Patent search ap:("TESSERA Page INC.") AND inv:"Wael Zohni"

21.

发明申请
ENHANCED STACKED MICROELECTRONIC ASSEMBLIES WITH CENTRAL CONTACTS AND IMPROVED THERMAL CHARACTERISTICS 有权
Title translation: 具有中央联系的增强型堆叠式微电子组件和改进的热特性

公开(公告)号：US20150145117A1

公开(公告)日：2015-05-28

申请号：US14605208

申请日：2015-01-26

Applicant: Tessera, Inc.

Inventor： Belgacem Haba , Wael Zohni , Richard Dewitt Crisp

IPC: H01L25/065 , H01L23/373 , H01L23/367 , H01L23/00

CPC classification number: H01L25/0652 , H01L23/13 , H01L23/3128 , H01L23/367 , H01L23/3677 , H01L23/3731 , H01L23/3736 , H01L23/4334 , H01L23/49816 , H01L24/14 , H01L24/32 , H01L24/33 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/0657 , H01L25/105 , H01L2224/06136 , H01L2224/13014 , H01L2224/14519 , H01L2224/32145 , H01L2224/32188 , H01L2224/32225 , H01L2224/48091 , H01L2224/48106 , H01L2224/4824 , H01L2224/484 , H01L2224/49111 , H01L2224/731 , H01L2224/73215 , H01L2224/73253 , H01L2225/0651 , H01L2225/06555 , H01L2225/06562 , H01L2225/06575 , H01L2225/06589 , H01L2225/1023 , H01L2225/1058 , H01L2225/1094 , H01L2924/00014 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/0105 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/10253 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/19107 , H01L2924/30107 , H01L2224/48227 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599

Abstract: A microelectronic assembly includes a dielectric element having oppositely-facing first and second surfaces and one or more apertures extending between the surfaces, the dielectric element further having conductive elements thereon; a first microelectronic element having a rear surface and a front surface facing the first surface of the dielectric element, the first microelectronic element having a first edge and a plurality of contacts exposed at the front surface thereof; a second microelectronic element including having a rear surface and a front surface facing the rear surface of the first microelectronic element, a projecting portion of the front surface of the second microelectronic element extending beyond the first edge of the first microelectronic element, the projecting portion being spaced from the first surface of the dielectric element, the second microelectronic element having a plurality of contacts exposed at the projecting portion of the front surface; leads extending from contacts of the microelectronic elements through the at least one aperture to at least some of the conductive elements; and a heat spreader thermally coupled to at least one of the first microelectronic element or the second microelectronic element.

Abstract translation: 微电子组件包括具有相对面对的第一和第二表面的介电元件和在表面之间延伸的一个或多个孔，该介电元件还在其上具有导电元件; 第一微电子元件，其具有背面和面向电介质元件的第一表面的前表面，第一微电子元件具有第一边缘和暴露在其前表面的多个触点; 第二微电子元件，包括具有背面和面向第一微电子元件的后表面的前表面，第二微电子元件的前表面的突出部分延伸超过第一微电子元件的第一边缘，突出部分为与介电元件的第一表面间隔开，第二微电子元件具有在前表面的突出部分处露出的多个触点; 从微电子元件的接触通过至少一个孔延伸到至少一些导电元件的引线; 以及热耦合到第一微电子元件或第二微电子元件中的至少一个的散热器。

22.

发明申请
FLIP-CHIP, FACE-UP AND FACE-DOWN CENTERBOND MEMORY WIREBOND ASSEMBLIES 有权
Title translation: FLIP-CHIP，FACE-UP和FACE-DOWN CENTREBOND MEMORY WIREBOND ASSEMBLIES

公开(公告)号：US20150115477A1

公开(公告)日：2015-04-30

申请号：US14589578

申请日：2015-01-05

Applicant: Tessera, Inc.

