-
公开(公告)号:US20210006144A1
公开(公告)日:2021-01-07
申请号:US16568937
申请日:2019-09-12
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor: SHIN-WEN CHEN , LONG-FEI ZHANG , KUN LI , XIAO-MEI MA
IPC: H02K41/035 , H02K11/22 , H02K11/40
Abstract: A camera module shielded against electromagnetic interference but of reduced size comprises a voice coil motor, a circuit board, a circuit board, and a base between voice coil motor and circuit board. The voice coil motor comprises conductive housing. The circuit board comprises a conductive wire itself comprising shielded wire, ground pad, and a surrounding and grounded closed ground loop. The base comprises a main body and a conductive loop sleeved thereon. A first side of the conductive loop is electrically connected to the conductive housing, a second side of the conductive loop is electrically connected to the ground loop. The conductive housing, the conductive loop, and the ground loop form a shield against electromagnetic interference. The disclosure further provides an electronic device including the camera module.
-
公开(公告)号:US20200266693A1
公开(公告)日:2020-08-20
申请号:US16561386
申请日:2019-09-05
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor: XIAO-MEI MA , SHIN-WEN CHEN , LONG-FEI ZHANG , KUN LI
IPC: H02K41/035 , H04N5/225 , G02B7/08
Abstract: A voice coil motor in a camera module with a means of being mounted robustly on a base comprises a casing and the base. The casing is hollow, the casing comprises a top surface and a side wall around the top surface. The base comprises a base portion and projections, the base portion being in contact with the side wall of the casing and engaged with the casing to form a cavity. The side wall is provided with recesses external to the cavity to accept the projections, the projections lending structural reinforcement to the casing.
-
公开(公告)号:US20200218028A1
公开(公告)日:2020-07-09
申请号:US16561425
申请日:2019-09-05
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor: KUN LI , LONG-FEI ZHANG , SHIN-WEN CHEN , HAO-ZHONG LIU
IPC: G02B7/02
Abstract: A lens module includes a lens holder and a lens. The lens holder comprises a through-hole. The lens holder comprises an inner wall surrounding to define the through-hole. A first thread is formed on the inner wall. A second thread is formed on an outer sidewall of the lens. The first thread cooperates with the second thread to fix the lens on the lens holder. At least one first slot is defined on the outer sidewall of the lens and around a periphery of the lens, and a seal ring is received in each first slot. At least one second slot is defined on the outer sidewall of the lens along a direction of an optic axis of the lens. Each second slot passes through each first slot to form a receiving space. The disclosure also provides an electronic device having the lens module.
-
公开(公告)号:US20200172019A1
公开(公告)日:2020-06-04
申请号:US16375461
申请日:2019-04-04
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor: SHENG-JIE DING , SHIN-WEN CHEN , LONG-FEI ZHANG , KUN LI , JING-WEI LI
IPC: B60R11/04
Abstract: A camera for mounting on a vehicle includes a holder, a lens, and a polarizing film. The lens includes an optical lens body and an annular body. A part of the optical lens body is received in the holder and the other part of the optical lens body extends out of the holder. The annular body is disposed around an outer circumference of a portion of the optical lens body extending out of the holder. The polarizing film in the annular body faces the lens and weakens the effects of strong lights on images captured by the camera.
-
公开(公告)号:US20190394366A1
公开(公告)日:2019-12-26
申请号:US16165824
申请日:2018-10-19
Inventor: KUN LI , SHIN-WEN CHEN , LONG-FEI ZHANG , XIAO-MEI MA
IPC: H04N5/225 , H01L27/146 , H01R12/77
Abstract: An imaging chip packaging structure includes a circuit substrate, an imaging chip, and a pedestal. The circuit substrate has a first through hole extending through the circuit substrate. The imaging chip comprises a photosensitive area, and the first through hole through the substrate exposes the photosensitive area. The pedestal is integrated with the circuit substrate. The pedestal is formed on a first surface of the circuit substrate and comprises a second through hole on an optical path of the light reaching the imaging chip.
