Electromagnetic pulse (EMP) generation

    公开(公告)号:US10088278B1

    公开(公告)日:2018-10-02

    申请号:US15498148

    申请日:2017-04-26

    Abstract: An apparatus includes charged-particle intercalated graphite. The apparatus additionally includes one or more explosive materials disposed within a region defined by the charged-particle intercalated graphite.

    HYBRID ACOUSTIC AND INDUCTION-HEATING SYSTEMS AND METHODS FOR IMPEDING FORMATION OF ICE

    公开(公告)号:US20170361936A1

    公开(公告)日:2017-12-21

    申请号:US15183593

    申请日:2016-06-15

    CPC classification number: B64D15/12 B64D15/22

    Abstract: An airfoil (200) comprises a skin (210), comprising an external surface (212) and an internal surface (214). The skin (210) has a controlled region (216). The airfoil (200) also comprises an interior space (208), formed by the skin (210). The airfoil (200) additionally comprises a hybrid acoustic induction-heating system (202), configured to impede formation of ice on the external surface (212). The hybrid acoustic induction-heating system (202) comprises an induction coil (230) and a control system (250). At least a portion (236) of the induction coil (230) is sufficiently close to the internal surface (214) to produce an eddy current (280) within the controlled region (216) when an alternating electrical current (234) is flowing in the induction coil (230). The control system (250) is configured to generate inductive heat and acoustic pressure in the controlled region (216) by supplying the alternating electrical current (234) to the induction coil (230) based, at least in part, on an ambient temperature of a layer of fluid (218) flowing over the external surface (212).

    HYBRID ACOUSTIC AND INDUCTION-HEATING SYSTEMS AND METHODS FOR IMPEDING FORMATION OF ICE

    公开(公告)号:US20170361935A1

    公开(公告)日:2017-12-21

    申请号:US15183563

    申请日:2016-06-15

    CPC classification number: B64D15/12 B64D15/163 H05B6/10 H05B6/105 H05B2214/02

    Abstract: An airfoil (100) comprises a skin (110), comprising an external surface (112) and an internal surface (114), opposite the external surface (112). The skin (110) is magnetically and electrically conductive. The airfoil (100) also comprises an interior space (108), formed by the skin (110). The internal surface (114) faces the interior space (108). The airfoil (100) additionally comprises a leading edge (106) along the external surface (112). The airfoil (100) further comprises a hybrid acoustic induction-heating system (102), configured to impede formation of ice on the external surface (112). The hybrid acoustic induction-heating system (102) comprises an induction coil (130) within the interior space (108). At least a portion (136) of the induction coil (130) is sufficiently close to the internal surface (114) to produce an eddy current (180) in the skin (110) when an alternating electrical current (134) is flowing in the induction coil (130). The hybrid acoustic induction-heating system (102) also comprises at least one magnet (140) within the interior space (108). At least the one magnet (140) is configured to produce a steady-state magnetic field (182) within the skin (110).

    HYBRID FABRICATION METHOD FOR LARGE AREA MICROWAVE CIRCUITS
    27.
    发明申请
    HYBRID FABRICATION METHOD FOR LARGE AREA MICROWAVE CIRCUITS 审中-公开
    用于大面积微波电路的混合制造方法

    公开(公告)号:US20170055342A1

    公开(公告)日:2017-02-23

    申请号:US14832462

    申请日:2015-08-21

    Abstract: A microwave device can include a printed circuit board substrate having a first microwave device subcircuit and a microdevice substrate having a second microwave device subcircuit. The first microwave device subcircuit may be formed at a low resolution and a low tolerance, while the second microwave device subcircuit may be formed at a high resolution and a high tolerance. The first microwave device subcircuit and the second microwave device subcircuit may be electrically coupled using a conductor.

    Abstract translation: 微波装置可以包括具有第一微波装置分支电路的印刷电路板基板和具有第二微波装置子电路的微装置基板。 第一微波器件子电路可以以低分辨率和低容差形成,而第二微波器件子电路可以以高分辨率和高容差形成。 第一微波器件子电路和第二微波器件子电路可以使用导体电耦合。

Patent Agency Ranking