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公开(公告)号：US10929636B2
公开(公告)日：2021-02-23
申请号：US16252408
申请日：2019-01-18
Applicant: QUALCOMM Incorporated
Inventor： Yipeng Lu , Hrishikesh Vijaykumar Panchawagh , Kostadin Dimitrov Djordjev , Chin-Jen Tseng , Nicholas Ian Buchan , Tsongming Kao , Jae Hyeong Seo
IPC: G06K9/00
Abstract: An ultrasonic fingerprint sensor system of the present disclosure may be provided with a thick electrically nonconductive acoustic layer and thin electrode layer coupled to a piezoelectric layer of an ultrasonic transmitter or transceiver. The thick electrically nonconductive acoustic layer may have a high density or high acoustic impedance value, and may be adjacent to the piezoelectric layer. The thin electrode layer may be divided into electrode segments. The ultrasonic fingerprint sensor system may use flexible or rigid substrates, and may use an ultrasonic transceiver or an ultrasonic transmitter separate from an ultrasonic receiver.
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公开(公告)号：US11087108B2
公开(公告)日：2021-08-10
申请号：US16691416
申请日：2019-11-21
Applicant: QUALCOMM Incorporated
Inventor： Jack Conway Kitchens , John Keith Schneider , Stephen Michael Gojevic , Evan Michael Breloff , James Anthony Miranto , Emily Kathryn Brooks , Fitzgerald John Archibald , Alexei Stoianov , Raj Kumar , Sai Praneeth Sreeram , Nirma Lnu , Sandeep Louis D'Souza , Nicholas Ian Buchan , Yipeng Lu , Chin-Jen Tseng , Hrishikesh Vijaykumar Panchawagh
Abstract: An apparatus may include a cover layer, a layer of first metamaterial proximate (or in) the cover layer, a light source system configured for providing light to the layer of first metamaterial and a receiver system. The first metamaterial may include nanoparticles configured to create ultrasonic waves when illuminated by light. The receiver system may include an ultrasonic receiver system configured to receive ultrasonic waves reflected from a target object in contact with, or proximate, a surface of the cover layer. The control system may be configured to receive ultrasonic receiver signals from the ultrasonic receiver system corresponding to the ultrasonic waves reflected from the target object and to perform an authentication process and/or an imaging process that is based, at least in part, on the ultrasonic receiver signals.
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公开(公告)号：US20200234021A1
公开(公告)日：2020-07-23
申请号：US16252408
申请日：2019-01-18
Applicant: QUALCOMM Incorporated
Inventor： Yipeng Lu , Hrishikesh Vijaykumar Panchawagh , Kostadin Dimitrov Djordjev , Chin-Jen Tseng , Nicholas Ian Buchan , Tsongming Kao , Jae Hyeong Seo
IPC: G06K9/00
Abstract: An ultrasonic fingerprint sensor system of the present disclosure may be provided with a thick electrically nonconductive acoustic layer and thin electrode layer coupled to a piezoelectric layer of an ultrasonic transmitter or transceiver. The thick electrically nonconductive acoustic layer may have a high density or high acoustic impedance value, and may be adjacent to the piezoelectric layer. The thin electrode layer may be divided into electrode segments. The ultrasonic fingerprint sensor system may use flexible or rigid substrates, and may use an ultrasonic transceiver or an ultrasonic transmitter separate from an ultrasonic receiver.
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公开(公告)号：US20170364726A1
公开(公告)日：2017-12-21
申请号：US15430389
申请日：2017-02-10
Applicant: QUALCOMM Incorporated
Inventor： Nicholas Ian Buchan , Mario Francisco Velez , Chin-Jen Tseng , Hrishikesh Vijaykumar Panchawagh , Firas Sammoura , Jessica Liu Strohmann , Kostadin Dimitrov Djordjev , David Williams Burns , Leonard Eugene Fennell , Jon Gregory Aday
IPC: G06K9/00 , H01L41/107 , H01L41/047 , G02F1/1333 , H01L27/32
CPC classification number: G06K9/0002 , G01N29/22 , G01N29/2437 , G02F1/13338 , H01L27/323 , H01L41/047 , H01L41/107
Abstract: A fingerprint sensor device includes a sensor substrate, a plurality of sensor circuits over a first surface of the sensor substrate, and a transceiver layer located over the plurality of sensor circuits and the first surface of the sensor substrate. The transceiver layer includes a piezoelectric layer and a transceiver electrode positioned over the piezoelectric layer. The piezoelectric layer and the transceiver electrode are configured to generate one or more ultrasonic waves or to receive one or more ultrasonic waves. The fingerprint sensor device may include a cap coupled to the sensor substrate and a cavity formed between the cap and the sensor substrate. The cavity and the sensor substrate may form an acoustic barrier.
