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    SEMICONDUCTOR DEVICE PACKAGE WITH INTERNAL MAGNETIC SHIELD FOR HALL SENSOR
    26.
    发明申请
    SEMICONDUCTOR DEVICE PACKAGE WITH INTERNAL MAGNETIC SHIELD FOR HALL SENSOR 有权

    公开(公告)号：US20250138054A1

    公开(公告)日：2025-05-01

    申请号：US18499086

    申请日：2023-10-31

    Applicant: Texas Instruments Incorporated

    Inventor： Yi Yan ,  Dok Won Lee ,  Hank Ming Sung ,  Kenji Otake

    IPC: G01R15/20 ,  G01R19/00 ,  H10N52/01 ,  H10N52/80

    Abstract: A described example includes: a heat slug coupled to a package substrate, the heat slug configured to conduct a current between terminals of the package substrate; a first magnetic shield mounted to a top surface of the package substrate, the first magnetic shield including a die mount area; a semiconductor die flip chip mounted to the die mount area; a second magnetic shield mounted to the package substrate, the second magnetic shield having a cantilever portion extending over a portion of the semiconductor die including a Hall element; electrical connections of wire bonds or ribbon bonds between bond pads of the semiconductor die and leads on the package substrate; and mold compound covering the electrical connections, the semiconductor die, the first magnetic shield, and the second magnetic shield, while a portion of the heat slug is exposed forming a thermal pad for a semiconductor device package.

    Semiconductor integrated fluxgate device shielded by discrete magnetic plate
    27.
    发明授权
    Semiconductor integrated fluxgate device shielded by discrete magnetic plate 有权

    公开(公告)号：US11921134B2

    公开(公告)日：2024-03-05

    申请号：US18295788

    申请日：2023-04-04

    Applicant: Texas Instruments Incorporated

    Inventor： Dok Won Lee

    IPC: G01R15/18 ,  G01R19/00 ,  H01L23/544 ,  H01L23/31 ,  H01L23/498

    CPC classification number: G01R15/183 ,  G01R19/0092 ,  H01L23/544 ,  H01L23/3107 ,  H01L23/49805 ,  H01L2223/54426 ,  H01L2223/54486

    Abstract: A current-sensing system includes a conductor for carrying a first electrical current generating a first magnetic field. A device, spaced from the conductor by a clearance, includes a semiconductor integrated circuit die in a package. The semiconductor integrated circuit die includes at least one elongated bar of a first ferromagnetic material magnetized by the first magnetic field; a sensor comprising a first coil wrapped around the at least one elongated bar to sense the bar's magnetization; and an electronic driver creating a second electrical current flowing through a second coil wrapped around the at least one elongated bar generating a second magnetic field to compensate the at least one bar's magnetization. The package has a first outer surface free of device terminals. A discrete plate of a second ferromagnetic material is positioned in the clearance and is conformal with the first outer surface of the package.

    MAGNETIC SENSOR ARRAY PROCESSING FOR INTERFERENCE REDUCTION
    28.
    发明申请
    MAGNETIC SENSOR ARRAY PROCESSING FOR INTERFERENCE REDUCTION 有权

    公开(公告)号：US20230052689A1

    公开(公告)日：2023-02-16

    申请号：US17875840

    申请日：2022-07-28

    Applicant: Texas Instruments Incorporated

    Inventor： Lei Ding ,  Srinath Mathur Ramaswamy ,  Dok Won Lee ,  Steven Howard

    IPC: G01R33/07 ,  G01R19/02 ,  H02M1/00

    Abstract: Current sensing techniques. In an example, a current sensing method includes: generating a first magnetic field measurement; generating a second magnetic field measurement; generating a frequency estimate of a current; calculating a root-mean-square (RMS) value of an estimated amplitude of the current; and generating a temperature estimate of an integrated circuit (IC) configured to perform the method. The method also includes generating a first weighting factor and a second weighting factor based on the frequency estimate, the RMS value, and the temperature estimate, the first weighting factor to control amplification of the first magnetic field measurement and the second weighting factor to control amplification of the second magnetic field measurement.

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