公开(公告)号：US12096559B2

公开(公告)日：2024-09-17

申请号：US17814804

申请日：2022-07-25

Applicant: Beijing Xiaomi Mobile Software Co., Ltd.

Inventor： Ning Hao

IPC: H05K1/14 ,  H05K1/11

CPC classification number: H05K1/142 ,  H05K1/115 ,  H05K1/144 ,  H05K2201/041

Abstract: A first circuit board includes: at least two supporting portions, where two adjacent supporting portions are movably connected; and a circuit layer formed on each of the supporting portions, where the circuit layers on the two adjacent supporting portions are electrically connected; and where the at least two supporting portions are configured to form a bending region of the circuit board.

公开(公告)号：US12089349B2

公开(公告)日：2024-09-10

申请号：US18239723

申请日：2023-08-29

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ming-Hung Chen ,  Yung I Yeh ,  Chang-Lin Yeh ,  Sheng-Yu Chen

IPC: H01L23/00 ,  H05K1/14 ,  H05K1/18 ,  H05K3/28 ,  H05K5/00 ,  H05K5/06 ,  H05K9/00

CPC classification number: H05K5/0017 ,  H05K1/142 ,  H05K1/144 ,  H05K1/181 ,  H05K3/284 ,  H05K5/065 ,  H05K9/0022 ,  H05K2201/041 ,  H05K2201/10037 ,  H05K2201/10128 ,  H05K2201/10151 ,  H05K2203/1316 ,  H05K2203/1327

Abstract: A semiconductor device package includes a display device, an encapsulation layer disposed in direct contact with the display device, and a reinforced structure surrounded by the encapsulation layer. The reinforced structure is spaced apart from a surface of the display device. A method of manufacturing a semiconductor device package is also disclosed.

公开(公告)号：US20240260191A1

公开(公告)日：2024-08-01

申请号：US17923193

申请日：2022-07-27

Applicant: NVIDIA CORPORATION

Inventor： Sien CHEN ,  Xuan WANG ,  Ziyi XU

IPC: H05K1/14 ,  H05K1/02 ,  H05K7/20

CPC classification number: H05K1/144 ,  H05K1/0203 ,  H05K7/20154 ,  H05K2201/041 ,  H05K2201/10545 ,  H05K2201/10734

Abstract: According to various embodiments, a processing subsystem includes a first printed circuit board (PCB); a processor mounted directly on a first side of the first PCB; and one or more power components. The one or more power components are coupled to a second side of the first PCB and electrically coupled to the processor, where the first side of the first PCB is opposite to the second side of the first PCB.

公开(公告)号：US12035462B2

公开(公告)日：2024-07-09

申请号：US17559204

申请日：2021-12-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hongkyu Lee ,  Hyoseok Na

IPC: H04R1/04 ,  H04R1/08 ,  H04R3/00 ,  H04R19/04 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14

CPC classification number: H05K1/0259 ,  H04R1/04 ,  H04R1/086 ,  H04R3/00 ,  H04R19/04 ,  H05K1/115 ,  H05K1/141 ,  H05K1/144 ,  H04R2201/003 ,  H04R2499/11 ,  H05K2201/041 ,  H05K2201/042 ,  H05K2201/10151

Abstract: An electronic device is provided. The electronic device includes a printed circuit board (PCB) on which a plurality of PCBs is stacked and comprising a hole penetrating the plurality of PCBs, a microphone disposed on a first surface of the PCB and to which a sound is delivered through the hole, and an electrical conductive path formed in at least a part of or the entire hole. The electrical conductive path may be electrically connected to at least one of a ground of the PCB or a ground of the microphone.

公开(公告)号：US20240179842A1

公开(公告)日：2024-05-30

申请号：US17779836

申请日：2022-04-24

Applicant: WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.

Inventor： Chengsheng LUO ,  Tiyao MA ,  Yingchuan JIANG ,  Wenxu XIANYU

IPC: H05K1/14 ,  C09J5/00 ,  C09J9/02 ,  G09F9/302 ,  H05K3/36

CPC classification number: H05K1/144 ,  C09J5/00 ,  C09J9/02 ,  H05K3/368 ,  G09F9/3026 ,  H05K2201/041 ,  H05K2201/10128

Abstract: A display screen and a manufacturing method thereof are disclosed. A first conductive adhesive and a second conductive adhesive are disposed between a daughter board and a mother board. A first adhesive force is formed between the first conductive adhesive and the daughter board, a second adhesive force is formed between the first conductive adhesive and the second conductive adhesive, and a third adhesive force is formed between the second conductive adhesive and the mother board. A technical problem of the daughter board and the mother board being difficult to separate for rework after assembly can be solved by allowing both the first adhesive force and the second adhesive force to be greater than the third adhesive force.