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公开(公告)号：US12169977B2
公开(公告)日：2024-12-17
申请号：US18486914
申请日：2023-10-13
Applicant: QUALCOMM Incorporated
Inventor： Shiang-Chi Lin , Hrishikesh Vijaykumar Panchawagh , Jessica Liu Strohmann , Yipeng Lu , Chin-Jen Tseng , Kostadin Dimitrov Djordjev , Min-Lun Yang , Chia-Wei Yang
Abstract: An apparatus may include an ultrasonic sensor stack, a foldable display stack and a transmission enhancement layer. The foldable display stack may include a display stiffener and display stack layers. The display stack layers may form one or more display stack resonators configured to enhance ultrasonic waves transmitted by the ultrasonic sensor stack in a first ultrasonic frequency range. In some implementations, a transmission enhancement resonator may include the display stiffener and the transmission enhancement layer. In some examples, the transmission enhancement resonator may include at least a portion of the ultrasonic sensor stack. The transmission enhancement resonator may be configured to enhance the ultrasonic waves transmitted by the ultrasonic sensor stack in the first ultrasonic frequency range.
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Patent Agency Ranking
公开(公告)号：US11910716B1
公开(公告)日：2024-02-20
申请号：US18163714
申请日：2023-02-02
Applicant: QUALCOMM Incorporated
Inventor： Chin-Jen Tseng , Jessica Liu Strohmann , Ila Badge , Shiang-Chi Lin , Min-Lun Yang , Hrishikesh Vijaykumar Panchawagh
CPC classification number: H10N30/10516 , G06V40/1306 , G06V40/1347 , H10K59/90 , H10N39/00
Abstract: An apparatus includes an ultrasonic sensor stack, a foldable display stack that includes a display stiffener, and an additional stiffener between the ultrasonic sensor stack and the foldable display stack. The additional stiffener forms an acoustic resonator with the display stiffener and an adhesive layer between the display stiffener and the additional stiffener in order to amplify transmission of ultrasonic waves transmitted by the ultrasonic sensor stack. The additional stiffener includes a material having a high modulus of elasticity, low density, and high acoustic impedance value. In some cases, the additional stiffener includes a metal, a ceramic, a glass, or a glass ceramic. The additional stiffener increases an overall stiffness and mechanical integrity of the apparatus so that a foam backer may be omitted from the ultrasonic sensor stack.
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公开(公告)号：US11003884B2
公开(公告)日：2021-05-11
申请号：US15430389
申请日：2017-02-10
Applicant: QUALCOMM Incorporated
Inventor： Nicholas Ian Buchan , Mario Francisco Velez , Chin-Jen Tseng , Hrishikesh Vijaykumar Panchawagh , Firas Sammoura , Jessica Liu Strohmann , Kostadin Dimitrov Djordjev , David William Burns , Leonard Eugene Fennell , Jon Gregory Aday
IPC: G06K9/00 , G01N29/22 , G01N29/24 , H01L41/047 , H01L41/107 , G02F1/1333 , H01L27/32
Abstract: A fingerprint sensor device includes a sensor substrate, a plurality of sensor circuits over a first surface of the sensor substrate, and a transceiver layer located over the plurality of sensor circuits and the first surface of the sensor substrate. The transceiver layer includes a piezoelectric layer and a transceiver electrode positioned over the piezoelectric layer. The piezoelectric layer and the transceiver electrode are configured to generate one or more ultrasonic waves or to receive one or more ultrasonic waves. The fingerprint sensor device may include a cap coupled to the sensor substrate and a cavity formed between the cap and the sensor substrate. The cavity and the sensor substrate may form an acoustic barrier.
