the ultrasonic sensor unit for capturing an ultrasonic image of an object placed on a sensor surface. In some implementations, the ultrasonic sensor may include an ultrasonic transmitter, a piezoelectric receiver, a thin film transistor (TFT) layer and a TFT substrate positioned between the transmitter and the receiver, one or more adhesive layers, and optional cover materials and coatings. The thickness, density and speed of sound of the sensor materials and associated adhesive attachment layers may be used to attain the desired acoustic cavity and improved performance.
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公开(公告)号:US20160107194A1
公开(公告)日:2016-04-21
申请号:US14883583
申请日:2015-10-14
Applicant: QUALCOMM Incorporated
Inventor: Hrishikesh Vijaykumar Panchawagh , Hao-Yen Tang , Yipeng Lu , Kostadin Dimitrov Djordjev , Suryaprakash Ganti , David William Burns , Ravindra Vaman Shenoy , Jon Bradley Lasiter , Nai-Kuei Kuo , Firas Sammoura
IPC: B06B1/06 , H01L41/047 , H01L41/053 , H01L41/04
CPC classification number: G01S7/5208 , B06B1/0207 , B06B1/0607 , B06B1/0644 , B06B1/0666 , B06B2201/20 , B06B2201/55 , G01S7/521 , G01S15/04 , G01S15/89 , G01S15/8915 , G06F3/0412 , G06F3/0416 , G06F3/043 , G06F3/0436 , G06F2203/04101 , G06K9/0002 , G06K9/00335 , G10K11/26 , G10K11/34 , G10K11/341 , G10K11/346 , H01L41/047 , H01L41/08
Abstract: A piezoelectric micromechanical ultrasonic transducer (PMUT) includes a diaphragm disposed over a cavity, the diaphragm including a piezoelectric layer stack including a piezoelectric layer, a first electrode electrically coupled with transceiver circuitry, and a second electrode electrically coupled with the transceiver circuitry. The first electrode may be disposed in a first portion of the diaphragm, and the second electrode may be disposed in a second, separate, portion of the diaphragm. Each of the first and the second electrode is disposed on or proximate to a first surface of the piezoelectric layer, the first surface being opposite from the cavity. The PMUT is configured to transmit first ultrasonic signals by way of the first electrode during a first time period and to receive second ultrasonic signals by way of the second electrode during a second time period, the first time period and the second time period being at least partially overlapping.
Abstract translation: 压电微机械超声换能器(PMUT)包括设置在空腔上方的隔膜,所述隔膜包括压电层堆叠,所述压电层堆叠包括压电层,与收发器电路电耦合的第一电极和与所述收发器电路电耦合的第二电极。 第一电极可以设置在隔膜的第一部分中,并且第二电极可以设置在隔膜的第二,分离的部分中。 第一和第二电极中的每一个设置在压电层的第一表面上或其附近,第一表面与空腔相对。 PMUT被配置为在第一时间段期间通过第一电极传输第一超声波信号,并且在第二时间段期间通过第二电极接收第二超声波信号,第一时间段和第二时间段至少是 部分重叠。
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公开(公告)号:US20160019408A1
公开(公告)日:2016-01-21
申请号:US14553823
申请日:2014-11-25
Applicant: QUALCOMM Incorporated
Inventor: Jianwei Liu , Norman Satoru Himaka , Sherman Sebastian Antao , Micah Timothy Lawrence , David William Burns , Kostadin Dimitrov Djordjev
IPC: G06K9/00
CPC classification number: G06K9/0002 , G01R31/2829 , H01H11/0062
Abstract: Techniques for testing ultrasonic fingerprint sensors include operating a fingerprint impress simulator that may cyclically press a contact pad of the simulator against a platen of an ultrasonic sensor under test. A control electronics arrangement may operate the ultrasonic sensor under test and the fingerprint impress simulator, and may receive ultrasonic image data from the ultrasonic sensor under test. The ultrasonic sensor may include an ultrasonic transmitter and an ultrasonic sensor array disposed between the ultrasonic transmitter and the platen. The control electronics arrangement may cause the ultrasonic transmitter to emit an ultrasonic pulse, and may receive ultrasonic image data from the ultrasonic sensor array, the ultrasonic image data being converted from a detected portion of the ultrasonic pulse.
Abstract translation: 用于测试超声波指纹传感器的技术包括操作指纹打印模拟器,其可循环地将模拟器的接触垫压靠在被测超声波传感器的压板上。 控制电子装置可以操作被测超声波传感器和指纹打印模拟器,并且可以从被测超声波传感器接收超声波图像数据。 超声波传感器可以包括超声波发射器和设置在超声波发射器和压板之间的超声波传感器阵列。 控制电子装置可以使超声波发射器发射超声波脉冲,并且可以从超声波传感器阵列接收超声波图像数据,超声波图像数据从超声波脉冲的检测部分转换。
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公开(公告)号:US12284481B2
公开(公告)日:2025-04-22
申请号:US17302714
申请日:2021-05-11
Applicant: QUALCOMM Incorporated
Inventor: Jessica Liu Strohmann , Hrishikesh Vijaykumar Panchawagh , Nicholas Ian Buchan , Yipeng Lu , Kostadin Dimitrov Djordjev
Abstract: A mobile device includes one or more piezoelectric polymer layers underlying a display. The one or more piezoelectric polymer layers may be electrically driven to operate in either a d33 stretching mode or a d31 bending mode. The mobile device functions as an ultrasonic sensor in the d33 stretching mode and as an audio speaker/microphone or a proximity sensor in the d31 bending mode. The piezoelectric polymer layer operating in the d31 bending mode may be directly mechanically coupled to a display, indirectly mechanically coupled to the display and underlying an ultrasonic sensor stack, or integrated in the ultrasonic sensor stack. Signal performance of the piezoelectric polymer layer operating in the d31 bending mode may be enhanced or modulated by having a larger area, multiple layers, bi-pole or uni-pole driving with multiple layers, one or more stiff adhesives, a spacer layer, one or more mass features, a thin TFT layer, a thick piezoelectric polymer layer, or combinations thereof.
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