IMAGE SENSOR
    22.
    发明公开
    IMAGE SENSOR 审中-公开

    公开(公告)号:US20240021638A1

    公开(公告)日:2024-01-18

    申请号:US18221736

    申请日:2023-07-13

    CPC classification number: H01L27/14623 H01L27/14645

    Abstract: An image sensor includes a first pixel group on a substrate and including a plurality of first pixels, a second pixel group on the substrate and including a plurality of second pixels, where at least one of the plurality of first pixels and at least one of the plurality of second pixels are adjacent in a first direction, a first autofocus pixel group between the first pixel group and the second pixel group, the first autofocus pixel group including a first autofocus pixel adjacent to the first pixel group and a second autofocus pixel adjacent to the second pixel group, a first color filter on the first autofocus pixel and the second autofocus pixel, a second color filter on the plurality of second pixels, and a light-shield pattern that separates the first color filter and the second color filter.

    SEMICONDUCTOR DEVICE
    23.
    发明申请

    公开(公告)号:US20220173255A1

    公开(公告)日:2022-06-02

    申请号:US17461034

    申请日:2021-08-30

    Abstract: A semiconductor apparatus includes a plurality of semiconductor devices. The semiconductor devices each include a ferroelectric layer, a conductive metal oxide layer, and a semiconductor layer, between two electrodes. The conductive metal oxide layer may be between the ferroelectric layer and the semiconductor layer. The ferroelectric layer, the conductive metal oxide layer, and the semiconductor layer may all include a metal oxide. The conductive metal oxide layer may include one or more materials selected from the group consisting of an indium oxide, a zinc oxide, a tin oxide, and any combination thereof.

    FIELD-EFFECT TRANSISTOR, FIELD-EFFECT TRANSISTOR ARRAY STRUCTURE AND METHOD OF MANUFACTURING FIELD-EFFECT TRANSISTOR

    公开(公告)号:US20220149166A1

    公开(公告)日:2022-05-12

    申请号:US17399175

    申请日:2021-08-11

    Abstract: A field-effect transistor includes a gate structure comprising a structure in which a first insulating layer, a first gate electrode, and a second insulating layer are sequentially stacked on a first conductive layer, the gate structure surrounding a first hole through the first insulating layer and exposing a part of the first conductive layer; a second conductive layer on the second insulating layer and surrounding a second hole connected to the first hole and exposing a part of the first conductive layer; a first gate insulating layer covering an inner wall of the gate structure exposed by the first hole; a semiconductor layer covering a part of the first conductive layer exposed through the first hole and the second hole, the first gate insulating layer, and the second conductive layer; a second gate insulating layer covering the semiconductor layer; and a second gate electrode filling the first and second holes.

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