-
公开(公告)号:US20210223497A1
公开(公告)日:2021-07-22
申请号:US16854003
申请日:2020-04-21
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor: LONG-FEI ZHANG , SHIN-WEN CHEN , KUN LI , XIAO-MEI MA , HAO-ZHONG LIU
IPC: G02B7/02
Abstract: A lens module includes a lens assembly and a lens barrel assembly receiving the lens assembly. The lens barrel assembly includes a lens holder and a lens barrel provided on the lens holder. A light transmission hole is defined passing through the lens holder and the lens barrel. The lens assembly is received in the light transmission hole. A center of the lens barrel is offset from a center of the lens holder.
-
公开(公告)号:US20210051251A1
公开(公告)日:2021-02-18
申请号:US16558596
申请日:2019-09-03
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor: SHIN-WEN CHEN , LONG-FEI ZHANG , KUN LI , XIAO-MEI MA
IPC: H04N5/225 , H05K1/18 , H05K1/14 , H01L23/00 , H01L27/146
Abstract: A camera device includes a lens assembly, a driver, and a photosensitive assembly. The driver drives the lens assembly. The photosensitive assembly is mounted to the lens assembly. The photosensitive assembly includes a filter, a photosensitive chip, a first circuit board, and a second circuit board. The first circuit board defines a first through hole. The photosensitive chip is received in the first through hole. The filter is fixed to a side of the first circuit board and covers the first through hole. The second circuit board is fixed to a side of the first circuit board facing away from the filter and is electrically coupled to the first circuit board. The photosensitive chip is electrically coupled to the second circuit board.
-
28.
公开(公告)号:US20200328666A1
公开(公告)日:2020-10-15
申请号:US16441235
申请日:2019-06-14
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor: SHIN-WEN CHEN , KUN LI , HAO-ZHONG LIU , LONG-FEI ZHANG
IPC: H02K41/035 , G02B7/02 , H02K3/02 , H02K3/44 , H02K15/04 , C23C18/20 , C23C18/32 , C23C18/42 , C23C18/16
Abstract: A method for fabricating a composite lens holder with low-mass conductive metal and high-precision placement thereof to enable smaller-scale fabrication includes the steps of forming a plastic lens holder as a matrix, laser etching an outer surface of the plastic lens holder to form surface patterns, and electroless plating of metal on the surface patterns to form an effective coil, thereby producing the composite lens holder. A voice coil motor and an electronic device which use such a composite lens holder are also disclosed.
-
公开(公告)号:US20200285018A1
公开(公告)日:2020-09-10
申请号:US16504545
申请日:2019-07-08
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor: LONG-FEI ZHANG , SHIN-WEN CHEN , YU-SHUAI LI , KUN LI
Abstract: A lens module relieved against the build-up of working heat and any condensation by allowing the release of same comprises a circuit board, a support base, and an optical filter. The support base is fixed on a first surface of the circuit board. The support base defines a through hole configured to receive the optical filter. The support base further defines at least one gas pressure relieving structure. The optical filter and the circuit board seal opposite sides of the support base to form a receiving space. The gas pressure relieving structure allows communication between the receiving space and the exterior such that heat generated in the receiving space is transported out. The lens module is dustproof, waterproof, and can breathe. An electronic device including the lens module is also disclosed.
-
公开(公告)号:US20200183254A1
公开(公告)日:2020-06-11
申请号:US16249008
申请日:2019-01-16
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor: XIAO-MEI MA , SHIN-WEN CHEN , LONG-FEI ZHANG , KUN LI
IPC: G03B17/12
Abstract: A camera module includes a circuit board, an image sensor, a lens holder, and a lens. The image sensor is arranged on the circuit board. The lens holder is covered over the image sensor. The lens is arranged on the lens holder. The lens holder is adhered to the circuit board by a colloid. The lens holder includes a projection on a side of the lens holder facing the circuit board. The projection is embedded within the colloid.
-
-
-
-
-
-
-
-
-