Inventor： Belgacem Haba , Richard Dewitt Crisp , Wael Zohni

IPC: H01L23/50 , H01L23/00

CPC classification number: H01L23/50 , H01L23/13 , H01L23/3128 , H01L23/49811 , H01L23/49816 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/0652 , H01L25/0657 , H01L25/105 , H01L25/16 , H01L25/18 , H01L2224/0401 , H01L2224/04042 , H01L2224/05599 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/06135 , H01L2224/06136 , H01L2224/13099 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/16245 , H01L2224/29101 , H01L2224/29191 , H01L2224/32145 , H01L2224/32225 , H01L2224/32227 , H01L2224/32245 , H01L2224/45099 , H01L2224/48095 , H01L2224/48137 , H01L2224/48145 , H01L2224/48227 , H01L2224/4824 , H01L2224/48247 , H01L2224/4826 , H01L2224/48472 , H01L2224/4911 , H01L2224/49112 , H01L2224/49175 , H01L2224/73203 , H01L2224/73204 , H01L2224/73215 , H01L2224/73253 , H01L2224/73265 , H01L2225/0651 , H01L2225/06562 , H01L2225/06575 , H01L2225/06589 , H01L2225/1023 , H01L2225/1029 , H01L2225/1047 , H01L2225/1052 , H01L2225/1058 , H01L2225/107 , H01L2924/0001 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/0105 , H01L2924/01076 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/12 , H01L2924/1205 , H01L2924/1206 , H01L2924/1207 , H01L2924/1431 , H01L2924/1433 , H01L2924/1435 , H01L2924/1436 , H01L2924/1437 , H01L2924/1438 , H01L2924/1443 , H01L2924/14511 , H01L2924/15151 , H01L2924/15165 , H01L2924/1517 , H01L2924/15172 , H01L2924/15182 , H01L2924/15311 , H01L2924/15331 , H01L2924/157 , H01L2924/15787 , H01L2924/15788 , H01L2924/1579 , H01L2924/181 , H01L2924/19107 , H01L2924/3011 , H01L2924/00 , H01L2924/00012

Abstract: A microelectronic assembly can include a substrate having first and second surfaces and an aperture extending therebetween, the substrate having terminals. The assembly can also include a first microelectronic element having a front surface facing the first surface of the substrate, a second microelectronic element having a front surface facing the first microelectronic element and projecting beyond an edge of the first microelectronic element, first and second leads electrically connecting contacts of the respective first and second microelectronic elements to the terminals, and third leads electrically interconnecting the contacts of the first and second microelectronic elements. The contacts of the first microelectronic element can be exposed at the front surface thereof adjacent the edge thereof. The contacts of the second microelectronic element can be disposed in a central region of the front surface thereof. The first, second, and third leads can have portions aligned with the aperture.

Abstract translation: 微电子组件可以包括具有第一和第二表面的基板和在其间延伸的孔，该基板具有端子。组件还可以包括具有面向衬底的第一表面的前表面的第一微电子元件，具有面向第一微电子元件并且突出超过第一微电子元件的边缘的前表面的第二微电子元件，第一和第二引线电将相应的第一和第二微电子元件的触点连接到端子，以及第三引线将第一和第二微电子元件的触点电互连。第一微电子元件的触点可以在靠近其边缘的前表面暴露。第二微电子元件的触点可以设置在其前表面的中心区域中。第一，第二和第三引线可以具有与孔对准的部分。

23.

发明授权
Multiple die in a face down package 有权
Title translation: 多个模具面朝下的包装

公开(公告)号：US09000583B2

公开(公告)日：2015-04-07

申请号：US14040948

申请日：2013-09-30

Applicant: Tessera, Inc.

Inventor： Belgacem Haba , Wael Zohni , Richard Dewitt Crisp

IPC: H01L23/482 , H01L23/495 , H01L25/065 , H01L23/31

CPC classification number: H01L25/0652 , H01L23/04 , H01L23/3107 , H01L23/3128 , H01L23/4822 , H01L23/4952 , H01L24/48 , H01L24/49 , H01L25/0657 , H01L2224/0401 , H01L2224/06155 , H01L2224/06156 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/32245 , H01L2224/48145 , H01L2224/48227 , H01L2224/4824 , H01L2224/4826 , H01L2224/48265 , H01L2224/49109 , H01L2224/49175 , H01L2224/73204 , H01L2224/73215 , H01L2224/73253 , H01L2224/73265 , H01L2225/0651 , H01L2225/06517 , H01L2924/00014 , H01L2924/12042 , H01L2924/15311 , H01L2924/18161 , H01L2924/18165 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19103 , H01L2924/19107 , H01L2924/3011 , H01L2924/386 , H01L2924/00 , H01L2224/7826 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012

