公开(公告)号：US20130192655A1

公开(公告)日：2013-08-01

申请号：US13798805

申请日：2013-03-13

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Henry L. Edwards ,  Kenneth J. Maggio ,  Steven Kummerl ,  Sreenivasan K. Koduri

IPC: H01L35/28 ,  H01L29/02

CPC classification number: H01L35/28 ,  H01L21/568 ,  H01L23/38 ,  H01L24/18 ,  H01L24/19 ,  H01L24/24 ,  H01L24/25 ,  H01L29/02 ,  H01L2224/04105 ,  H01L2224/06181 ,  H01L2224/2518 ,  H01L2224/32225 ,  H01L2224/92144 ,  H01L2924/12042 ,  H05K1/0203 ,  H05K1/185 ,  H05K2201/0358 ,  H05K2201/10219 ,  H01L2924/00

Abstract: A circuit board with an embedded thermoelectric device with hard thermal bonds. A method of embedding a thermoelectric device in a circuit board and forming hard thermal bonds.

Abstract translation: 具有硬热键的嵌入式热电元件的电路板。 一种在电路板中嵌入热电装置并形成硬热键的方法。

公开(公告)号：US20130187252A1

公开(公告)日：2013-07-25

申请号：US13798592

申请日：2013-03-13

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Henry L. Edwards

IPC: H01L23/38

Abstract: An integrated circuit has thermoelectric cooling devices integrated into bondpads. A method for operating the integrated circuit includes turning a thermal switch to a thermoelectric cooler operate position when the integrated circuit is powered up, turning the thermal switch to a thermoelectric cooler operate position to allow the thermoelectric cooler to operate when the integrated circuit powers down, and turning the thermal switch to a thermoelectric cooler off position when a predetermined integrated circuit chip temperature is reached.

Abstract translation: 集成电路将热电冷却装置集成到粘合垫中。 一种用于操作集成电路的方法包括当集成电路通电时将热开关转到热电冷却器操作位置，将热开关转到热电冷却器操作位置以允许热电冷却器在集成电路断电时工作， 并且当达到预定的集成电路芯片温度时，将热开关转到热电冷却器关闭位置。