公开(公告)号：US20220402751A1

公开(公告)日：2022-12-22

申请号：US17664022

申请日：2022-05-18

Applicant: Skyworks Solutions, Inc.

Inventor： Guofeng Chen ,  Michael Jon Wurtz ,  Rakesh Kumar ,  You Qian ,  Humberto Campanella-Pineda

IPC: B81B3/00 ,  H01L41/113 ,  H01L41/047

Abstract: An acoustic sensor (e.g., for use in a piezoelectric MEMS microphone) includes a substrate and a cantilever beam attached to the substrate. The cantilever beam has a proximal portion attached to the substrate and extending to a distal tip at a free end of the beam. The cantilevered beam has a width in plan view that is greater at a location distal of the proximal portion than at the proximal portion attached to the substrate. One or more electrodes are disposed on or in the proximal portion of the beam.

公开(公告)号：US12297100B2

公开(公告)日：2025-05-13

申请号：US18045885

申请日：2022-10-12

Applicant: SKYWORKS SOLUTIONS, INC.

Inventor： Humberto Campanella-Pineda ,  Michael Jon Wurtz ,  Rakesh Kumar ,  You Qian ,  Guofeng Chen

IPC: H04R3/00 ,  B81B7/02 ,  H04R17/02

Abstract: Electronic acoustic devices and methods of operating the same include a microphone having a frequency response including a resonance frequency, a reference microphone having a frequency response including a resonance frequency, the microphone and the reference microphone configured to substantially simultaneously receive a common acoustic signal to produce a transduced signal of the microphone and a transduced signal of the reference microphone, the resonance frequency of the reference microphone being different than the resonance frequency of the microphone, and an equalization module configured to equalize the frequency response of the microphone based on the transduced signal of the microphone and the transduced signal of the reference microphone.

公开(公告)号：US12273680B2

公开(公告)日：2025-04-08

申请号：US18045888

申请日：2022-10-12

Applicant: SKYWORKS SOLUTIONS, INC.

Inventor： Humberto Campanella-Pineda ,  Michael Jon Wurtz ,  You Qian ,  Guofeng Chen ,  Rakesh Kumar

IPC: H04R1/24 ,  G01H3/12 ,  H04R1/04 ,  H04R19/04 ,  H04R31/00

Abstract: An electronic device package comprises a primary microphone having a frequency response having a first resonance frequency, and a reference microphone having a frequency response including a second resonance frequency, the primary microphone and the reference microphone configured to substantially simultaneously receive a same acoustic signal to produce a transduced signal of the primary microphone and a transduced signal of the reference microphone, the second resonance frequency of the reference microphone being different than the first resonance frequency of the primary microphone, the package having dimensions that cause the primary microphone and reference microphone to be acoustically isolated from one another at the resonance frequency of the primary microphone, there being less than 3 dB of acoustic coupling between the primary microphone and reference microphone at the first resonance frequency.

公开(公告)号：US20230283963A1

公开(公告)日：2023-09-07

申请号：US18176598

申请日：2023-03-01

Applicant: Skyworks Solutions, Inc.

Inventor： Guofeng Chen ,  Rakesh Kumar ,  You Qian ,  Michael Jon Wurtz ,  Humberto Campanella-Pineda

IPC: H04R17/02 ,  H04R1/04 ,  H04R1/08 ,  H04R3/00

CPC classification number: H04R17/02 ,  H04R1/04 ,  H04R1/086 ,  H04R3/00 ,  H04R2201/003

Abstract: A piezoelectric microelectromechanical system microphone assembly comprises a carrier substrate including one of a through-hole or a recess, and a package including a microelectromechanical system die having a piezoelectric microelectromechanical system microphone mounted on a microphone substrate and a lid, at least a portion of the package disposed within the one of the through-hole or recess.

公开(公告)号：US11716576B2

公开(公告)日：2023-08-01

申请号：US17674203

申请日：2022-02-17

Applicant: SKYWORKS SOLUTIONS, INC.

Inventor： Guofeng Chen ,  You Qian ,  Rakesh Kumar ,  Michael Jon Wurtz ,  Humberto Campanella-Pineda

IPC: H04R17/02 ,  H04R7/08 ,  H04R7/18 ,  H10N30/50

CPC classification number: H04R17/02 ,  H04R7/08 ,  H04R7/18 ,  H10N30/508 ,  H04R2201/003

Abstract: A piezoelectric microelectromechanical system microphone comprises a piezoelectric element configured to deform and generate an electrical potential responsive to impingement of sound waves on the piezoelectric element, a sensing electrode disposed on the piezoelectric element and configured to sense the electrical potential, and a dummy electrode electrically unconnected to the sensing electrode and disposed on a portion of the piezoelectric element that is free of the sensing electrode, the dummy electrode configured to reduce static deformation of the piezoelectric element caused by residual stresses in the piezoelectric element.

公开(公告)号：US20230136347A1

公开(公告)日：2023-05-04

申请号：US18050906

申请日：2022-10-28

Applicant: Skyworks Solutions, Inc.

Inventor： You Qian ,  Rakesh Kumar ,  Guofeng Chen

IPC: B81C1/00 ,  H04R31/00 ,  H10N30/30

Abstract: A method for making a cantilever sensor includes forming a beam extending between a proximal portion and a distal end, and forming and attaching an electrode on the proximal portion. The beam is attached to a substrate in cantilever form so that the proximal portion of the beam is anchored to the substrate and the distal end of the beam is unsupported. The method includes modifying the resonance frequency of the cantilever sensor by forming at least the tip of the beam of a material having one or both of a density and Young's modulus that provides the desired resonant frequency, or by forming at least the tip of the beam so that it has a greater height in a Z direction transverse to a length of the beam than the proximal portion of the beam to thereby tune a resonant frequency of the sensor.

公开(公告)号：US20230125523A1

公开(公告)日：2023-04-27

申请号：US18047443

申请日：2022-10-18

Applicant: Skyworks Solutions, Inc.

Inventor： You Qian ,  Humberto Campanella-Pineda ,  Guofeng Chen ,  Rakesh Kumar

IPC: H04R17/02 ,  H01L41/113 ,  H04R7/10 ,  H04R3/00

Abstract: A piezoelectric sensor (e.g., for use in a piezoelectric MEMS microphone) includes a substrate and a cantilever beam attached to the substrate. The cantilever beam has a proximal portion attached to the substrate and extending to an unsupported distal end. An electrode is disposed on or in the proximal portion of the beam and has an outer boundary with a shape substantially corresponding to a contour line of a strain distribution plot for the cantilever beam resulting from a force applied to the cantilever beam.

公开(公告)号：US20220408208A1

公开(公告)日：2022-12-22

申请号：US17664023

申请日：2022-05-18

Applicant: Skyworks Solutions, Inc.

Inventor： Guofeng Chen ,  Michael Jon Wurtz ,  Rakesh Kumar ,  You Qian ,  Humberto Campanella-Pineda

IPC: H04R31/00 ,  H04R17/02 ,  H04R3/00 ,  H01L41/083 ,  H01L41/113 ,  H01L41/27

Abstract: A method of making an acoustic sensor (e.g., a piezoelectric sensor for a piezoelectric microelectromechanical systems microphone) includes forming or depositing one or more piezoelectric layers to define a beam extending between a proximal portion and a distal tip (e.g., unsupported free end), the beam having a width in plan view that is greater at a location distal of the proximal portion than at the proximal portion. The method also comprises attaching the beam to a substrate in cantilever form so that the proximal portion of the beam is anchored to the substrate and the distal tip is a free unsupported end of the beam. One or more electrodes are disposed on or in the proximal portion of the beam.