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    Electronic device having heat-radiating structure
    5.
    发明授权
    Electronic device having heat-radiating structure 有权

    公开(公告)号：US11800632B2

    公开(公告)日：2023-10-24

    申请号：US17262973

    申请日：2019-07-24

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Yonghwa Kim ,  Min Park ,  Dongil Son ,  Hyunwoo Sim ,  Jaedeok Lim ,  Chunghyo Jung ,  Seungbum Choi

    IPC: H05K1/02

    CPC classification number: H05K1/0207 ,  H05K1/0209 ,  H05K1/0219

    Abstract: According to various embodiments, an electronic device may include a first plate, a second plate facing away from the first plate, and a side member surrounding a space between the first plate and the second plate, a middle plate disposed in the space between the first plate and the second plate in parallel with the second plate, a first Printed Circuit Board (PCB) disposed in a space between the second plate and the middle plate, a first electronic component mounted on the first PCB between the first PCB and the middle plate, a first heat transfer structure disposed between the first electronic component and the middle plate, a second electronic component including a first surface disposed in the space and spaced apart from the first PCB, a second surface facing away from the first surface, and a side face substantially perpendicular to the first surface or the second surface, and a second heat transfer structure. The second heat transfer structure may include a first thermal conductive layer including a first portion attached to the first surface or the second surface, and a second portion extending from the first portion toward the middle plate and at least partially having a thermal conductive path between the second electronic component and the middle plate, and a second electrical conductive layer including a third portion attached to the first portion so that the third portion constructs an electromagnetic shielding structure for the second electric component. Other various embodiments may also be possible.

    Display including shielding member arranged to cover at least part of display driving circuit, and electronic device including same
    6.
    发明授权
    Display including shielding member arranged to cover at least part of display driving circuit, and electronic device including same 有权

    公开(公告)号：US11503749B2

    公开(公告)日：2022-11-15

    申请号：US17048552

    申请日：2019-04-18

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Hyunwoo Sim ,  Yonghwa Kim ,  Dongil Son ,  Seungbum Choi

    IPC: H05K9/00 ,  H05K1/18 ,  H05K5/00

    Abstract: According to various embodiments, an electronic device may include a housing, and a display disposed to at least part of the housing. The display may include a display panel including at least one pixel, and a substrate layer disposed below the display panel. The substrate layer may include a bendable connecting area extending to the outside of the display panel. The display may further include a display driving circuit disposed to one face of the connecting area, a Flexible Printed Circuit Board (FPCB) electrically coupled with at least part of the connecting area and including a contact area to which a conductor electrically coupled with a ground portion of the electronic device is exposed, and a shielding member electrically coupled with the contact area. The shielding member may be disposed on the FPCB and one face of the connecting area to cover at least part of the display driving circuit. Various other embodiments may also be possible.

    Electronic device including connecting member sharing structure
    8.
    发明授权
    Electronic device including connecting member sharing structure 有权

    公开(公告)号：US11019190B2

    公开(公告)日：2021-05-25

    申请号：US16515712

    申请日：2019-07-18

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Yonghwa Kim ,  Bumhee Bae ,  Dongil Son ,  Hyunwoo Sim ,  Jaedeok Lim ,  Seungbum Choi

    IPC: H04M1/02 ,  H04B1/38 ,  H01Q5/30 ,  H01Q1/24

    Abstract: An electronic device includes a housing including a first plate, a second plate facing away from the first plate, and a lateral member surrounding a space between the first and second plates; a display disposed in the housing and exposed through at least a part of the first plate; an antenna module disposed at a first area adjacent to the lateral member; an electronic component disposed at a second area adjacent to the first area in the housing; at least one wireless communication circuit disposed in the housing and configured to transmit or receive a signal having a frequency between 3 gigahertz (GHz) and 100 GHz through the antenna module; a processor disposed in the housing; and a flexible printed circuit board (FPCB) including a first conductive line electrically connected between the at least one wireless communication circuit and the antenna module, and a second conductive line electrically connected between the processor and the electronic component.

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