公开(公告)号：US20240147602A1

公开(公告)日：2024-05-02

申请号：US17772185

申请日：2021-03-19

Applicant: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD. ,  BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Xianfeng YANG ,  Xianlei BI ,  Chuanyan LAN ,  Qian MA

IPC: H05K1/02 ,  G06F3/041 ,  H05K1/14

CPC classification number: H05K1/0218 ,  G06F3/0416 ,  H05K1/144 ,  G06F2203/04107 ,  H05K2201/041

Abstract: A circuit board module relates to the field of touch technologies. The above circuit board module includes a touch chip, a first circuit board, a second circuit board and at least one conductive connection portion. The touch chip includes at least one ground pin and a plurality of signal pins. The first circuit board includes a first ground portion and a plurality of signal pads; the signal pads are electrically connected to the signal pins; the first ground is electrically connected to the at least one ground pin. The second circuit board includes a second ground portion. The at least one conductive connection portion is electrically connected to the first ground portion and the second ground portion.

公开(公告)号：US20240121899A1

公开(公告)日：2024-04-11

申请号：US18544586

申请日：2023-12-19

Applicant: Innolux Corporation

Inventor： Chin-Cheng Kuo ,  Chia-Chun Yang ,  Wen-Cheng Huang

IPC: H05K1/14 ,  H05K1/18 ,  H05K3/28 ,  H05K3/30 ,  H05K3/36

CPC classification number: H05K1/148 ,  H05K1/181 ,  H05K3/284 ,  H05K3/303 ,  H05K3/361 ,  H05K2201/041 ,  H05K2201/09027 ,  H05K2201/10106 ,  H05K2201/10128 ,  H05K2201/10522 ,  H05K2203/0126

Abstract: An electronic device includes a substrate, a plurality of flexible circuit boards, a plurality of ICs and an insulator. The flexible circuit boards are disposed on the substrate. In a top view of the electronic device, the flexible circuit boards are overlapped with an edge of the substrate. The ICs are disposed on the substrate. The insulator is disposed on the flexible circuit boards and contacted the ICs, wherein the insulator has a first side and a second side opposite to the first side and the first side is closer to the edge than the second side. Along a first direction perpendicular to an extension direction of the edge, a first minimum distance between the second side and one of the ICs is less than a second minimum distance between the second side and one of the flexible circuit boards.

公开(公告)号：US20240107670A1

公开(公告)日：2024-03-28

申请号：US18475060

申请日：2023-09-26

Applicant: CANON KABUSHIKI KAISHA

Inventor： JUN TSUKANO

IPC: H05K1/14 ,  H01R12/62 ,  H01R12/65 ,  H04N23/53 ,  H05K3/36

CPC classification number: H05K1/14 ,  H01R12/62 ,  H01R12/65 ,  H04N23/53 ,  H05K3/361 ,  H01R4/70 ,  H05K2201/041 ,  H05K2201/09045

Abstract: An electronic component includes first and second electrodes, first and second substrates having first and second principal surfaces, respectively, and a connection member to connect the first and second electrodes, wherein the first and second electrodes are arranged on the first and second principal surfaces, respectively, a height of the connection member is greater than those of the first and second electrodes in the direction perpendicular to the first principal surface, a distance between a portion of the first principal surface not in contact with the first electrode and a portion of the second principal surface not in contact with the second electrode is shorter than a distance between a portion of the first principal surface in contact with the first electrode and a portion of the second principal surface in contact with the second electrode, and an intermediary body is arranged between the second electrode and the connection member.

公开(公告)号：US20240098875A1

公开(公告)日：2024-03-21

申请号：US18269599

申请日：2021-05-27

Applicant: QKM TECHNOLOGY (DONG GUAN) CO., LTD

Inventor： Jinbo SHI ,  Lihui CHEN ,  Chunhua YU ,  Qi SHA ,  Hong LIU ,  Hong WANG

IPC: H05K1/02 ,  B25J9/16 ,  H05K1/14

CPC classification number: H05K1/0203 ,  B25J9/161 ,  H05K1/144 ,  H05K2201/041 ,  H05K2201/042 ,  H05K2201/066

Abstract: Provided are a driver controller integrated board, a control system, and a robot. The driver controller integrated board includes a control module (1), a drive module (2), and a first substrate (3). The control module (1) and the drive module (2) are disposed on the first substrate (3), and the control module (1) is electrically connected to the drive module (2).

公开(公告)号：US20240056520A1

公开(公告)日：2024-02-15

申请号：US18313722

申请日：2023-05-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngsub KIM ,  Jungho PARK ,  Kwanghyun BAEK ,  Jungyub LEE ,  Juneseok LEE ,  Dohyuk HA

IPC: H04M1/02 ,  H05K1/14 ,  H05K1/02

CPC classification number: H04M1/0277 ,  H05K1/144 ,  H05K1/028 ,  H05K2201/041 ,  H05K2201/10734 ,  H05K2201/10098

Abstract: In various embodiments, a module for a wireless communication includes: a radiator, a plurality of resonators, a first substrate on which the radiator and the plurality of resonators are disposed, and a second substrate including a power supply. The first substrate includes a plurality of first layers. The second substrate includes a plurality of second layers. The radiator is disposed on a radiation layer of the plurality of first layers of the first substrate. The plurality of resonators is disposed on a resonance layer of the plurality of first layers of the first substrate. At least part of the plurality of resonators in the resonance layer is disposed in an area in the radiation layer, different from an area in which the radiator is disposed.