Abstract: A microelectronic package includes a subassembly including a first substrate and first and second microelectronic elements having contact-bearing faces facing towards oppositely-facing first and second surfaces of the first substrate and each having contacts electrically connected with the first substrate. The contact-bearing faces of the first and second microelectronic elements at least partially overlie one another. Leads electrically connect the subassembly with a second substrate, at least portions of the leads being aligned with an aperture in the second substrate. The leads can include wire bonds extending through an aperture in the first substrate and joined to contacts of the first microelectronic element aligned with the first substrate aperture. In one example, the subassembly can be electrically connected with the second substrate using electrically conductive spacer elements.

Abstract translation: 微电子封装包括包括第一基板和第一和第二微电子元件的子组件，所述第一和第二微电子元件具有面向第一基板的相对面向的第一和第二表面的接触轴承面，并且每个具有与第一基板电连接的触点。第一和第二微电子元件的接触面至少部分地彼此覆盖。引线将子组件与第二衬底电连接，引线的至少部分与第二衬底中的孔对齐。引线可以包括延伸穿过第一基板中的孔并且连接到与第一基板孔对准的第一微电子元件的触点的引线键合。在一个示例中，子组件可以使用导电间隔元件与第二衬底电连接。

24.

发明授权
Impedance controlled packages with metal sheet or 2-layer rdl 有权
Title translation: 阻抗控制的包装与金属板或2层rdl

公开(公告)号：US08981579B2

公开(公告)日：2015-03-17

申请号：US14306947

申请日：2014-06-17

Applicant: Tessera, Inc.

Inventor： Belgacem Haba , Ellis Chau , Wael Zohni , Philip Damberg , Richard Dewitt Crisp

IPC: H01L23/00 , H01L23/64 , H01L23/31 , H01L23/552 , H01L25/065 , H01L23/498

CPC classification number: H01L23/64 , H01L23/3128 , H01L23/49816 , H01L23/552 , H01L24/06 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/0657 , H01L2224/02311 , H01L2224/02313 , H01L2224/02375 , H01L2224/02379 , H01L2224/04042 , H01L2224/05554 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/49175 , H01L2224/73265 , H01L2225/0651 , H01L2225/06537 , H01L2225/06575 , H01L2924/00014 , H01L2924/01005 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/014 , H01L2924/07802 , H01L2924/10161 , H01L2924/15311 , H01L2924/181 , H01L2924/19107 , H01L2924/30107 , H01L2924/3011 , H01L2924/00 , H01L2924/00012 , H01L2224/43

Abstract: A microelectronic assembly is disclosed that is capable of achieving a desired impedance for raised conductive elements. The microelectronic assembly may include an interconnection element, a surface conductive element, a microelectronic device, a plurality of raised conductive elements, and a bond element. The microelectronic device may overlie the dielectric element and at least one surface conductive element attached to the front surface. The plurality of raised conductive elements may connect the device contacts with the element contacts. The raised conductive elements may have substantial portions spaced a first height above and extending at least generally parallel to at least one surface conductive element, such that a desired impedance may be achieved for the raised conductive elements. A bond element may electrically connect at least one surface conductive element with at least one reference contact that may be connectable to a source of reference potential.

Abstract translation: 公开了能够实现用于凸起的导电元件的期望阻抗的微电子组件。微电子组件可以包括互连元件，表面导电元件，微电子器件，多个凸起的导电元件和接合元件。微电子器件可以覆盖在电介质元件和附接到前表面的至少一个表面导电元件。多个凸起的导电元件可以将元件触点与元件触点连接。升高的导电元件可以具有在第一高度之上并且至少大致平行于至少一个表面导电元件延伸的基本部分，使得可以为凸起的导电元件实现期望的阻抗。键合元件可以将至少一个表面导电元件与可连接到参考电位源的至少一个参考触点电连接。

25.