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公开(公告)号：US20240206736A1
公开(公告)日：2024-06-27
申请号：US18069859
申请日：2022-12-21
Applicant: QUALCOMM Incorporated
Inventor： Yipeng LU , Hrishikesh Vijaykumar PANCHAWAGH , Nicholas BUCHAN , Kostadin Dimitrov DJORDJEV , Camilo PEREZ SAAIBI , Legardo REYES , Ali LOPEZ , Ila BADGE , Chin-Jen Tseng , Ye ZHAN , John Keith Schneider
CPC classification number: A61B5/0095 , A61B5/02125 , A61B5/6824 , A61B5/6826 , B06B1/0611 , B06B3/00 , G01H11/08 , G10K11/02 , G10K11/162 , G10K11/30 , B06B2201/76
Abstract: An apparatus may include a platen, a light source system and an ultrasonic receiver system. The light source system may be configured to provide light to a target object on an outer surface of the platen. The light source system may be configured to direct the light along a first axis oriented at a first angle relative to the outer surface of the platen. The ultrasonic receiver system may be configured to receive ultrasonic waves generated by the target object responsive to the light from the light source system. The ultrasonic receiver system may include one or more receiver elements residing in a receiver plane. A normal to the receiver plane being may be oriented along a second axis at a second angle relative to the outer surface of the platen. The first angle may be different from the second angle.
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公开(公告)号：US11798307B2
公开(公告)日：2023-10-24
申请号：US17446436
申请日：2021-08-30
Applicant: QUALCOMM Incorporated
Inventor： Shiang-Chi Lin , Hrishikesh Vijaykumar Panchawagh , Jessica Liu Strohmann , Yipeng Lu , Chin-Jen Tseng , Kostadin Dimitrov Djordjev , Min-Lun Yang , Chia-Wei Yang
CPC classification number: G06V40/1306 , G01S7/52079 , G06F21/32
Abstract: An apparatus may include an ultrasonic sensor stack, a foldable display stack and a transmission enhancement layer. The foldable display stack may include a display stiffener and display stack layers. The display stack layers may form one or more display stack resonators configured to enhance ultrasonic waves transmitted by the ultrasonic sensor stack in a first ultrasonic frequency range. In some implementations, a transmission enhancement resonator may include the display stiffener and the transmission enhancement layer. In some examples, the transmission enhancement resonator may include at least a portion of the ultrasonic sensor stack. The transmission enhancement resonator may be configured to enhance the ultrasonic waves transmitted by the ultrasonic sensor stack in the first ultrasonic frequency range.
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公开(公告)号：US20210158002A1
公开(公告)日：2021-05-27
申请号：US16691416
申请日：2019-11-21
Applicant: QUALCOMM Incorporated
Inventor： Jack Conway Kitchens , John Keith Schneider , Stephen Michael Gojevic , Evan Michael Breloff , James Anthony Miranto , Emily Kathryn Brooks , Fitzgerald John Archibald , Alexei Stoianov , Raj Kumar , Sai Praneeth Sreeram , Nirma Lnu , Sandeep Louis D'Souza , Nicholas Ian Buchan , Yipeng Lu , Chin-Jen Tseng , Hrishikesh Vijaykumar Panchawagh
Abstract: An apparatus may include a cover layer, a layer of first metamaterial proximate (or in) the cover layer, a light source system configured for providing light to the layer of first metamaterial and a receiver system. The first metamaterial may include nanoparticles configured to create ultrasonic waves when illuminated by light. The receiver system may include an ultrasonic receiver system configured to receive ultrasonic waves reflected from a target object in contact with, or proximate, a surface of the cover layer. The control system may be configured to receive ultrasonic receiver signals from the ultrasonic receiver system corresponding to the ultrasonic waves reflected from the target object and to perform an authentication process and/or an imaging process that is based, at least in part, on the ultrasonic receiver signals.
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