Capacitor component and method of manufacturing the same

    公开(公告)号:US10699845B2

    公开(公告)日:2020-06-30

    申请号:US15965528

    申请日:2018-04-27

    Abstract: A capacitor component includes a dielectric including a first main surface and a second main surface facing each other, and at least one end surface that connects the first main surface and the second main surface, the dielectric being vertically disposed by positioning the at least one end surface on a lower surface of the capacitor component, and a first electrode and a second electrode that are disposed on the first main surface and the second main surface of the dielectric, respectively, wherein a size of each of the first electrode and the second electrode is greater than a size of the dielectric.

    CAPACITOR COMPONENT AND METHOD OF MANUFACTURING THE SAME

    公开(公告)号:US20190131069A1

    公开(公告)日:2019-05-02

    申请号:US15965528

    申请日:2018-04-27

    Abstract: A capacitor component includes a dielectric including a first main surface and a second main surface facing each other, and at least one end surface that connects the first main surface and the second main surface, the dielectric being vertically disposed by positioning the at least one end surface on a lower surface of the capacitor component, and a first electrode and a second electrode that are disposed on the first main surface and the second main surface of the dielectric, respectively, wherein a size of each of the first electrode and the second electrode is greater than a size of the dielectric.

    Thin-film ceramic capacitor
    24.
    发明授权

    公开(公告)号:US10199167B2

    公开(公告)日:2019-02-05

    申请号:US15642025

    申请日:2017-07-05

    Abstract: A thin-film ceramic capacitor includes a body, a plurality of dielectric layers and first and second electrode layers alternately disposed on a substrate in the body, first and second electrode pads disposed on an external surface of the body, and a plurality of vias disposed in the body, the plurality of dielectric layers and first and second electrode layers having inclined etched surfaces exposed to the plurality of vias, a first via, of the plurality of vias, being connected to the inclined surface of the first electrode layer, and a second via, of the plurality of vias, being connected to the inclined surface of the second electrode layer.

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