发明申请
MULTIPLE DIE IN A FACE DOWN PACKAGE 有权
Title translation: 多个DIE在面包下

公开(公告)号：US20140117516A1

公开(公告)日：2014-05-01

申请号：US14040948

申请日：2013-09-30

Applicant: TESSERA, INC.

Inventor： Belgacem Haba , Wael Zohni , Richard Dewitt Crisp

IPC: H01L23/495

CPC classification number: H01L25/0652 , H01L23/04 , H01L23/3107 , H01L23/3128 , H01L23/4822 , H01L23/4952 , H01L24/48 , H01L24/49 , H01L25/0657 , H01L2224/0401 , H01L2224/06155 , H01L2224/06156 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/32245 , H01L2224/48145 , H01L2224/48227 , H01L2224/4824 , H01L2224/4826 , H01L2224/48265 , H01L2224/49109 , H01L2224/49175 , H01L2224/73204 , H01L2224/73215 , H01L2224/73253 , H01L2224/73265 , H01L2225/0651 , H01L2225/06517 , H01L2924/00014 , H01L2924/12042 , H01L2924/15311 , H01L2924/18161 , H01L2924/18165 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19103 , H01L2924/19107 , H01L2924/3011 , H01L2924/386 , H01L2924/00 , H01L2224/7826 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012

Abstract: A microelectronic package includes a subassembly including a first substrate and first and second microelectronic elements having contact-bearing faces facing towards oppositely-facing first and second surfaces of the first substrate and each having contacts electrically connected with the first substrate. The contact-bearing faces of the first and second microelectronic elements at least partially overlie one another. Leads electrically connect the subassembly with a second substrate, at least portions of the leads being aligned with an aperture in the second substrate. The leads can include wire bonds extending through an aperture in the first substrate and joined to contacts of the first microelectronic element aligned with the first substrate aperture. In one example, the subassembly can be electrically connected with the second substrate using electrically conductive spacer elements.

Abstract translation: 微电子封装包括包括第一基板和第一和第二微电子元件的子组件，所述第一和第二微电子元件具有面向第一基板的相对面向的第一和第二表面的接触轴承面，并且每个具有与第一基板电连接的触点。第一和第二微电子元件的接触面至少部分地彼此覆盖。引线将子组件与第二衬底电连接，引线的至少部分与第二衬底中的孔对齐。引线可以包括延伸穿过第一基板中的孔并且连接到与第一基板孔对准的第一微电子元件的触点的引线键合。在一个示例中，子组件可以使用导电间隔元件与第二衬底电连接。

26.

发明申请
ENHANCED STACKED MICROELECTRONIC ASSEMBLIES WITH CENTRAL CONTACTS AND IMPROVED THERMAL CHARACTERISTICS 有权
Title translation: 具有中央联系的增强型堆叠式微电子组件和改进的热特性

公开(公告)号：US20140035121A1

公开(公告)日：2014-02-06

申请号：US14046233

申请日：2013-10-04

Applicant: Tessera, Inc.

Inventor： Belgacem Haba , Wael Zohni , Richard Dewitt Crisp

IPC: H01L25/065

CPC classification number: H01L25/0652 , H01L23/13 , H01L23/3128 , H01L23/367 , H01L23/3677 , H01L23/3731 , H01L23/3736 , H01L23/4334 , H01L23/49816 , H01L24/14 , H01L24/32 , H01L24/33 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/0657 , H01L25/105 , H01L2224/06136 , H01L2224/13014 , H01L2224/14519 , H01L2224/32145 , H01L2224/32188 , H01L2224/32225 , H01L2224/48091 , H01L2224/48106 , H01L2224/4824 , H01L2224/484 , H01L2224/49111 , H01L2224/731 , H01L2224/73215 , H01L2224/73253 , H01L2225/0651 , H01L2225/06555 , H01L2225/06562 , H01L2225/06575 , H01L2225/06589 , H01L2225/1023 , H01L2225/1058 , H01L2225/1094 , H01L2924/00014 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/0105 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/10253 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/19107 , H01L2924/30107 , H01L2224/48227 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599

