Electronic device including heat dissipation structure

    公开(公告)号:US11013149B2

    公开(公告)日:2021-05-18

    申请号:US16810144

    申请日:2020-03-05

    Abstract: An electronic device is provided. The electronic device includes a housing including a front plate, a rear plate facing away from the front plate, and a side structure surrounding a space between the front plate and the rear plate, a heat dissipation member accommodated inside the housing, at least one antenna module disposed adjacent to the side structure or at least partially accommodated in the side structure, the at least one antenna module being disposed to be inclined or perpendicular relative to the front plate or the rear plate, and a fixing member coupled to and at least partially surrounding the antenna module. The fixing member may include a first heat transfer portion at least partially surrounding a rear face of the antenna module, and a second heat transfer portion disposed in contact with the heat dissipation member.

    Conduit structure of electronic device and electronic device including the same

    公开(公告)号:US10819836B2

    公开(公告)日:2020-10-27

    申请号:US16387059

    申请日:2019-04-17

    Abstract: A conduit structure of an electronic device and an electronic device are provided. The conduit structure includes an inner structure including a front surface and a rear surface, wherein the front surface includes a first region configured to receive a display and a second region, which is a remaining area of the front surface of the inner structure; a receiver hole configured to penetrate the second region and to connect a receiver receiving space and an external space of the inner structure; a first through-hole configured to penetrate the first region and to connect the receiver receiving space and the front surface of the inner structure; a second through-hole, which is spaced apart from the first through-hole, configured to penetrate the first region and to connect the rear surface of the inner structure; and a flow path configured to connect the first through-hole and the second through-hole at the front surface of the inner structure.

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