Abstract: A microelectronic assembly includes a dielectric element that has oppositely-facing first and second surfaces and first and second apertures extending between the surfaces. The dielectric element further includes conductive elements. First and second microelectronic elements are stacked one on top of the another. The second microelectronic element has a plurality of contacts at a surface, which is spaced from the first surface of the dielectric element. Leads extend from contacts of the first and second microelectronic elements through respective apertures to at least some of the conductive elements. A heat spreader is thermally coupled to at least one of the first microelectronic element or the second microelectronic element.

Abstract translation: 微电子组件包括具有相对面对的第一和第二表面的介电元件以及在表面之间延伸的第一和第二孔。电介质元件还包括导电元件。第一和第二微电子元件堆叠在另一个之上。第二微电子元件在与电介质元件的第一表面间隔开的表面处具有多个触点。引线从第一和第二微电子元件的接触通过相应的孔延伸到至少一些导电元件。散热器热耦合到第一微电子元件或第二微电子元件中的至少一个。

27.

发明申请
DESKEWED MULTI-DIE PACKAGES 有权
Title translation: DESKEWED多重包装

公开(公告)号：US20130307138A1

公开(公告)日：2013-11-21

申请号：US13950912

申请日：2013-07-25

Applicant: Tessera, Inc.

Inventor： Richard Dewitt Crisp , Belgacem Haba , Wael Zohni

IPC: H01L23/48

CPC classification number: H01L23/48 , G11C5/06 , H01L23/3128 , H01L24/06 , H01L24/13 , H01L24/29 , H01L24/48 , H01L24/50 , H01L24/73 , H01L25/0652 , H01L25/0655 , H01L25/0657 , H01L25/18 , H01L2224/0401 , H01L2224/05554 , H01L2224/06135 , H01L2224/06136 , H01L2224/12105 , H01L2224/13024 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/291 , H01L2224/2919 , H01L2224/29193 , H01L2224/32145 , H01L2224/32225 , H01L2224/48011 , H01L2224/48227 , H01L2224/4824 , H01L2224/73203 , H01L2224/73215 , H01L2224/73253 , H01L2224/73265 , H01L2225/06506 , H01L2225/0651 , H01L2225/06517 , H01L2225/06541 , H01L2225/06562 , H01L2225/06565 , H01L2924/00014 , H01L2924/01322 , H01L2924/1203 , H01L2924/1205 , H01L2924/1431 , H01L2924/1432 , H01L2924/1433 , H01L2924/14335 , H01L2924/1434 , H01L2924/1436 , H01L2924/1438 , H01L2924/1443 , H01L2924/15311 , H01L2924/15312 , H01L2924/15313 , H01L2924/157 , H01L2924/15786 , H01L2924/15787 , H01L2924/15788 , H01L2924/1579 , H01L2924/18161 , H01L2924/18165 , H01L2924/19041 , H01L2924/19105 , H01L2924/19106 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207

Abstract: A microelectronic package may have a plurality of terminals disposed at a face thereof which are configured for connection to at least one external component. e.g., a circuit panel. First and second microelectronic elements can be affixed with packaging structure therein. A first electrical connection can extend from a respective terminal of the package to a corresponding contact on the first microelectronic element, and a second electrical connection can extend from the respective terminal to a corresponding contact on the second microelectronic element, the first and second connections being configured such that a respective signal carried by the first and second connections in each group is subject to propagation delay of the same duration between the respective terminal and each of the corresponding contacts coupled thereto.

Abstract translation: 微电子封装可以具有设置在其面上的多个端子，其被配置为连接到至少一个外部部件。例如电路板。第一和第二微电子元件可以用其中的包装结构固定。第一电连接可以从封装的相应端子延伸到第一微电子元件上的相应触点，并且第二电连接可以从相应端子延伸到第二微电子元件上的相应触点，第一和第二连接是被配置为使得由每个组中的第一和第二连接承载的相应信号在相应的终端和与其耦合的每个对应的触点之间经历相同持续时间的传播延迟。